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1. 发明授权

US08829553B2 Light emitting package and methods of fabricating the same 有权
标题翻译：发光封装及其制造方法
公开(公告)号：US08829553B2
公开(公告)日：2014-09-09
申请号：US12805085
申请日：2010-07-12
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/167 , H01L33/60 , H01L2224/16225 , H01L2924/12044 , H01L2924/00
摘要： Example embodiments are directed to a light emitting package having a structure that prevents variance in a depth of a cavity in which a chip is mounted and a method of fabricating the same. A light emitting package includes a package body including a first body including the cavity and a second body bonded to the first body. The cavity penetrates the first body. A first electrode and a second electrode separate from each other are on the package body. A first dielectric layer is between the package body and the first electrode and between the package body and the second electrode. A light emitting element is placed in the cavity and electrically connected to the first electrode and the second electrode. A method of fabricating the light emitting package includes forming the first body and the second body bonded to the first body through a dielectric layer, forming the cavity in the first body and forming the light emitting element in the cavity.
摘要翻译：示例性实施例涉及具有防止其中安装芯片的腔的深度变化的结构的发光封装及其制造方法。一种发光封装，包括：封装主体，包括包括该空腔的第一主体和与第一主体结合的第二主体。空腔穿透第一体。彼此分开的第一电极和第二电极在封装主体上。第一电介质层位于封装主体和第一电极之间以及封装体和第二电极之间。将发光元件放置在空腔中并电连接到第一电极和第二电极。制造发光封装的方法包括：通过电介质层形成第一本体和第二主体，该第一本体和第二主体通过电介质层结合到第一主体上，在第一主体中形成空腔，并在腔中形成发光元件。

2. 发明申请

US20130285103A1 LIGHT EMITTING ELEMENTS, LIGH EMITTING DEVICES INCLUDING LIGHT EMITTING ELEMENTS AND METHODS OF MANUFACTURING SUCH LIGHT EMITTING ELEMENTS AND/OR DEVICES 审中-公开
标题翻译：发光元件，包括发光元件的发光装置和制造这种发光元件和/或器件的方法
公开(公告)号：US20130285103A1
公开(公告)日：2013-10-31
申请号：US13930606
申请日：2013-06-28
申请人： Yu-Sik KIM , Seung-Jae LEE
发明人： Yu-Sik KIM , Seung-Jae LEE
IPC分类号： H01L33/20
CPC分类号： H01L33/20 , H01L25/0753 , H01L33/145 , H01L33/405 , H01L33/44 , H01L33/507 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/10158 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/01039
摘要： An emitting device including a first electrode, a second electrode spaced apart from the first electrode, an emitting pattern including a portion between the first electrode and the second electrode, and a block pattern including a portion between the emitting pattern and the first electrode and/or on a same level as the first electrode.
摘要翻译：一种发光装置，包括第一电极，与第一电极间隔开的第二电极，包括第一电极和第二电极之间的部分的发射图案，以及包括在发光图案与第一电极之间的部分和/ 或在与第一电极相同的水平上。

3. 发明授权

US08415181B2 Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device 有权
标题翻译：具有提高光提取效率的发光元件，包括该发光元件的发光器件，以及发光元件和发光器件的制造方法
公开(公告)号：US08415181B2
公开(公告)日：2013-04-09
申请号：US13343147
申请日：2012-01-04
申请人： Yu-Sik Kim , Seong-Deok Hwang , Seung-Jae Lee , Sun-Pil Youn
发明人： Yu-Sik Kim , Seong-Deok Hwang , Seung-Jae Lee , Sun-Pil Youn
IPC分类号： H01L21/00
CPC分类号： H01L33/48 , H01L33/20 , H01L33/24 , H01L33/405 , H01L33/44 , H01L33/46 , H01L2224/05001 , H01L2224/05026 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05184 , H01L2224/05186 , H01L2224/05568 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05684 , H01L2224/13 , H01L2224/48091 , H01L2924/12044 , H01L2924/00014 , H01L2924/00 , H01L2924/0542 , H01L2924/0543 , H01L2924/0544
摘要： Provided is a light emitting element, a light emitting device including the same, and fabrication methods of the light emitting element and light emitting device. The light emitting device comprises a substrate, a light emitting structure including a first conductive layer of a first conductivity type, a light emitting layer, and a second conductive layer of a second conductivity type which are sequentially stacked, a first electrode which is electrically connected with the first conductive layer; and a second electrode which is electrically connected with the second conductive layer and separated apart from the first electrode, wherein at least a part of the second electrode is connected from a top of the light emitting structure, through a sidewall of the light emitting structure, and to a sidewall of the substrate.
摘要翻译：提供了一种发光元件，包括该发光元件的发光器件，以及发光元件和发光器件的制造方法。发光装置包括基板，发光结构，其包括依次堆叠的第一导电类型的第一导电层，发光层和第二导电类型的第二导电层，电连接的第一电极与第一导电层; 以及与所述第二导电层电连接并与所述第一电极分离的第二电极，其中所述第二电极的至少一部分通过所述发光结构的侧壁从所述发光结构的顶部连接，和衬底的侧壁。

4. 发明授权

US08338204B2 Light emitting element, a light emitting device, a method of manufacturing a light emitting element and a method of manufacturing a light emitting device 有权
标题翻译：发光元件，发光元件，发光元件的制造方法以及发光元件的制造方法
公开(公告)号：US08338204B2
公开(公告)日：2012-12-25
申请号：US13279790
申请日：2011-10-24
申请人： Yu-Sik Kim , Sang-Joon Park
发明人： Yu-Sik Kim , Sang-Joon Park
IPC分类号： H01L21/20
CPC分类号： H01L33/0079 , H01L33/0095 , H01L33/483 , H01L2224/48091 , H01L2924/01021 , H01L2924/01066 , H01L2924/01067 , H01L2924/10253 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a light-emitting element, a method of manufacturing the light-emitting element, a light-emitting device, and a method of manufacturing the light-emitting device. A method of manufacturing a light-emitting element includes: forming a first conductive layer of a first conductive type, a light-emitting layer, and a second conductive layer of a second conductive type on at least one first substrate, forming an ohmic layer on the second conductive layer and bonding the at least one first substrate to a second substrate. The second substrate being larger than the first substrate. The method further includes etching portions of the ohmic layer, the second conductive layer, and the light-emitting layer to expose a portion of the first conductive layer.
摘要翻译：本发明提供一种发光元件，发光元件的制造方法，发光元件及其制造方法。一种制造发光元件的方法包括：在至少一个第一基板上形成第一导电类型的第一导电层，第二导电类型的第二导电层和形成欧姆层的第二导电层所述第二导电层并将所述至少一个第一衬底结合到第二衬底。第二基板大于第一基板。该方法还包括蚀刻欧姆层，第二导电层和发光层的部分以暴露第一导电层的一部分。

5. 发明授权

US08324001B2 Light-emitting device, light-emitting system including the same, and fabricating method thereof 失效
标题翻译：发光装置，包括其的发光系统及其制造方法
公开(公告)号：US08324001B2
公开(公告)日：2012-12-04
申请号：US13118942
申请日：2011-05-31
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L21/00
CPC分类号： H01L33/505 , H01L25/0753 , H01L33/20 , H01L33/507 , H01L2224/45139 , H01L2224/48091 , H01L2224/73265 , H01L2924/12044 , H01L2924/3025 , H01L2933/0041 , H01L2924/00 , H01L2924/00014
摘要： A light-emitting device having improved light conversion efficiency, a light-emitting system including the same, and fabricating methods of the light-emitting device and the light-emitting system, are provided. The light-emitting device includes one or more light-emitting elements arranged on one surface of a substrate, and a phosphor layer disposed inside or on the substrate to a predetermined thickness and partially wavelength-converts the light emitted from the one or more light-emitting elements into light having different wavelength, wherein a light conversion efficiency of the phosphor layer is maximized when the phosphor layer has the predetermined thickness.
摘要翻译：提供了具有改善的光转换效率的发光装置，包括该发光装置的发光系统以及发光装置和发光系统的制造方法。发光装置包括布置在基板的一个表面上的一个或多个发光元件和设置在基板内部或基板上的预定厚度的荧光体层，并且部分地对从一个或多个发光元件发射的光进行波长转换，发光元件变成具有不同波长的光，其中当荧光体层具有预定厚度时，荧光体层的光转换效率最大化。

6. 发明授权

US08288755B2 Light-emitting device, light-emitting element and method of manufacturing same 失效
标题翻译：发光元件，发光元件及其制造方法
公开(公告)号：US08288755B2
公开(公告)日：2012-10-16
申请号：US13099869
申请日：2011-05-03
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L29/06 , H01L31/00
CPC分类号： H01L33/382 , H01L33/007 , H01L33/20 , H01L33/62 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05027 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05184 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/0558 , H01L2224/05624 , H01L2224/05639 , H01L2224/16145 , H01L2933/0083 , H01L2224/48091 , H01L2924/00014
摘要： Provided are a light-emitting element and a light-emitting device, and methods of fabricating the same. The method of fabricating a light-emitting element includes forming a buffer layer on a substrate and forming photonic crystal patterns and a pad pattern on the buffer layer. Each of the pad pattern and the photonic crystal patterns are made of a metal material, and the pad pattern is physically connected to the photonic crystal patterns. Forming a light-emitting structure includes sequentially stacking a first conductive pattern of a first conductivity type, a light-emitting pattern, and a second conductive pattern of a second conductivity type on the buffer layer. And the method also includes forming a first electrode that is electrically connected to the first conductive pattern and forming a second electrode that is electrically connected to the second conductive pattern.
摘要翻译：提供发光元件和发光器件及其制造方法。制造发光元件的方法包括在衬底上形成缓冲层并在缓冲层上形成光子晶体图案和衬垫图案。焊盘图案和光子晶体图案中的每一个由金属材料制成，并且焊盘图案物理连接到光子晶体图案。形成发光结构包括在缓冲层上依次堆叠第一导电类型的第一导电图案，发光图案和第二导电类型的第二导电图案。并且该方法还包括形成电连接到第一导电图案并形成电连接到第二导电图案的第二电极的第一电极。

7. 发明授权

US08268699B2 Wafer structures and wafer bonding methods 失效
标题翻译：晶圆结构和晶圆接合方法
公开(公告)号：US08268699B2
公开(公告)日：2012-09-18
申请号：US12384617
申请日：2009-04-07
申请人： Sang-Joon Park , Kyoung-Kook Kim , Yu-Sik Kim
发明人： Sang-Joon Park , Kyoung-Kook Kim , Yu-Sik Kim
IPC分类号： H01L21/30
CPC分类号： H01L21/187 , B32B38/0008 , B32B2309/02 , B32B2309/027 , B32B2309/12 , B32B2310/14 , B32B2457/14 , Y10T156/1089 , Y10T428/24942
摘要： Wafer structures and wafer bonding methods are provided. In some embodiments, a wafer bonding method includes providing a conductive wafer and a plurality of insulating wafers, the conductive wafer being larger than the insulating wafers; performing a pre-treatment operation on the conductive wafer, the insulating wafers, or both; and directly bonding the insulating wafers to the conductive wafer.
摘要翻译：提供了晶圆结构和晶圆接合方法。在一些实施例中，晶片接合方法包括提供导电晶片和多个绝缘晶片，导电晶片大于绝缘晶片; 在导电晶片，绝缘晶片或两者上执行预处理操作; 并将绝缘晶片直接接合到导电晶片。

8. 发明授权

US08179938B2 Light-emitting element capable of increasing amount of light emitted, light-emitting device including the same, and method of manufacturing light-emitting element and light-emitting device 有权
标题翻译：能够增加发光量的发光元件，包括该发光元件的发光元件以及发光元件和发光元件的制造方法
公开(公告)号：US08179938B2
公开(公告)日：2012-05-15
申请号：US12584857
申请日：2009-09-14
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01S3/00
CPC分类号： H01L33/24 , H01L33/12 , H01L33/405 , H01L2224/45139 , H01L2224/48091 , H01L2224/49107 , H01L2924/12044 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting element capable of increasing the amount of light emitted, a light-emitting device including the same, and a method of manufacturing the light-emitting element and the light-emitting device include a buffer layer having an uneven pattern formed thereon; a light-emitting structure including a first conductive pattern of a first conductivity type that is conformally formed along the buffer layer having the uneven pattern formed thereon, a light-emitting pattern that is conformally formed along the first conductive pattern, and a second conductive pattern of a second conductivity type that is formed on the light-emitting pattern; a first electrode electrically connected to the first conductive pattern; and a second electrode electrically connected to the second conductive pattern.
摘要翻译：能够增加发光量的发光元件，包括该发光元件的发光装置，以及制造发光元件和发光器件的方法包括：形成有凹凸图案的缓冲层; 发光结构，其包括沿着形成有凹凸图案的缓冲层共形形成的第一导电类型的第一导电图案，沿着第一导电图案共形形成的发光图案，以及第二导电图案形成在所述发光图案上的第二导电类型; 电连接到第一导电图案的第一电极; 以及电连接到第二导电图案的第二电极。

9. 发明申请

US20120074442A1 LIGHT EMITTING DIODE MODULE 审中-公开
标题翻译：发光二极管模块
公开(公告)号：US20120074442A1
公开(公告)日：2012-03-29
申请号：US13309364
申请日：2011-12-01
申请人： Yu-sik KIM , Hyung-kun KIM , Cheol-soo SONE , Jae-wook JEONG
发明人： Yu-sik KIM , Hyung-kun KIM , Cheol-soo SONE , Jae-wook JEONG
IPC分类号： H01L33/50
CPC分类号： H01L33/50 , H01L33/46
摘要： A light emitting diode module having improved luminous efficiency is provided. The light emitting diode module includes: a light emitting chip; a phosphor layer formed of phosphor materials emitting light having a wavelength longer than the light emitted from the light emitting chip using light emitted from the light emitting chip as an excitation source; and a reflection plate that is disposed between the light emitting chip and the phosphor layer and that reflects the light emitted by the phosphor layer.
摘要翻译：提供了具有改善的发光效率的发光二极管模块。发光二极管模块包括：发光芯片; 荧光体层，由荧光体材料形成，所述荧光体材料使用从所述发光芯片发射的光作为激发源发射波长比从所述发光芯片发射的光的波长的光; 以及设置在发光芯片和荧光体层之间并且反射由荧光体层发射的光的反射板。

10. 发明授权

US08110843B2 Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device 有权
标题翻译：具有提高光提取效率的发光元件，包括该发光元件的发光器件，以及发光元件和发光器件的制造方法
公开(公告)号：US08110843B2
公开(公告)日：2012-02-07
申请号：US12586970
申请日：2009-09-30
申请人： Yu-Sik Kim , Seong-Deok Hwang , Seung-Jae Lee , Sun-Pil Youn
发明人： Yu-Sik Kim , Seong-Deok Hwang , Seung-Jae Lee , Sun-Pil Youn
IPC分类号： H01L33/00
CPC分类号： H01L33/48 , H01L33/20 , H01L33/24 , H01L33/405 , H01L33/44 , H01L33/46 , H01L2224/05001 , H01L2224/05026 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05184 , H01L2224/05186 , H01L2224/05568 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05684 , H01L2224/13 , H01L2224/48091 , H01L2924/12044 , H01L2924/00014 , H01L2924/00 , H01L2924/0542 , H01L2924/0543 , H01L2924/0544
摘要： Provided is a light emitting element, a light emitting device including the same, and fabrication methods of the light emitting element and light emitting device. The light emitting device comprises a substrate, a light emitting structure including a first conductive layer of a first conductivity type, a light emitting layer, and a second conductive layer of a second conductivity type which are sequentially stacked, a first electrode which is electrically connected with the first conductive layer; and a second electrode which is electrically connected with the second conductive layer and separated apart from the first electrode, wherein at least a part of the second electrode is connected from a top of the light emitting structure, through a sidewall of the light emitting structure, and to a sidewall of the substrate.
摘要翻译：提供了一种发光元件，包括该发光元件的发光器件，以及发光元件和发光器件的制造方法。发光装置包括基板，发光结构，其包括依次堆叠的第一导电类型的第一导电层，发光层和第二导电类型的第二导电层，电连接的第一电极与第一导电层; 以及与所述第二导电层电连接并与所述第一电极分离的第二电极，其中所述第二电极的至少一部分通过所述发光结构的侧壁从所述发光结构的顶部连接，和衬底的侧壁。

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