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    • 41. 发明授权
    • Method and apparatus of forming thin films
    • 形成薄膜的方法和装置
    • US5755888A
    • 1998-05-26
    • US518267
    • 1995-08-23
    • Hideo ToriiEiji FujiiShigenori HayashiRyoichi Takayama
    • Hideo ToriiEiji FujiiShigenori HayashiRyoichi Takayama
    • C23C14/00C23C14/56C23C16/44C23C16/54C30B25/14H01L21/203H01L21/205H01L21/285C23C16/00
    • C23C14/568C23C16/4412C23C16/54C30B25/14
    • An apparatus of forming thin films, which is small and requires a short thin-film formation time, is provided which comprises at least one physical vapor deposition device and at least one chemical vapor deposition device, wherein said physical vapor deposition device and said chemical vapor deposition device are provided with an exhaust pipe respectively for connection with a common exhaust means and an exhaust switching means. A method of forming thin films using this apparatus is also provided. According to the configuration in which the exhaust switching means is connected via exhaust pipes to the physical vapor deposition device, to the chemical vapor deposition device, and to the exhaust means, this apparatus can be accomplished in a small size which has at least two chambers and one exhaust means. In this way, thin films can be formed in a short thin-film formation time with a small apparatus, since vapor of a starting material which is led in at the time of chemical vapor deposition does not enter the physical vapor deposition device.
    • 提供一种形成薄膜并需要短的薄膜形成时间的装置,其包括至少一个物理气相沉积装置和至少一个化学气相沉积装置,其中所述物理气相沉积装置和所述化学气相 沉积装置设置有分别用于与公共排气装置和排气开关装置连接的排气管。 还提供了使用该装置形成薄膜的方法。 根据其中排气切换装置经由排气管连接到物理气相沉积装置,化学气相沉积装置和排气装置的结构,该装置可以实现为具有至少两个室的小尺寸 和一个排气装置。 这样,由于在化学气相沉积时引入的原料的蒸气不会进入物理气相沉积装置,因此可以用小的装置在短的薄膜形成时间内形成薄膜。
    • 50. 发明授权
    • Thin film thermistor element and method for the fabrication of thin film thermistor element
    • 薄膜热敏电阻元件及制造薄膜热敏电阻元件的方法
    • US06475604B1
    • 2002-11-05
    • US09584768
    • 2000-06-01
    • Eiji FujiiAtsushi TomozawaHideo ToriiRyoichi Takayama
    • Eiji FujiiAtsushi TomozawaHideo ToriiRyoichi Takayama
    • H01C700
    • H01C17/12H01C7/023Y10T428/24917
    • A thin film thermistor element 10 is formed by forming on a backing substrate 11 of alumina a thermistor thin film 12 and a pair of comb electrodes 13 and 14 formed of a thin film of Pt. The thermistor thin film 12, which is formed of, for example, complex oxide of Mn—Co—Ni, has either a spinel type crystal structure which is priority oriented or oriented mainly in a (100) surface or a bixbite type crystal structure which is priority oriented in a (100) or (111) surface. Alternatively, the thermistor thin film is formed of LaCoO3 and has a rhombohedral bixbite type crystal structure. This makes it possible to hold the variation in resistance value low thereby to achieve high accuracy, and the deterioration with time can be held low and the high temperature durability can be improved, for the achievement of high reliability.
    • 通过在氧化铝的背衬基板11上形成热敏电阻薄膜12和由Pt的薄膜形成的一对梳状电极13和14来形成薄膜热敏电阻元件10。 由例如Mn-Co-Ni的复合氧化物形成的热敏电阻薄膜12具有尖晶石型晶体结构,其优先取向或主要在(100)表面取向或双键型晶体结构中,其中, 在(100)或(111)表面优先考虑。 或者,热敏电阻薄膜由LaCoO 3形成,并且具有菱形双峰型晶体结构。 这使得可以将电阻值的变化保持为低,从而实现高精度,并且,为了实现高可靠性,能够将劣化随时间变低,提高耐高温性。