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51. 发明授权

US07985975B2 Light emitting package and light emitting package array formed by coupled electrodes 有权
标题翻译：由耦合电极形成的发光封装和发光封装阵列
公开(公告)号：US07985975B2
公开(公告)日：2011-07-26
申请号：US12805404
申请日：2010-07-29
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/01078 , H01L2924/09701 , H01L2924/00014
摘要： Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body-including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.
摘要翻译：示例性实施例可以包括发光器件封装。发光器件封装可以包括发光器件，封装体 - 包括其上安装有发光器件的底表面的空腔和用于反射从发光器件发射的光的侧表面，从第一电极突出的第一电极所述封装主体以及与所述封装主体耦合的第二电极。第一和第二电极可以被设计成分别与另一个发光器件封装的第二和第二电极耦合，从而形成发光器件封装的阵列。

52. 发明授权

US07888689B2 Light emitting package and light emitting package array 有权
标题翻译：发光封装和发光封装阵列
公开(公告)号：US07888689B2
公开(公告)日：2011-02-15
申请号：US11798390
申请日：2007-05-14
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/01078 , H01L2924/09701 , H01L2924/00014
摘要： Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.
摘要翻译：示例性实施例可以包括发光器件封装。发光器件封装可以包括发光器件，封装体，其包括具有其上安装有发光器件的底表面的空腔和用于反射从发光器件发射的光的侧表面，从所述发光器件突出的第一电极封装主体和与封装主体耦合的第二电极。第一和第二电极可以被设计成分别与另一个发光器件封装的第二和第二电极耦合，从而形成发光器件封装的阵列。

53. 发明申请

US20110012164A1 LIGHT-EMITTING ELEMENT AND METHOD OF FABRICATING THE SAME 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US20110012164A1
公开(公告)日：2011-01-20
申请号：US12839800
申请日：2010-07-20
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L33/62
CPC分类号： H01L33/14 , H01L25/0753 , H01L33/0079 , H01L33/382 , H01L33/387 , H01L33/42 , H01L33/62 , H01L2224/16 , H01L2933/0016 , Y10S257/918
摘要： Provided are a light-emitting element and a method of fabricating the same. The light-emitting element includes: a first pattern including conductive regions and non-conductive regions. The non-conductive regions are defined by the conductive regions. The light-emitting element also include an insulating pattern including insulating regions and non-insulating regions which correspond respectively to the conductive regions and non-conductive regions. The non-insulating regions are defined by the insulating regions. The light-emitting element further includes a light-emitting structure interposed between the first pattern and the insulating pattern. The light-emitting structure includes a first semiconductor pattern of a first conductivity type, a light-emitting pattern, and a second semiconductor pattern of a second conductivity type which are stacked sequentially. The light-emitting element also includes a second pattern formed in the non-insulating regions.
摘要翻译：提供一种发光元件及其制造方法。发光元件包括：包括导电区域和非导电区域的第一图案。非导电区域由导电区域限定。发光元件还包括绝缘图案，其包括分别对应于导电区域和非导电区域的绝缘区域和非绝缘区域。非绝缘区域由绝缘区域限定。发光元件还包括插入在第一图案和绝缘图案之间的发光结构。发光结构包括依次堆叠的第一导电类型的第一半导体图案，发光图案和第二导电类型的第二半导体图案。发光元件还包括形成在非绝缘区域中的第二图案。

54. 发明申请

US20110012153A1 Light emitting package and methods of fabricating the same 有权
标题翻译：发光封装及其制造方法
公开(公告)号：US20110012153A1
公开(公告)日：2011-01-20
申请号：US12805085
申请日：2010-07-12
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L33/52 , H01L33/48
CPC分类号： H01L33/486 , H01L25/167 , H01L33/60 , H01L2224/16225 , H01L2924/12044 , H01L2924/00
摘要： Example embodiments are directed to a light emitting package having a structure that prevents variance in a depth of a cavity in which a chip is mounted and a method of fabricating the same. A light emitting package includes a package body including a first body including the cavity and a second body bonded to the first body. The cavity penetrates the first body. A first electrode and a second electrode separate from each other are on the package body. A first dielectric layer is between the package body and the first electrode and between the package body and the second electrode. A light emitting element is placed in the cavity and electrically connected to the first electrode and the second electrode. A method of fabricating the light emitting package includes forming the first body and the second body bonded to the first body through a dielectric layer, forming the cavity in the first body and forming the light emitting element in the cavity.
摘要翻译：示例性实施例涉及具有防止其中安装芯片的腔的深度变化的结构的发光封装及其制造方法。一种发光封装，包括：封装主体，包括包括该空腔的第一主体和与第一主体结合的第二主体。空腔穿透第一体。彼此分开的第一电极和第二电极在封装主体上。第一电介质层位于封装主体和第一电极之间以及封装体和第二电极之间。将发光元件放置在空腔中并电连接到第一电极和第二电极。制造发光封装的方法包括：通过电介质层形成第一本体和第二主体，该第一本体和第二主体通过电介质层结合到第一主体上，在第一主体中形成空腔并在腔内形成发光元件。

55. 发明申请

US20100248400A1 Methods of fabricating a light-emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：US20100248400A1
公开(公告)日：2010-09-30
申请号：US12662056
申请日：2010-03-30
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L33/50 , H01L33/52
CPC分类号： H01L33/50 , H01L24/94 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05672 , H01L2224/0568 , H01L2224/05684 , H01L2224/14 , H01L2924/00014 , H01L2924/12035 , H01L2933/0041 , H01L2924/00 , H01L2924/013 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Methods of fabricating of a light-emitting device are provided, the methods include forming a plurality of light-emitting units on a substrate, measuring light characteristics of the plurality of light-emitting units, respectively, depositing a phosphor layer on the plurality of light-emitting units using a printing method, and cutting the substrate to separate the plurality of light-emitting units into unit by unit. The phosphor layer is adjustably deposited according to the measured light characteristics of the plurality of light-emitting units.
摘要翻译：提供了一种制造发光器件的方法，所述方法包括在衬底上形成多个发光单元，分别测量多个发光单元的光特性，在多个光上沉积磷光体层 - 使用打印方法的设备单元，以及切割所述基板以将所述多个发光单元分离成单元。根据多个发光单元的测量光特性可调节地沉积磷光体层。

56. 发明申请

US20100078670A1 Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device 有权
标题翻译：具有提高光提取效率的发光元件，包括该发光元件的发光器件，以及发光元件和发光器件的制造方法
公开(公告)号：US20100078670A1
公开(公告)日：2010-04-01
申请号：US12586970
申请日：2009-09-30
申请人： Yu-Sik Kim , Seong-Deok Hwang , Seung-Jae Lee , Sun-Pil Youn
发明人： Yu-Sik Kim , Seong-Deok Hwang , Seung-Jae Lee , Sun-Pil Youn
IPC分类号： H01L33/00
CPC分类号： H01L33/48 , H01L33/20 , H01L33/24 , H01L33/405 , H01L33/44 , H01L33/46 , H01L2224/05001 , H01L2224/05026 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05184 , H01L2224/05186 , H01L2224/05568 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05684 , H01L2224/13 , H01L2224/48091 , H01L2924/12044 , H01L2924/00014 , H01L2924/00 , H01L2924/0542 , H01L2924/0543 , H01L2924/0544
摘要： Provided is a light emitting element, a light emitting device including the same, and fabrication methods of the light emitting element and light emitting device. The light emitting device comprises a substrate, a light emitting structure including a first conductive layer of a first conductivity type, a light emitting layer, and a second conductive layer of a second conductivity type which are sequentially stacked, a first electrode which is electrically connected with the first conductive layer; and a second electrode which is electrically connected with the second conductive layer and separated apart from the first electrode, wherein at least a part of the second electrode is connected from a top of the light emitting structure, through a sidewall of the light emitting structure, and to a sidewall of the substrate.
摘要翻译：提供了一种发光元件，包括该发光元件的发光器件，以及发光元件和发光器件的制造方法。发光装置包括基板，发光结构，其包括依次堆叠的第一导电类型的第一导电层，发光层和第二导电类型的第二导电层，电连接的第一电极与第一导电层; 以及与所述第二导电层电连接并与所述第一电极分离的第二电极，其中所述第二电极的至少一部分通过所述发光结构的侧壁从所述发光结构的顶部连接，和衬底的侧壁。

57. 发明申请

US20100065881A1 Light-emitting element capable of increasing amount of light emitted, light-emitting device including the same, and method of manufacturing light-emitting element and light-emitting device 有权
标题翻译：能够增加发光量的发光元件，包括该发光元件的发光元件以及发光元件和发光元件的制造方法
公开(公告)号：US20100065881A1
公开(公告)日：2010-03-18
申请号：US12584857
申请日：2009-09-14
申请人： Yu-sik Kim
发明人： Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/24 , H01L33/12 , H01L33/405 , H01L2224/45139 , H01L2224/48091 , H01L2224/49107 , H01L2924/12044 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting element capable of increasing the amount of light emitted, a light-emitting device including the same, and a method of manufacturing the light-emitting element and the light-emitting device include a buffer layer having an uneven pattern formed thereon; a light-emitting structure including a first conductive pattern of a first conductivity type that is conformally formed along the buffer layer having the uneven pattern formed thereon, a light-emitting pattern that is conformally formed along the first conductive pattern, and a second conductive pattern of a second conductivity type that is formed on the light-emitting pattern; a first electrode electrically connected to the first conductive pattern; and a second electrode electrically connected to the second conductive pattern.
摘要翻译：能够增加发光量的发光元件，包括该发光元件的发光装置，以及制造发光元件和发光器件的方法包括：形成有凹凸图案的缓冲层; 发光结构，包括沿着形成有凹凸图案的缓冲层共形形成的第一导电类型的第一导电图案，沿着第一导电图案共形形成的发光图案，以及第二导电图案形成在所述发光图案上的第二导电类型; 电连接到第一导电图案的第一电极; 以及电连接到第二导电图案的第二电极。

58. 发明申请

US20100015738A1 Light emitting elements and methods of fabricating the same 失效
标题翻译：发光元件及其制造方法
公开(公告)号：US20100015738A1
公开(公告)日：2010-01-21
申请号：US12459950
申请日：2009-07-10
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L33/007 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： Methods of fabricating light emitting elements and light emitting devices, light emitting elements and light emitting devices are provided. In some embodiments, the methods of fabricating a light emitting element includes forming a buffer layer on at least one first substrate, bonding the at least one first substrate on a second substrate, wherein the buffer layer is placed between each of the first substrate and the second substrate and the second substrate is larger than the first substrate, exposing the buffer layer, and sequentially forming a first conductive layer, a light emitting layer, and a second conductive layer on the exposed buffer layer.
摘要翻译：提供制造发光元件和发光器件，发光元件和发光器件的方法。在一些实施例中，制造发光元件的方法包括在至少一个第一衬底上形成缓冲层，在第二衬底上结合至少一个第一衬底，其中缓冲层位于第一衬底和第二基板和第二基板大于第一基板，暴露缓冲层，并且在暴露的缓冲层上依次形成第一导电层，发光层和第二导电层。

59. 发明申请

US20090315054A1 Light emitting elements, light emitting devices including light emitting elements and methods of manufacturing such light emitting elements and/or devices 有权
标题翻译：发光元件，包括发光元件的发光器件和制造这种发光元件和/或器件的方法
公开(公告)号：US20090315054A1
公开(公告)日：2009-12-24
申请号：US12457177
申请日：2009-06-03
申请人： Yu-Sik Kim , Seung-Jae Lee
发明人： Yu-Sik Kim , Seung-Jae Lee
IPC分类号： H01L33/00 , H01L21/28
CPC分类号： H01L33/20 , H01L25/0753 , H01L33/145 , H01L33/405 , H01L33/44 , H01L33/507 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/10158 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/01039
摘要： An emitting device including a first electrode, a second electrode spaced apart from the first electrode, an emitting pattern including a portion between the first electrode and the second electrode, and a block pattern including a portion between the emitting pattern and the first electrode and/or on a same level as the first electrode.
摘要翻译：一种发光装置，包括第一电极，与第一电极间隔开的第二电极，包括第一电极和第二电极之间的部分的发射图案，以及包括在发光图案与第一电极之间的部分和/ 或在与第一电极相同的水平上。

60. 发明申请

US20090252939A1 Wafer structures and wafer bonding methods 失效
标题翻译：晶圆结构和晶圆接合方法
公开(公告)号：US20090252939A1
公开(公告)日：2009-10-08
申请号：US12384617
申请日：2009-04-07
申请人： Sang-Joon Park , Kyoung-Kook kim , Yu-Sik Kim
发明人： Sang-Joon Park , Kyoung-Kook kim , Yu-Sik Kim
IPC分类号： B32B7/02 , B32B37/00 , B32B38/00 , B32B38/10 , B32B38/16
CPC分类号： H01L21/187 , B32B38/0008 , B32B2309/02 , B32B2309/027 , B32B2309/12 , B32B2310/14 , B32B2457/14 , Y10T156/1089 , Y10T428/24942
摘要： Wafer structures and wafer bonding methods are provided. In some embodiments, a wafer bonding method includes providing a conductive wafer and a plurality of insulating wafers, the conductive wafer being larger than the insulating wafers; performing a pre-treatment operation on the conductive wafer, the insulating wafers, or both; and directly bonding the insulating wafers to the conductive wafer.
摘要翻译：提供了晶圆结构和晶圆接合方法。在一些实施例中，晶片接合方法包括提供导电晶片和多个绝缘晶片，导电晶片大于绝缘晶片; 在导电晶片，绝缘晶片或两者上执行预处理操作; 并将绝缘晶片直接接合到导电晶片。

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