专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070246712A1 Light emitting diode module 有权
标题翻译：发光二极管模块
公开(公告)号：US20070246712A1
公开(公告)日：2007-10-25
申请号：US11515248
申请日：2006-09-05
申请人： Yu-sik Kim , Hyung-kun Kim
发明人： Yu-sik Kim , Hyung-kun Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/486 , H01L33/644 , H01L2224/48235
摘要： A long life light-emitting diode (LED) module is provided. The LED module includes: a light-emitting chip; a phosphor layer formed of phosphor materials that transform light emitted from the light-emitting chip into light having a longer wavelength than the light emitted from the light-emitting chip; a capping layer that is formed on the light-emitting chip and protects the light-emitting chip; and a heat spreading plate that is disposed between the capping layer and the phosphor layer that dissipates heat generated in the light-emitting chip and the phosphor layer.
摘要翻译：提供长寿命的发光二极管（LED）模块。 LED模块包括：发光芯片; 将从发光芯片发射的光变换为比从发光芯片发射的光更长的波长的荧光材料形成的荧光体层; 覆盖层，形成在所述发光芯片上并保护所述发光芯片; 以及散热板，其设置在所述覆盖层和所述荧光体层之间，其散发在所述发光芯片和所述荧光体层中产生的热量。

2. 发明授权

US08093615B2 Light emitting diode module 有权
标题翻译：发光二极管模块
公开(公告)号：US08093615B2
公开(公告)日：2012-01-10
申请号：US11513221
申请日：2006-08-31
申请人： Yu-sik Kim , Hyung-kun Kim , Cheol-soo Sone , Jae-wook Jeong
发明人： Yu-sik Kim , Hyung-kun Kim , Cheol-soo Sone , Jae-wook Jeong
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , H01L33/46
摘要： A light emitting diode module having improved luminous efficiency is provided. The light emitting diode module includes: a light emitting chip; a phosphor layer formed of phosphor materials emitting light having a wavelength longer than the light emitted from the light emitting chip using light emitted from the light emitting chip as an excitation source; and a reflection plate that is disposed between the light emitting chip and the phosphor layer and that reflects the light emitted by the phosphor layer.
摘要翻译：提供了具有改善的发光效率的发光二极管模块。发光二极管模块包括：发光芯片; 荧光体层，由荧光体材料形成，所述荧光体材料使用从所述发光芯片发射的光作为激发源发射波长比从所述发光芯片发射的光的波长的光; 以及设置在发光芯片和荧光体层之间并且反射由荧光体层发射的光的反射板。

3. 发明申请

US20100295082A1 Light emitting package and light emitting package array 有权
标题翻译：发光封装和发光封装阵列
公开(公告)号：US20100295082A1
公开(公告)日：2010-11-25
申请号：US12805404
申请日：2010-07-29
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： H01L33/60
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/01078 , H01L2924/09701 , H01L2924/00014
摘要： Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body-including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.
摘要翻译：示例性实施例可以包括发光器件封装。发光器件封装可以包括发光器件，封装体 - 包括其上安装有发光器件的底表面的空腔和用于反射从发光器件发射的光的侧表面，从第一电极突出的第一电极所述封装主体以及与所述封装主体耦合的第二电极。第一和第二电极可以被设计成分别与另一个发光器件封装的第二和第二电极耦合，从而形成发光器件封装的阵列。

4. 发明申请

US20070217210A1 Light emitting device unit for AC voltage 审中-公开
标题翻译：用于交流电压的发光装置单元
公开(公告)号：US20070217210A1
公开(公告)日：2007-09-20
申请号：US11655830
申请日：2007-01-22
申请人： Jae-wook Jeong , Hyung-kun Kim , Jae-hee Cho , Yu-sik Kim
发明人： Jae-wook Jeong , Hyung-kun Kim , Jae-hee Cho , Yu-sik Kim
IPC分类号： B60Q1/06
CPC分类号： H05B33/0821 , F21K9/00 , Y02B20/348
摘要： A light emitting diode unit for AC voltage is provided. The light emitting diode unit includes a sub-mount on which electric wires are formed; a first light emitting diode array in which a plurality of first light emitting diodes are serially connected to the sub-mount; and a second light emitting diode array, in which a plurality of second light emitting diodes are connected to the sub-mount as bridge circuits, connecting to the first light emitting diode array. Therefore, rectification can be performed through the bridge circuit without an additional rectifying device by connecting the light emitting diodes to the bridge circuit in series, and thus the structure of the unit can be simplified and a size of the light emitting diode unit can be reduced.
摘要翻译：提供了用于交流电压的发光二极管单元。发光二极管单元包括其上形成电线的子座; 第一发光二极管阵列，其中多个第一发光二极管串联连接到所述副安装座; 以及第二发光二极管阵列，其中多个第二发光二极管连接到作为桥接电路的子座，连接到第一发光二极管阵列。因此，通过将发光二极管串联连接到桥式电路，可以通过桥式电路进行整流，而不需要额外的整流装置，因此可以简化单元的结构，并且可以减小发光二极管单元的尺寸。

5. 发明申请

US20070176196A1 Light emitting diode module 有权
标题翻译：发光二极管模块
公开(公告)号：US20070176196A1
公开(公告)日：2007-08-02
申请号：US11513221
申请日：2006-08-31
申请人： Yu-sik Kim , Hyung-kun Kim , Cheol-soo Sone , Jae-wook Jeong
发明人： Yu-sik Kim , Hyung-kun Kim , Cheol-soo Sone , Jae-wook Jeong
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , H01L33/46
摘要： A light emitting diode module having improved luminous efficiency is provided. The light emitting diode module includes: a light emitting chip; a phosphor layer formed of phosphor materials emitting light having a wavelength longer than the light emitted from the light emitting chip using light emitted from the light emitting chip as an excitation source; and a reflection plate that is disposed between the light emitting chip and the phosphor layer and that reflects the light emitted by the phosphor layer.
摘要翻译：提供了具有改善的发光效率的发光二极管模块。发光二极管模块包括：发光芯片; 荧光体层，由荧光体材料形成，所述荧光体材料使用从所述发光芯片发射的光作为激发源发射波长比从所述发光芯片发射的光的波长的光; 以及设置在发光芯片和荧光体层之间并且反射由荧光体层发射的光的反射板。

6. 发明申请

US20060284209A1 Light emitting device package 有权
标题翻译：发光装置封装
公开(公告)号：US20060284209A1
公开(公告)日：2006-12-21
申请号：US11452410
申请日：2006-06-14
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device package is provided. The light emitting device package comprises a base substrate on which a wiring pattern is formed; a light emitting device mounted on the base substrate to emit light when supplied with driving power through the wiring pattern; a molded lens stably seated on the base substrate and having an inner space for sealing the light emitting device and reflective surfaces formed along outer sides facing the inner space to guide light from the light emitting device in an effective display direction; and a sealing resin between the inner space to bond the base substrate to the molded lens, whereby the packaging structure is simplified so that an assembly process and reliability testing are simplified, process losses due to defects are minimized, and the light extraction efficiency from the light emitting device and heat-dissipation performance are improved.
摘要翻译：提供发光器件封装。发光器件封装包括其上形成有布线图案的基底基板; 当通过所述布线图案供给驱动电力时，安装在所述基底基板上的发光装置发光; 模制透镜稳定地安置在基底基板上，并且具有用于密封发光器件的内部空间和沿着面向内部空间的外侧形成的反射表面，以在有效的显示方向上引导来自发光器件的光; 以及在内部空间之间的密封树脂，以将基底基板粘合到模制透镜上，从而简化了包装结构，从而简化了组装过程和可靠性测试，使由缺陷引起的工艺损失最小化，并且来自发光器件和散热性能得到改善。

7. 发明授权

US07943951B2 Light emitting device package 有权
标题翻译：发光装置封装
公开(公告)号：US07943951B2
公开(公告)日：2011-05-17
申请号：US11452410
申请日：2006-06-14
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device package is provided. The light emitting device package comprises a base substrate on which a wiring pattern is formed; a light emitting device mounted on the base substrate to emit light when supplied with driving power through the wiring pattern; a molded lens stably seated on the base substrate and having an inner space for sealing the light emitting device and reflective surfaces formed along outer sides facing the inner space to guide light from the light emitting device in an effective display direction; and a sealing resin between the inner space to bond the base substrate to the molded lens, whereby the packaging structure is simplified so that an assembly process and reliability testing are simplified, process losses due to defects are minimized, and the light extraction efficiency from the light emitting device and heat-dissipation performance are improved.
摘要翻译：提供发光器件封装。发光器件封装包括其上形成有布线图案的基底基板; 当通过所述布线图案供给驱动电力时，安装在所述基底基板上的发光装置发光; 模制透镜稳定地安置在基底基板上，并且具有用于密封发光器件的内部空间和沿着面向内部空间的外侧形成的反射表面，以在有效的显示方向上引导来自发光器件的光; 以及在内部空间之间的密封树脂，以将基底基板粘合到模制透镜上，从而简化了包装结构，从而简化了组装过程和可靠性测试，使由缺陷引起的工艺损失最小化，并且来自发光器件和散热性能得到改善。

8. 发明授权

US07902563B2 Light emitting diode module with heat spreading plate between capping layer and phosphor layer 有权
标题翻译：发光二极管模块，在封盖层和磷光体层之间具有散热板
公开(公告)号：US07902563B2
公开(公告)日：2011-03-08
申请号：US11515248
申请日：2006-09-05
申请人： Yu-sik Kim , Hyung-kun Kim
发明人： Yu-sik Kim , Hyung-kun Kim
IPC分类号： H01L33/64
CPC分类号： H01L33/507 , H01L33/486 , H01L33/644 , H01L2224/48235
摘要： A long life light-emitting diode (LED) module is provided. The LED module includes: a light-emitting chip; a phosphor layer formed of phosphor materials that transform light emitted from the light-emitting chip into light having a longer wavelength than the light emitted from the light-emitting chip; a capping layer that is formed on the light-emitting chip and protects the light-emitting chip; and a heat spreading plate that is disposed between the capping layer and the phosphor layer that dissipates heat generated in the light-emitting chip and the phosphor layer.
摘要翻译：提供长寿命的发光二极管（LED）模块。 LED模块包括：发光芯片; 将从发光芯片发射的光变换为比从发光芯片发射的光更长的波长的荧光材料形成的荧光体层; 覆盖层，形成在所述发光芯片上并保护所述发光芯片; 以及散热板，其设置在所述覆盖层和所述荧光体层之间，其散发在所述发光芯片和所述荧光体层中产生的热量。

9. 发明申请

US20090278154A1 Led module and method of manufacturing the same 审中-公开
标题翻译： LED模块及其制造方法
公开(公告)号：US20090278154A1
公开(公告)日：2009-11-12
申请号：US12458581
申请日：2009-07-16
申请人： Hyung-kun Kim , Jae-hee Cho , Yu-sik Kim
发明人： Hyung-kun Kim , Jae-hee Cho , Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Provided are a light emitting diode (LED) module and a method of manufacturing the same. The LED module may include a package housing including an inner space, a light-emitting chip in the inner space of the package housing, a phosphor layer including a fluorescent material and converting light emitted from the light-emitting chip to light having a longer wavelength than that of the light emitted from the light-emitting chip. The concentration of the fluorescent material of the phosphor layer may be inhomogeneous. The method of manufacturing the LED module may include providing or forming a package housing having an inner space and including a light-emitting chip in the inner space, measuring a radiation pattern of light emitted from the light-emitting chip, and forming a phosphor layer including a fluorescent material on the light-emitting chip and having characteristics that may be determined according to the radiation pattern.
摘要翻译：提供了一种发光二极管（LED）模块及其制造方法。 LED模块可以包括包括内部空间的封装壳体，在封装壳体的内部空间中的发光芯片，包括荧光材料的荧光体层，将从发光芯片发射的光转换成具有较长波长的光比从发光芯片发出的光的强度高。荧光体层的荧光材料的浓度可能不均匀。制造LED模块的方法可以包括提供或形成具有内部空间并且在内部空间中包括发光芯片的封装壳体，测量从发光芯片发射的光的辐射图案，以及形成荧光体层包括在发光芯片上的荧光材料，并且具有可以根据辐射图案确定的特性。

10. 发明授权

US07425083B2 Light emitting device package 失效
标题翻译：发光装置封装
公开(公告)号：US07425083B2
公开(公告)日：2008-09-16
申请号：US11347257
申请日：2006-02-06
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： F21V29/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01S5/02276 , H01S5/02292 , H01L2924/00014
摘要： A light emitting device package is provided. The light emitting device package includes a light emitting device; a package body on which the light emitting device is loaded and which dissipates heat generated from the light emitting device to the outside; a first electrode formed in the package body in a single body; and a second electrode inserted into the package body.
摘要翻译：提供发光器件封装。发光器件封装包括发光器件; 封装体，其上装载有发光器件并且将从发光器件产生的热量散发到外部; 在单体中形成在封装主体中的第一电极; 以及插入到封装主体中的第二电极。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式