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1. 发明授权

US08709840B2 Light-emitting device package and method of manufacturing the same 有权
标题翻译：发光器件封装及其制造方法
公开(公告)号：US08709840B2
公开(公告)日：2014-04-29
申请号：US13312237
申请日：2011-12-06
申请人： Hyung-kun Kim
发明人： Hyung-kun Kim
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/00014
摘要： A light-emitting device package uses a metal layer as a reflective region and includes a light-emitting device chip and an electrode pad that are disposed on an insulating layer. In addition, the electrode pad and an electrode pattern of a printed circuit board are connected to each other by an electrode pattern formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink.
摘要翻译：发光器件封装使用金属层作为反射区域，并且包括设置在绝缘层上的发光器件芯片和电极焊盘。此外，电极焊盘和印刷电路板的电极图案通过由导电油墨形成的电极图案彼此连接。一种制造发光器件封装的方法包括在金属层上形成绝缘层，并将发光器件芯片和电极焊盘接合在绝缘层上。电极焊盘和印刷电路板通过导电油墨相互连接。

2. 发明申请

US20120211780A1 LED PACKAGE MODULE 有权
标题翻译： LED封装模块
公开(公告)号：US20120211780A1
公开(公告)日：2012-08-23
申请号：US13404924
申请日：2012-02-24
申请人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
发明人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
IPC分类号： H01L33/50
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48235 , H01L2924/00014
摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.
摘要翻译：根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。

3. 发明申请

US20120056227A1 LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20120056227A1
公开(公告)日：2012-03-08
申请号：US13224658
申请日：2011-09-02
申请人： Young Jin LEE , Hyung Kun Kim , Kyung Mi Moon , Gwang Bok Woo
发明人： Young Jin LEE , Hyung Kun Kim , Kyung Mi Moon , Gwang Bok Woo
IPC分类号： H01L33/62 , H01L33/58
CPC分类号： H01L33/642 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2933/0075 , H01L2924/00014
摘要： A light emitting diode (LED) package is disclosed. The LED package includes a lead frame comprising a thermal pad and at least two electrode pads disposed at a distance from the thermal pad; at least one LED mounted on the thermal pad and electrically connected with the at least two electrode pads through a wire; a package mold comprising a first cavity to receive the thermal pad and the at least two electrode pads and to partially expose the thermal pad and the at least two electrode pads through a first surface of the package mold, the first surface on which the at least one LED is mounted, and exposing the thermal pad and the at least two electrode pads through a surface coplanar with a second surface opposite to the first surface; and a molding unit disposed in the first cavity.
摘要翻译：公开了一种发光二极管（LED）封装。所述LED封装包括引线框架，所述引线框架包括散热焊盘和至少两个设置在距离所述散热焊盘一定距离的电极焊盘; 至少一个LED，其安装在所述散热垫上并通过导线与所述至少两个电极焊盘电连接; 封装模具，其包括用于接收所述热垫和所述至少两个电极焊盘的第一腔，并且通过所述封装模具的第一表面部分地暴露所述热垫和所述至少两个电极焊盘，所述第一表面至少在所述第一表面上，安装一个LED，并且通过与第一表面相对的第二表面共面的表面暴露热衬垫和至少两个电极焊盘; 以及设置在所述第一腔中的模制单元。

4. 发明授权

US08124998B2 Light emitting device package 有权
标题翻译：发光装置封装
公开(公告)号：US08124998B2
公开(公告)日：2012-02-28
申请号：US11225090
申请日：2005-09-14
申请人： Hyung-kun Kim
发明人： Hyung-kun Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L33/486 , H01L33/62 , H01L2224/16 , H01L2224/48091 , H01L2224/48247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2224/0401
摘要： A light emitting device package is provided. The light emitting device package includes: a light emitting device; and first and second electrodes disposed a predetermined distance from each other and respectively adhered to the light emitting device so as to be electrically connected to the light emitting device, the first and second electrodes applying a current or voltage to the light emitting device and emitting heat generated by the light emitting device.
摘要翻译：提供发光器件封装。发光器件封装包括：发光器件; 以及第一和第二电极彼此间隔预定距离并且分别粘附到发光器件以便电连接到发光器件，第一和第二电极向发光器件施加电流或电压并发射热量由发光器件产生。

5. 发明申请

US20120043896A1 AC DRIVEN LIGHT EMITTING DEVICE 有权
标题翻译：交流驱动发光装置
公开(公告)号：US20120043896A1
公开(公告)日：2012-02-23
申请号：US13215619
申请日：2011-08-23
申请人： Young Jin LEE , Hyung Kun Kim , Kyung Mi Moon
发明人： Young Jin LEE , Hyung Kun Kim , Kyung Mi Moon
IPC分类号： H05B37/02
CPC分类号： H05B33/0821 , H05B33/0806
摘要： There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.
摘要翻译：提供了一种包括串联连接的多个LED阵列的交流（AC）驱动的发光器件，每个LED阵列具有多个LED电连接以形成两端电路并通过双向电压发光的结构当对两端电路施加交流电压时; 以及连接到所述多个LED阵列中的至少一个并且控制相对于所述多个LED阵列的总驱动电压的开关装置。交流驱动发光器件允许从低驱动电压Vf进行操作，同时具有高电压Vf的高驱动电压，从而在功率因数，THD和能量效率方面实现卓越。

6. 发明授权

US07985975B2 Light emitting package and light emitting package array formed by coupled electrodes 有权
标题翻译：由耦合电极形成的发光封装和发光封装阵列
公开(公告)号：US07985975B2
公开(公告)日：2011-07-26
申请号：US12805404
申请日：2010-07-29
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/01078 , H01L2924/09701 , H01L2924/00014
摘要： Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body-including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.
摘要翻译：示例性实施例可以包括发光器件封装。发光器件封装可以包括发光器件，封装体 - 包括其上安装有发光器件的底表面的空腔和用于反射从发光器件发射的光的侧表面，从第一电极突出的第一电极所述封装主体以及与所述封装主体耦合的第二电极。第一和第二电极可以被设计成分别与另一个发光器件封装的第二和第二电极耦合，从而形成发光器件封装的阵列。

7. 发明授权

US07973328B2 Light emitting diode package 有权
标题翻译：发光二极管封装
公开(公告)号：US07973328B2
公开(公告)日：2011-07-05
申请号：US12204095
申请日：2008-09-04
申请人： Hyung Kun Kim
发明人： Hyung Kun Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/505 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： There is provided a light emitting diode (LED) package in which a phosphor layer encapsulating an LED chip is formed uniformly to facilitate a process. The LED package includes: a package body having a mounting area; a holding part mounted on the mounting area to expose a portion of the mounting area; an LED chip mounted on the mounting area, the LED chip surrounded by the holding part to emit light; and a phosphor layer held by the holding part to seal a space defined by the holding part, the phosphor layer converting a wavelength of the light from the LED chip.
摘要翻译：提供了一种发光二极管（LED）封装，其中均匀地形成封装LED芯片的荧光体层以便于处理。 LED封装包括：具有安装区域的封装体; 保持部，安装在所述安装区域上，以暴露所述安装区域的一部分; 安装在安装区域上的LED芯片，由保持部分包围的LED芯片发光; 以及由所述保持部保持的荧光体层，以密封由所述保持部限定的空间，所述荧光体层转换来自所述LED芯片的光的波长。

8. 发明授权

US07888689B2 Light emitting package and light emitting package array 有权
标题翻译：发光封装和发光封装阵列
公开(公告)号：US07888689B2
公开(公告)日：2011-02-15
申请号：US11798390
申请日：2007-05-14
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/01078 , H01L2924/09701 , H01L2924/00014
摘要： Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.
摘要翻译：示例性实施例可以包括发光器件封装。发光器件封装可以包括发光器件，封装体，其包括具有其上安装有发光器件的底表面的空腔和用于反射从发光器件发射的光的侧表面，从所述发光器件突出的第一电极封装主体和与封装主体耦合的第二电极。第一和第二电极可以被设计成分别与另一个发光器件封装的第二和第二电极耦合，从而形成发光器件封装的阵列。

9. 发明申请

US20090322248A1 LED DRIVING CIRCUIT AND LIGHT EMITTING DIODE ARRAY DEVICE 有权
标题翻译： LED驱动电路和发光二极管阵列器件
公开(公告)号：US20090322248A1
公开(公告)日：2009-12-31
申请号：US12262801
申请日：2008-10-31
申请人： Young Jin LEE , Joong Kon SON , Hyung Kun KIM , Jung Ja YANG , Grigory ONUSHKIN
发明人： Young Jin LEE , Joong Kon SON , Hyung Kun KIM , Jung Ja YANG , Grigory ONUSHKIN
IPC分类号： H05B41/36
CPC分类号： H05B33/0821
摘要： There is provided an LED driving circuit. The LED driving circuit according to an aspect of the invention may include: at least one ladder circuit including: (n−1) number (here, n is a positive integer satisfying n≧2) of first branches provided between first and second junction points, and connected in-line with each other by n number of first middle junction points, (n−1) number of second branches arranged in parallel with the first branches, and connected in-line with each other by n number of second middle junction points between the first and second junction points, and n number of middle branches connecting m-th first and second middle junction points to each other, wherein at least one LED device is disposed on each of the first, second, and middle branches. Here, the number of LED devices included in each of the first and second branches is greater than the number of LED devices included in each of the middle branches.
摘要翻译：提供了LED驱动电路。根据本发明的一个方面的LED驱动电路可以包括：至少一个梯形电路，包括：设置在第一和第二结之间的第一分支的（n-1）个数（这里，n是满足n> = 2的正整数）点，并且通过n个第一中间连接点彼此并排连接，（n-1）个与第一分支平行布置的第二分支，并且彼此连接成n个第二中间第一和第二接合点之间的接合点以及将第m个第一和第二中间接合点彼此连接的n个中间分支，其中至少一个LED器件设置在第一，第二和中间分支中的每一个上。这里，包括在第一和第二分支中的每个中的LED装置的数量大于包括在每个中间分支中的LED装置的数量。

10. 发明授权

US07535942B2 Semiconductor laser device including a light shield plate, semiconductor laser device package, and methods of manufacturing the same 失效
标题翻译：包括遮光板，半导体激光器件封装的半导体激光器件及其制造方法
公开(公告)号：US07535942B2
公开(公告)日：2009-05-19
申请号：US11907879
申请日：2007-10-18
申请人： Han-youl Ryu , Hyung-kun Kim
发明人： Han-youl Ryu , Hyung-kun Kim
IPC分类号： H01S3/09 , H01S5/00
CPC分类号： H01S5/02212 , H01S5/005 , H01S5/021 , H01S5/0213 , H01S5/2027 , H01S5/22 , H01S5/32341
摘要： Provided is a semiconductor laser device, a semiconductor laser device package including the semiconductor laser device and methods of manufacturing the same. A semiconductor laser device may include a light emission structure including a first clad layer, an active layer and a second clad layer sequentially deposited on a substrate, a submount to which the light emission structure bonded, and a light shield plate in the submount, wherein the light shield plate blocks an end of the substrate on a light emission face of the light emission structure and blocks light leaked through the end of the substrate.
摘要翻译：提供一种半导体激光器件，包括半导体激光器件的半导体激光器器件封装及其制造方法。半导体激光器件可以包括发光结构，其包括顺序地沉积在衬底上的第一覆盖层，有源层和第二覆盖层，接合发光结构的基座以及基座中的遮光板，其中遮光板在发光结构的发光面上阻挡基板的一端，并且阻挡通过基板的端部泄漏的光。

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