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    • 4. 发明授权
    • Semiconductor device and method for fabricating the same
    • 半导体装置及其制造方法
    • US07053436B2
    • 2006-05-30
    • US10752668
    • 2004-01-08
    • Yoshihisa NaganoToshie Kutsunai
    • Yoshihisa NaganoToshie Kutsunai
    • H01L27/108
    • H01L28/55H01L21/7687H01L27/10852H01L28/65
    • A conductive oxygen barrier layer is formed on an interlayer dielectric film and patterned such that it is in contact with the top surface of a contact plug to prevent the diffusion of oxygen into the contact plug from above. The conductive oxygen barrier layer is composed of a lower layer containing a conductive nitride such as TiAlN, and an upper layer containing a conductive oxide such as IrO2. An insulative oxygen barrier layer composed of Al2O3 and having a thickness of approximately 20 nm is formed on the side surfaces of the conductive oxygen barrier layer to prevent the diffusion of oxygen into the contact plug from the sides, such as from the sides of the lower layer of the conductive barrier layer.
    • 导电氧阻隔层形成在层间电介质膜上并被图案化,使得其与接触插塞的顶表面接触以防止氧气从上方扩散到接触塞中。 导电氧阻隔层由包含诸如TiAlN的导电氮化物的下层和包含诸如IrO 2的导电氧化物的上层组成。 在导电氧阻隔层的侧表面上形成厚度约为20nm的由Al 2 O 3 3 N 2构成的绝缘性氧阻隔层,以防止扩散 氧从侧面进入接触塞,例如从导电阻挡层的下层的侧面。
    • 9. 发明授权
    • Capacitance element and method of manufacturing the same
    • 电容元件及其制造方法
    • US06818498B2
    • 2004-11-16
    • US10391617
    • 2003-03-20
    • Takumi MikawaYuji JudaiYoshihisa Nagano
    • Takumi MikawaYuji JudaiYoshihisa Nagano
    • H01L218242
    • H01L28/55H01L28/60Y10S438/957
    • On a substrate, there are provided a lower electrode, a capacitance insulating film, a passivation insulating film, and a first partial film of an upper electrode to be filled in a second aperture (capacitance determining aperture) formed in the passivation insulating film. The lower electrode, the capacitance insulating film, and the first partial film constitute a capacitance element. The upper electrode has the first partial film which is in contact with the capacitance insulating film and a second partial film which is not in contact with the capacitance insulating film. Since a second electrode wire consisting of a lower-layer film composed of titanium and an upper-layer film composed of an aluminum alloy film is in contact with the second partial film distinct from the first partial film of the upper electrode, titanium or the like encroaching from the second electrode wire can be prevented from diffusing into the capacitance insulating film.
    • 在基板上,设置有被填充在形成在钝化绝缘膜中的第二孔(电容确定孔)中的下电极,电容绝缘膜,钝化绝缘膜和上电极的第一部分膜。 下电极,电容绝缘膜和第一部分膜构成电容元件。 上电极具有与电容绝缘膜接触的第一部分膜和不与电容绝缘膜接触的第二部分膜。 由于由钛构成的下层膜和由铝合金膜构成的上层膜构成的第2电极线与上部电极的第1部分膜不同的第2部分膜接触,钛等 可以防止从第二电极线的侵入扩散到电容绝缘膜。