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    • 51. 发明公开
    • 3차원 반도체 장치 및 그 제조 방법
    • 三维半导体存储器件及其制造方法
    • KR1020110086405A
    • 2011-07-28
    • KR1020100006124
    • 2010-01-22
    • 삼성전자주식회사
    • 황성민김한수조원석장재훈
    • H01L27/115H01L21/768
    • H01L21/768H01L27/11575H01L27/11578H01L27/11582
    • PURPOSE: A 3D semiconductor device and a manufacturing method thereof are provided to easily form three-dimensionally arranged electrodes and wire structures for electrically connecting the three-dimensionally arranged electrodes. CONSTITUTION: A word line structure is formed on a substrate(10). The word line structure includes a first word line structure and a second word line structure. The first word line structure is made of first electrode patterns(175). The second word line structure is made of second electrode patterns(275). Channel structures penetrate the word line structure. The channel structures are two-dimensionally arranged on the substrate. Each channel structure comprises a first channel structure(150) and a second channel structure(250). A wiring structure includes lower plugs(P1) and lower wires(M1). The wiring structure is arranged on the word line structure.
    • 目的:提供一种三维半导体器件及其制造方法,用于容易地形成用于电连接三维布置的电极的三维布置的电极和线结构。 构成:在基板(10)上形成字线结构。 字线结构包括第一字线结构和第二字线结构。 第一字线结构由第一电极图案(175)制成。 第二字线结构由第二电极图案(275)制成。 渠道结构穿透字线结构。 通道结构被二维排列在基板上。 每个通道结构包括第一通道结构(150)和第二通道结构(250)。 布线结构包括下插头(P1)和下导线(M1)。 布线结构布置在字线结构上。
    • 52. 发明公开
    • 반도체 메모리 장치의 출력 구동회로 및 출력 구동방법
    • 半导体存储器件的输出电路及其驱动方法
    • KR1020080011974A
    • 2008-02-11
    • KR1020060072802
    • 2006-08-02
    • 삼성전자주식회사
    • 황성민이중화
    • G11C7/12
    • An output driving circuit of a semiconductor memory device and a method thereof are provided to reduce chip size of a semiconductor integrated circuit by using drains of pulldown transistors included a pulldown driver for a first memory device and source regions of field mitigation transistors connected to the pulldown transistors. A pullup driver(120) pulls up a potential of an output node in response to a pullup driving signal. A first pulldown driver(140) for a first memory device pulls down a potential of the output node in response to a first pulldown driving signal. A second pulldown driver(160) for a second memory device pulls down the potential of the output node in response to a second pulldown driving signal. The first memory device is operated by a first power supply voltage, and is operated by the second power supply voltage lower than the first power supply voltage.
    • 提供半导体存储器件的输出驱动电路及其方法,以通过使用下拉晶体管的漏极来减少半导体集成电路的芯片尺寸,所述下拉晶体管包括用于第一存储器件的下拉驱动器和连接到下拉的场缓冲晶体管的源极区域 晶体管。 上拉驱动器(120)响应于上拉驱动信号上拉输出节点的电位。 用于第一存储器件的第一下拉驱动器(140)响应于第一下拉驱动信号而拉低输出节点的电位。 用于第二存储器装置的第二下拉驱动器(160)响应于第二下拉驱动信号而拉低输出节点的电位。 第一存储器件由第一电源电压操作,并且通过低于第一电源电压的第二电源电压来操作。