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1. 发明申请

WO2023069557A1 POST CMP BRUSH AND METHOD OF MANUFACTURE 审中-公开
公开(公告)号：WO2023069557A1
公开(公告)日：2023-04-27
申请号：PCT/US2022/047187
申请日：2022-10-19
申请人： RAJEEV, Bajaj
发明人： RAJEEV, Bajaj
IPC分类号： H01L21/02 , B08B1/00
摘要： A brush for post chemical/mechanical polishing cleaning of a semiconductor wafer is provided, the brush comprising a microporous core with open cell pores and an outer layer of a plurality of loop fibers formed on the outer surface of the microporous core, wherein the brush has a first core flow resistance R1, a second through surface flow resistance R2, and a third flow resistance R3 across the surface and wherein R3

2. 发明授权

US10226853B2 Methods and apparatus for conditioning of chemical mechanical polishing pads 有权
公开(公告)号：US10226853B2
公开(公告)日：2019-03-12
申请号：US13801127
申请日：2013-03-13
申请人： Rajeev Bajaj , Hung Chih Chen
发明人： Rajeev Bajaj , Hung Chih Chen
IPC分类号： B24B53/017 , B23K26/38 , B24B37/34
摘要： A method and apparatus for conditioning a polishing pad is provided. In one embodiment, a pad conditioning device for a substrate polishing process is provided. The pad conditioning device includes an optical device coupled to a portion of a polishing station adjacent a polishing pad, the optical device comprising a laser emitter adapted to emit a beam toward a polishing surface of the polishing pad, the beam having a wavelength range that is substantially non-reactive with a polishing fluid utilized in the polishing process, but is reactive with the polishing pad.

3. 发明授权

US09296085B2 Polishing pad with homogeneous body having discrete protrusions thereon 有权
标题翻译：具有均匀体的抛光垫，其上具有离散的突起
公开(公告)号：US09296085B2
公开(公告)日：2016-03-29
申请号：US14530534
申请日：2014-10-31
申请人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
发明人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
IPC分类号： B24B37/26 , B24B37/20 , B24B37/22 , B24B37/24 , B24D18/00 , B29C39/12 , B29K75/00 , B29L9/00 , B29L31/00
CPC分类号： B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0009 , B29C39/123 , B29K2075/00 , B29L2009/00 , B29L2031/736
摘要： Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.
摘要翻译：描述具有其上具有离散突起的均匀体的抛光垫。在一个实例中，用于抛光衬底的抛光垫包括具有抛光侧和背面的均匀体。均质体由具有第一硬度的材料构成。多个分立的突起设置在同质体的抛光侧上并与之共同地结合。多个离散突起由具有与第一硬度不同的第二硬度的材料构成。还描述了制造具有其上具有离散突起的均匀体的抛光垫的方法。

4. 发明申请

US20120302148A1 POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON 审中-公开
标题翻译：具有同位素分布的均质体的抛光垫
公开(公告)号：US20120302148A1
公开(公告)日：2012-11-29
申请号：US13113655
申请日：2011-05-23
申请人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
发明人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
IPC分类号： B24D11/00 , B29C44/12 , B29C39/12
CPC分类号： B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0009 , B29C39/123 , B29K2075/00 , B29L2009/00 , B29L2031/736
摘要： Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.
摘要翻译：描述具有其上具有离散突起的均匀体的抛光垫。在一个实例中，用于抛光衬底的抛光垫包括具有抛光侧和背面的均匀体。均质体由具有第一硬度的材料构成。多个分立的突起设置在同质体的抛光侧上并与之共同地结合。多个离散突起由具有与第一硬度不同的第二硬度的材料构成。还描述了制造具有其上具有离散突起的均匀体的抛光垫的方法。

5. 发明授权

US08292692B2 Polishing pad with endpoint window and systems and method using the same 有权
标题翻译：具有端点窗口和系统的抛光垫及其使用方法
公开(公告)号：US08292692B2
公开(公告)日：2012-10-23
申请号：US12616323
申请日：2009-11-11
申请人： Rajeev Bajaj
发明人： Rajeev Bajaj
IPC分类号： B24B49/00
CPC分类号： B24B37/205
摘要： A polishing pad includes a guide plate, a compressible foam under layer disposed adjacent to a lower surface of the guide plate, and a plurality of polishing elements that extend in a first direction substantially normal to a plane defined by the guide plate and through the guide plate. The pad further includes an optical path along the first direction and which is defined by an aperture in the compressible foam under layer and the guide plate. The optical path includes a transparent window that extends above an upper surface of the guide plate but below tips of the polishing elements, the upper surface of the guide plate being opposite the lower surface thereof. An optional slurry distribution layer may be disposed on the upper surface of the guide plate, in which case the polishing elements extend through the slurry distribution layer and the transparent window extends beyond a top surface thereof.
摘要翻译：抛光垫包括引导板，与导板的下表面相邻设置的可压缩泡沫底层，以及多个抛光元件，其沿基本上垂直于由导板限定的平面的第一方向延伸并穿过导向件盘子。衬垫还包括沿着第一方向的光路，并且由可压缩泡沫底层和引导板中的孔限定。光路包括在导板的上表面上方但在抛光元件的顶端之上的透明窗口，导向板的上表面与其下表面相对。可选的浆料分配层可以设置在导向板的上表面上，在这种情况下，抛光元件延伸穿过浆料分布层，并且透明窗延伸超过其顶表面。

6. 发明申请

US20110143640A1 PAD CONDITIONER AND METHOD 失效
标题翻译： PAD调节器和方法
公开(公告)号：US20110143640A1
公开(公告)日：2011-06-16
申请号：US12636644
申请日：2009-12-11
申请人： Rajeev Bajaj
发明人： Rajeev Bajaj
IPC分类号： B24B1/00 , B24B53/095 , B24B53/12
CPC分类号： B24B53/017 , B23K26/3576 , B24B53/095
摘要： A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface.
摘要翻译：抛光垫调节装置包括用于提供激光束的激光束产生单元，用于提供流体流的流体输送系统和用于去除碎屑的真空管线。激光束可以直接冲击抛光垫的表面，从而产生切割作用，而雾化的流体流提供冷却和垫片碎屑以及流体通过真空管线被去除。或者，激光束可以与垫表面上方的区域中的雾化流体流组合，以将其能量的一部分基本上赋予流体流，产生在焊盘表面上提供“冷”切割作用的高能量液滴。

7. 发明申请

US20060199471A1 Pad conditioner design and method of use 有权
标题翻译：垫调节器的设计和使用方法
公开(公告)号：US20060199471A1
公开(公告)日：2006-09-07
申请号：US11369876
申请日：2006-03-06
申请人： Rajeev Bajaj
发明人： Rajeev Bajaj
IPC分类号： B24B51/00 , B24B1/00
CPC分类号： B24B53/017 , B23K26/0006 , B23K26/352 , B23K2103/42 , B24B37/20
摘要： A polishing pad conditioning apparatus includes a laser beam generating unit along with a system to transmit or focus the beam. The unit is mounted on a conditioning arm, such that the laser beam may be directed perpendicular to the plane of the polishing pad, which is next to the polishing platen. The conditioning arm is capable of moving across the polishing table to scan the pad radius, allowing the laser to traverse the pad radius.
摘要翻译：抛光垫调节装置包括激光束产生单元以及用于传输或聚焦光束的系统。该单元安装在调节臂上，使得激光束可以垂直于抛光垫的平面定向，抛光垫的平面邻近研磨台板。调理臂能够移动穿过抛光台以扫描焊盘半径，允许激光穿过焊盘半径。

8. 发明授权

US06960521B2 Method and apparatus for polishing metal and dielectric substrates 失效
标题翻译：抛光金属和电介质基板的方法和装置
公开(公告)号：US06960521B2
公开(公告)日：2005-11-01
申请号：US10939750
申请日：2004-09-13
申请人： Yongsik Moon , David Mai , Kapila Wijekoon , Rajeev Bajaj , Rahul Surana , Yongqi Hu , Tony S. Kaushal , Shijian Li , Jui-Lung Li , Shi-Ping Wang , Gary Lam , Fred C. Redeker
发明人： Yongsik Moon , David Mai , Kapila Wijekoon , Rajeev Bajaj , Rahul Surana , Yongqi Hu , Tony S. Kaushal , Shijian Li , Jui-Lung Li , Shi-Ping Wang , Gary Lam , Fred C. Redeker
IPC分类号： B24B1/00 , B24B5/00 , B24B29/00 , B24B37/04 , C23F1/00 , H01L21/306 , H01L21/321 , H01L21/461 , H01L21/4763 , H01L21/768
CPC分类号： H01L21/3212 , B24B37/042 , B24B37/30 , H01L21/7684
摘要： Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.
摘要翻译：提供了用于抛光衬底的方法和装置，其包括具有降低或最小衬底表面损伤和分层的导电和低k电介质材料。在一个方面，提供了一种用于处理衬底的方法，包括将具有形成在其上的导电材料的衬底定位在具有一个或多个旋转载体头和一个或多个可旋转压板的抛光设备中，其中所述载体头包括保持环和用于固定基板的薄膜和压板具有设置在其上的抛光制品，其以约0.4psi或更大于膜压力的保持环接触压力将基板表面和抛光制品彼此接触，并抛光基板以去除导电材料。

9. 发明授权

US06872329B2 Chemical mechanical polishing composition and process 失效
标题翻译：化学机械抛光组合物和工艺
公开(公告)号：US06872329B2
公开(公告)日：2005-03-29
申请号：US09842476
申请日：2001-04-25
申请人： Yuchun Wang , Rajeev Bajaj , Fred C. Redeker , Shijian Li
发明人： Yuchun Wang , Rajeev Bajaj , Fred C. Redeker , Shijian Li
IPC分类号： B24B37/04 , C09G1/02 , H01L21/321 , C09K13/00 , C09K13/04 , C09K13/06 , H01L21/302
CPC分类号： H01L21/3212 , B24B37/044 , C09G1/02
摘要： A method and composition for planarizing a substrate surface is provided. The polishing composition includes an oxidizer capable of oxidizing a metal undergoing planarization and yielding a complexing agent which complexes with the oxidized metal and a stabilizer such as a stannate salt. The composition may further include abrasive particles and/or inhibitors. The composition may be used in a multi-step polishing process including polishing a substrate surface to selectively remove a metal layer with respect to a barrier layer and dielectric layer and polishing a substrate surface using the composition to non-selectively remove the metal layer, a barrier layer, and a dielectric layer from the substrate surface.
摘要翻译：提供了用于平坦化基板表面的方法和组合物。抛光组合物包括能够氧化经历平坦化的金属并产生与氧化金属络合的络合剂和稳定剂如锡酸盐的氧化剂。组合物还可以包括研磨颗粒和/或抑制剂。组合物可以用于多步抛光工艺中，包括抛光衬底表面以相对于阻挡层和电介质层选择性去除金属层，并使用该组合物抛光衬底表面以非选择性地去除金属层，阻挡层和介电层。

10. 发明授权

US06783432B2 Additives for pressure sensitive polishing compositions 失效
标题翻译：用于压敏抛光组合物的添加剂
公开(公告)号：US06783432B2
公开(公告)日：2004-08-31
申请号：US09874177
申请日：2001-06-04
申请人： Jui-Lung Li , Yuchun Wang , Rajeev Bajaj , Fred C. Redeker
发明人： Jui-Lung Li , Yuchun Wang , Rajeev Bajaj , Fred C. Redeker
IPC分类号： B24B100
CPC分类号： B24B37/0056 , B24B37/044 , C09G1/02
摘要： A method and composition for planarizing a substrate. The composition includes a pressure sensitive solution and one or more chemical agents for complexing with a metal or oxidized metal. The method for removal of a copper containing layer from a substrate surface, comprising applying a composition to a polishing media, the composition comprising a pressure sensitive solution, and one or more chemical agents for complexing with a metal or oxidized metal, and polishing the substrate surface with the polishing media.
摘要翻译：一种用于平坦化衬底的方法和组合物。组合物包括压敏溶液和用于与金属或氧化金属络合的一种或多种化学试剂。一种从基材表面除去含铜层的方法，包括将组合物施用于抛光介质，所述组合物包含压敏溶液，以及一种或多种与金属或氧化金属络合的化学试剂，以及研磨该基材表面与抛光介质。

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