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    • 73. 发明申请
    • PHOTORESIST COMPOSITIONS AND METHODS FOR SHRINKING A PHOTORESIST CRITICAL DIMENSION
    • 光电复合材料组合物和方法,用于收缩光刻胶关键尺寸
    • US20120070787A1
    • 2012-03-22
    • US12883442
    • 2010-09-16
    • Wu-Song HuangKuang-Jung ChenWai-Kin LiSen Liu
    • Wu-Song HuangKuang-Jung ChenWai-Kin LiSen Liu
    • G03F7/20
    • G03F7/40G03F7/0045G03F7/0397G03F7/405
    • A method for reducing a photoresist critical dimension, the method comprising depositing a photoresist film on a substrate, wherein the photoresist film includes a thermal base generator; patterning the photoresist film to form a first patterned film possessing a first critical dimension; depositing a crosslinkable film over the first patterned film; heat-activating the first patterned film, either before or after depositing the crosslinkable film, to release a base in the first patterned film and cause crosslinking in the crosslinkable film in contact with the first patterned film; and developing the crosslinkable film to remove non-crosslinked soluble portions therein to form a second patterned film possessing a reduced critical dimension compared to the first critical dimension.
    • 一种降低光致抗蚀剂临界尺寸的方法,所述方法包括在基底上沉积光致抗蚀剂膜,其中光致抗蚀剂膜包括热碱发生器; 图案化光致抗蚀剂膜以形成具有第一临界尺寸的第一图案化膜; 在第一图案化膜上沉积可交联膜; 在沉积可交联膜之前或之后热激活第一图案化膜,以释放第一图案化膜中的碱,并引起与第一图案化膜接触的可交联膜的交联; 并且显影所述可交联膜以除去其中的非交联的可溶部分以形成与第一临界尺寸相比具有降低的临界尺寸的第二图案化膜。
    • 76. 发明申请
    • Chemical Trim of Photoresist Lines by Means of A Tuned Overcoat
    • 通过调整大衣的光刻胶线的化学修剪
    • US20110129652A1
    • 2011-06-02
    • US12983297
    • 2011-01-01
    • Sean David BurnsMatthew E. ColburnSteven John HolmesWu-Song Huang
    • Sean David BurnsMatthew E. ColburnSteven John HolmesWu-Song Huang
    • B32B3/02G03F7/20
    • G03F7/40Y10T428/24802
    • A new lithographic process comprises reducing the linewidth of an image while maintaining the lithographic process window, and using this process to fabricate pitch split structures comprising nm order (e.g., about 22 nm) node semiconductor devices. The process comprises applying a lithographic resist layer on a surface of a substrate and patterning and developing the lithographic resist layer to form a nm order node image having an initial line width. Overcoating the nm order node image with an acidic polymer produces an acidic polymer coated image. Heating the acidic polymer coated image gives a heat treated coating on the image, the heating being conducted at a temperature and for a time sufficient to reduce the initial linewidth to a subsequent narrowed linewidth. Developing the heated treated coating removes it from the image resulting in a free-standing trimmed lithographic feature on the substrate. Optionally repeating the foregoing steps further reduces the linewidth of the narrowed line. The invention also comprises a product produced by this process.
    • 新的光刻工艺包括在保持光刻工艺窗口的同时降低图像的线宽,并且使用该工艺来制造包括nm阶(例如约22nm)的节点半导体器件的间距分裂结构。 该方法包括在基片的表面上施加平版印刷抗蚀剂层,并对平版印刷抗蚀剂层进行图形化和显影,以形成具有初始线宽的nm阶节点图像。 用酸性聚合物覆盖nm阶节点图像产生酸性聚合物涂层图像。 加热酸性聚合物涂覆的图像给图像上的热处理涂层,加热在足以将初始线宽降低到随后变窄的线宽的温度和时间内进行。 显影加热处理的涂层将其从图像中去除,从而在基底上产生独立的修整光刻特征。 可选地,重复前述步骤进一步减小了变窄线的线宽。 本发明还包括通过该方法生产的产品。
    • 80. 发明授权
    • Photoresist compositions and process for multiple exposures with multiple layer photoresist systems
    • 光刻胶组合物和多层光刻胶系统的多次曝光工艺
    • US07803521B2
    • 2010-09-28
    • US11942062
    • 2007-11-19
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara R. Varanasi
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara R. Varanasi
    • G03F7/30
    • G03F7/0048G03F7/0035G03F7/0397G03F7/40
    • A photoresist composition and methods using the photoresist composition in multiple exposure/multiple layer processes. The photoresist composition includes a polymer comprising repeat units having a hydroxyl moiety; a photoacid generator; and a solvent. The polymer when formed on a substrate is substantially insoluble to the solvent after heating to a temperature of about 150° C. or greater. One method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second non photoresist layer on the substrate and patterned first photoresist layer. Another method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second photoresist layer on the substrate and patterned first photoresist layer and patternwise exposing the second photoresist layer.
    • 光致抗蚀剂组合物和在多次曝光/多层工艺中使用光致抗蚀剂组合物的方法。 光致抗蚀剂组合物包括包含具有羟基部分的重复单元的聚合物; 光致酸发生器; 和溶剂。 形成在基材上的聚合物在加热至约150℃或更高的温度之后基本上不溶于溶剂。 一种方法包括在衬底上形成第一光致抗蚀剂层,图案地暴露第一光致抗蚀剂层,在衬底上形成第二非光致抗蚀剂层并且形成图案化的第一光致抗蚀剂层。 另一种方法包括在衬底上形成第一光致抗蚀剂层,以图形方式暴露第一光致抗蚀剂层,在衬底上形成第二光致抗蚀剂层并图案化的第一光致抗蚀剂层和图案地曝光第二光致抗蚀剂层。