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71. 发明授权

US07645364B2 Apparatus and method for plating semiconductor wafers 失效
标题翻译：用于电镀半导体晶片的装置和方法
公开(公告)号：US07645364B2
公开(公告)日：2010-01-12
申请号：US10882712
申请日：2004-06-30
申请人： Yezdi N. Dordi , Fred C. Redeker , John M. Boyd , Robert Maraschin , Carl Woods
发明人： Yezdi N. Dordi , Fred C. Redeker , John M. Boyd , Robert Maraschin , Carl Woods
IPC分类号： C25D21/00
CPC分类号： C25D17/14 , C25D5/06 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/2885
摘要： An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided.
摘要翻译：提供了一种用于电镀晶片表面的电镀设备。该晶片能够作为阴极充电。电镀装置包括能够位于晶片表面的上方或下方并能够作为阳极带电的电镀头。当晶片和电镀头被充电时，电镀头能够在晶片表面和电镀头之间实现金属电镀。电镀头还包括能够感测电镀头和晶片表面之间的电压的电压传感器对，以及能够从电压传感器对接收数据的控制器。当电镀头位于晶片表面上方时，由电压传感器对接收的数据由控制器使用以保持由阳极施加的基本上恒定的电压。还提供了一种电镀晶片的方法。

72. 发明授权

US07604011B2 Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid 有权
标题翻译：用超临界流体使用高频声能的半导体晶片清洗方法和装置
公开(公告)号：US07604011B2
公开(公告)日：2009-10-20
申请号：US11670631
申请日：2007-02-02
申请人： Fred C. Redeker , John M. Boyd , John Parks
发明人： Fred C. Redeker , John M. Boyd , John Parks
IPC分类号： B08B3/12 , B08B7/02
CPC分类号： B08B3/12 , B08B7/0021 , H01L21/67057 , Y10S134/902
摘要： An apparatus and a method is provided for using high-frequency acoustic energy with a supercritical fluid to perform a semiconductor wafer (“wafer”) cleaning process. High-frequency acoustic energy is applied to the supercritical fluid to impart energy to particulate contamination present on the wafer surface. Energy imparted to particulate contamination via the high-frequency acoustic energy and supercritical fluid is used to dislodge and remove the particulate contamination from the wafer. Additionally, the wafer cleaning process benefits from the supercritical fluid properties of near zero surface tension, high diffusivity, high density, and chemical mixing capability.
摘要翻译：提供了一种使用高频声能与超临界流体来执行半导体晶片（“晶片”）清洁工艺的装置和方法。高频声能被施加到超临界流体以赋予存在于晶片表面上的颗粒污染物的能量。通过高频声能和超临界流体赋予颗粒污染物的能量被用来移除和去除晶片上的颗粒污染物。此外，晶片清洗过程受益于近零表面张力，高扩散性，高密度和化学混合能力的超临界流体性质。

73. 发明授权

US07464719B2 Multi-menisci processing apparatus 失效
标题翻译：多功能加工设备
公开(公告)号：US07464719B2
公开(公告)日：2008-12-16
申请号：US11437891
申请日：2006-05-18
申请人： James P. Garcia , Mike Ravkin , Carl Woods , Fred C. Redeker , John de Larios
发明人： James P. Garcia , Mike Ravkin , Carl Woods , Fred C. Redeker , John de Larios
IPC分类号： B08B3/00 , B08B7/04
CPC分类号： C25D5/22 , B08B3/04 , C25D17/001 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A substrate preparation apparatus is provided. The apparatus includes a housing configured to be installed in a substrate fabrication facility. The housing includes a manifold for use in preparing a wafer surface. The manifold is configured to include a first process window in a first portion of the manifold. A first fluid meniscus is capable of being defined within the first process windowl. Further included is a second process window in a second portion of the manifold. A second fluid meniscus is capable of being defined within the second process window. An arm is integrated with the housing, and the arm is coupled to the manifold, such that the arm is capable of positioning the manifold in proximity with the substrate during operation. The apparatus therefore provides for the formation of multi-menisci over the surface of a substrate using a single manifold.
摘要翻译：提供了基板制备装置。该装置包括构造成安装在基板制造设备中的壳体。壳体包括用于制备晶片表面的歧管。歧管被配置为在歧管的第一部分中包括第一过程窗口。第一流体弯液面能够在第一过程窗口内被定义。还包括在歧管的第二部分中的第二处理窗口。能够在第二过程窗口内限定第二流体弯月面。臂与壳体一体化，并且臂联接到歧管，使得臂在操作期间能够将歧管定位在基板附近。因此，该装置提供了使用单个歧管在基板的表面上形成多重半月板。

74. 发明申请

US20080267721A1 METHOD AND APPARATUS FOR TRANSPORTING A SUBSTRATE USING NON-NEWTONIAN FLUID 失效
标题翻译：使用非牛顿流体运输基质的方法和装置
公开(公告)号：US20080267721A1
公开(公告)日：2008-10-30
申请号：US12173661
申请日：2008-07-15
申请人： John M. de Larios , Mike Ravkin , John Parks , Mikhail Korolik , Fred C. Redeker
发明人： John M. de Larios , Mike Ravkin , John Parks , Mikhail Korolik , Fred C. Redeker
IPC分类号： B65G51/01
CPC分类号： H01L21/67784 , H01L21/67057
摘要： A method for transporting a substrate is provided. In this method, a non-Newtonian fluid is provided and the substrate is suspended in the non-Newtonian fluid. The non-Newtonian fluid is capable of supporting the substrate. Thereafter, a supply force is applied on the non-Newtonian fluid to cause the non-Newtonian fluid to flow, whereby the flow is capable of moving the substrate along a direction of the flow. Apparatuses and systems for transporting the substrate using the non-Newtonian fluid also are described.
摘要翻译：提供了一种输送基板的方法。在该方法中，提供了非牛顿流体，并将基底悬挂在非牛顿流体中。非牛顿流体能够支撑基底。此后，向非牛顿流体施加供应力以使非牛顿流体流动，由此流动能够沿着流动方向移动基底。还描述了使用非牛顿流体输送基底的装置和系统。

75. 发明授权

US07358186B2 Method and apparatus for material deposition in semiconductor fabrication 有权
标题翻译：在半导体制造中材料沉积的方法和装置
公开(公告)号：US07358186B2
公开(公告)日：2008-04-15
申请号：US10735216
申请日：2003-12-12
申请人： Yezdi Dordi , John Boyd , William Thie , Bob Maraschin , Fred C. Redeker , Joel M. Cook
发明人： Yezdi Dordi , John Boyd , William Thie , Bob Maraschin , Fred C. Redeker , Joel M. Cook
IPC分类号： H01L21/44 , B05C5/12
CPC分类号： C23C18/1612 , C23C18/14 , C23C18/161 , C23C18/1619 , C23C18/1651 , C23C18/1667 , C23C18/168 , C23C18/31 , H01L21/288
摘要： Broadly speaking, a method and an apparatus are provided for depositing a material on a semiconductor wafer (“wafer”). More specifically, the method and apparatus provide for selective heating of a surface of the wafer exposed to an electroless plating solution. The selective heating is provided by applying radiant energy to the wafer surface. The selective heating of the wafer surface causes a temperature increase at an interface between the wafer surface and the electroless plating solution. The temperature increase at the interface in turn causes a plating reaction to occur at the wafer surface. Thus, material is deposited on the wafer surface through an electroless plating reaction that is initiated and controlled by varying the temperature of the wafer surface using an appropriately defined radiant energy source.
摘要翻译：概括地说，提供了一种在半导体晶片（“晶片”）上沉积材料的方法和装置。更具体地，该方法和装置提供了暴露于化学镀溶液的晶片的表面的选择性加热。通过向晶片表面施加辐射能来提供选择性加热。晶片表面的选择性加热导致晶片表面和化学镀溶液之间的界面处的温度升高。界面处的温度升高又导致在晶片表面发生电镀反应。因此，通过化学镀反应将材料沉积在晶片表面上，该电镀反应通过使用适当限定的辐射能源改变晶片表面的温度来启动和控制。

76. 发明授权

US07252097B2 System and method for integrating in-situ metrology within a wafer process 有权
标题翻译：在晶圆工艺中整合原位计量的系统和方法
公开(公告)号：US07252097B2
公开(公告)日：2007-08-07
申请号：US10606022
申请日：2003-06-24
申请人： John M. Boyd , John M. de Larios , Michael Ravkin , Fred C. Redeker
发明人： John M. Boyd , John M. de Larios , Michael Ravkin , Fred C. Redeker
IPC分类号： B08B3/00 , B08B7/04
CPC分类号： H01L21/67028 , G03F7/70341 , H01L21/67034 , H01L21/67051 , Y10S134/902
摘要： A system and method for processing a wafer includes applying a process to the wafer. The process being supported by a surface tension gradient device. A result of the process is monitored. The monitored result is output.
摘要翻译：用于处理晶片的系统和方法包括将工艺应用于晶片。该过程由表面张力梯度装置支撑。监视该过程的结果。输出监视结果。

77. 发明授权

US07191787B1 Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid 有权
标题翻译：用超临界流体使用高频声能的半导体晶片清洗方法和装置
公开(公告)号：US07191787B1
公开(公告)日：2007-03-20
申请号：US10357664
申请日：2003-02-03
申请人： Fred C. Redeker , John M. Boyd , John Parks
发明人： Fred C. Redeker , John M. Boyd , John Parks
IPC分类号： B06B3/12
CPC分类号： B08B3/12 , B08B7/0021 , H01L21/67057 , Y10S134/902
摘要： An apparatus and a method is provided for using high-frequency acoustic energy with a supercritical fluid to perform a semiconductor wafer (“wafer”) cleaning process. High-frequency acoustic energy is applied to the supercritical fluid to impart energy to particulate contamination present on the wafer surface. Energy imparted to particulate contamination via the high-frequency acoustic energy and supercritical fluid is used to dislodge and remove the particulate contamination from the wafer. Additionally, the wafer cleaning process benefits from the supercritical fluid properties of near zero surface tension, high diffusivity, high density, and chemical mixing capability.
摘要翻译：提供了一种使用高频声能与超临界流体来执行半导体晶片（“晶片”）清洁工艺的装置和方法。高频声能被施加到超临界流体以赋予存在于晶片表面上的颗粒污染物的能量。通过高频声能和超临界流体赋予颗粒污染物的能量被用来移除和去除晶片上的颗粒污染物。此外，晶片清洗过程受益于近零表面张力，高扩散性，高密度和化学混合能力的超临界流体性质。

78. 发明授权

US07108591B1 Compliant wafer chuck 失效
标题翻译：符合晶圆卡盘
公开(公告)号：US07108591B1
公开(公告)日：2006-09-19
申请号：US10816418
申请日：2004-03-31
申请人： John M. Boyd , Fred C. Redeker , Yezdi Dordi
发明人： John M. Boyd , Fred C. Redeker , Yezdi Dordi
IPC分类号： B24B5/02 , B24B7/04 , B24B1/00
CPC分类号： B24B37/30
摘要： A semiconductor substrate support is provided. The semiconductor substrate support includes a chuck configured to change between a compliant state and a rigid state. An electromagnetic field source configured to apply an electromagnetic field to the chuck is included. The electromagnetic field causes the chuck to change from the compliant state to the rigid state. A method for supporting a semiconductor substrate and a system for cleaning a substrate and an apparatus are also provided.
摘要翻译：提供半导体衬底支撑。半导体衬底支撑件包括构造成在柔顺状态和刚性状态之间变化的卡盘。包括被配置为向卡盘施加电磁场的电磁场源。电磁场使卡盘从顺从状态转变为刚性状态。还提供了一种用于支撑半导体衬底的方法和用于清洁衬底和装置的系统。

79. 发明授权

US06869332B2 Chemical mechanical polishing of a metal layer with polishing rate monitoring 有权
标题翻译：用抛光速率监测金属层的化学机械抛光
公开(公告)号：US06869332B2
公开(公告)日：2005-03-22
申请号：US10412038
申请日：2003-04-10
申请人： Fred C. Redeker , Rajeev Bajaj
发明人： Fred C. Redeker , Rajeev Bajaj
IPC分类号： B24B37/013 , B24B49/02 , B24B49/12 , H01L21/00 , H01L21/321 , B24B7/22
CPC分类号： B24B37/013 , B24B49/02 , B24B49/12 , G01B7/105
摘要： A method of chemical mechanical polishing a metal layer on a substrate in which the substrate is polished at a first polishing rate. Polishing is monitored with an eddy current monitoring system, and the polishing rate is reduced to a second polishing rate when the eddy current monitoring system indicates that a predetermined thickness of the metal layer remains on the substrate. Then polishing is monitored with an optical monitoring system, and polishing is halted when the optical monitoring system indicates that an underlying layer is at least partially exposed.
摘要翻译：在基板上以第一抛光速率抛光基板的化学机械抛光金属层的方法。用涡流监测系统监测抛光，当涡流监测系统指示金属层的预定厚度保留在基板上时，抛光速率降低到第二抛光速率。然后用光学监测系统监测抛光，并且当光学监测系统指示底层至少部分暴露时，停止抛光。

80. 发明授权

US06645061B1 Polishing pad having a grooved pattern for use in chemical mechanical polishing 有权
标题翻译：具有用于化学机械抛光的带槽图案的抛光垫
公开(公告)号：US06645061B1
公开(公告)日：2003-11-11
申请号：US09441633
申请日：1999-11-16
申请人： Doyle E. Bennett , Thomas H. Osterheld , Fred C. Redeker , Ginetto Addiego
发明人： Doyle E. Bennett , Thomas H. Osterheld , Fred C. Redeker , Ginetto Addiego
IPC分类号： B24D1100
CPC分类号： B24B37/26
摘要： A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
摘要翻译：一种用于化学机械抛光装置的抛光垫。抛光垫包括多个同心的圆形槽。抛光垫可以包括具有不同宽度和间隔的凹槽的多个区域。

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