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    • 1. 发明授权
    • Method and apparatus of forming thin films
    • 形成薄膜的方法和装置
    • US5755888A
    • 1998-05-26
    • US518267
    • 1995-08-23
    • Hideo ToriiEiji FujiiShigenori HayashiRyoichi Takayama
    • Hideo ToriiEiji FujiiShigenori HayashiRyoichi Takayama
    • C23C14/00C23C14/56C23C16/44C23C16/54C30B25/14H01L21/203H01L21/205H01L21/285C23C16/00
    • C23C14/568C23C16/4412C23C16/54C30B25/14
    • An apparatus of forming thin films, which is small and requires a short thin-film formation time, is provided which comprises at least one physical vapor deposition device and at least one chemical vapor deposition device, wherein said physical vapor deposition device and said chemical vapor deposition device are provided with an exhaust pipe respectively for connection with a common exhaust means and an exhaust switching means. A method of forming thin films using this apparatus is also provided. According to the configuration in which the exhaust switching means is connected via exhaust pipes to the physical vapor deposition device, to the chemical vapor deposition device, and to the exhaust means, this apparatus can be accomplished in a small size which has at least two chambers and one exhaust means. In this way, thin films can be formed in a short thin-film formation time with a small apparatus, since vapor of a starting material which is led in at the time of chemical vapor deposition does not enter the physical vapor deposition device.
    • 提供一种形成薄膜并需要短的薄膜形成时间的装置,其包括至少一个物理气相沉积装置和至少一个化学气相沉积装置,其中所述物理气相沉积装置和所述化学气相 沉积装置设置有分别用于与公共排气装置和排气开关装置连接的排气管。 还提供了使用该装置形成薄膜的方法。 根据其中排气切换装置经由排气管连接到物理气相沉积装置,化学气相沉积装置和排气装置的结构,该装置可以实现为具有至少两个室的小尺寸 和一个排气装置。 这样,由于在化学气相沉积时引入的原料的蒸气不会进入物理气相沉积装置,因此可以用小的装置在短的薄膜形成时间内形成薄膜。
    • 3. 发明授权
    • Thin film sensor element and method of manufacturing the same
    • 薄膜传感器元件及其制造方法
    • US5612536A
    • 1997-03-18
    • US374989
    • 1995-01-19
    • Hideo ToriiTakeshi KamadaShigenori HayashiRyoichi TakayamaTakashi HiraoMasumi Hattori
    • Hideo ToriiTakeshi KamadaShigenori HayashiRyoichi TakayamaTakashi HiraoMasumi Hattori
    • G01P15/08G01P15/09H01L41/29G01J5/10
    • G01P15/0922G01P15/0802H01L41/0478H01L41/0815H01L41/313Y10T29/42Y10T29/4981
    • A thin film sensor element includes a sensor holding substrate having an opening part and a multilayer film adhered thereon at least consisting of an electrode film A, an electrode film B having (100) plane orientation, and a piezoelectic dielectric oxide film present between the electrode film A and the electrode film B. As a result, a thin film sensor element which is small, light, highly accurate, and inexpensive can be attained which can be used for an acceleration sensor element and a pyroelectric infrared sensor element. On the surface of a flat plate KBr substrate, a rock-salt crystal structure oxide of a conductive NiO is formed by a plasma MOCVD method whose vertical direction is crystal-oriented to direction against the substrate surface. By means of a sputtering method, a PZT film is formed by an epitaxial growth on that surface, and a Ni-Cr electrode film is formed thereon. Next, the multilayer film structure is reversed and adhered to a sensor substrate having an opening part with an adhesive. After a connection electrode is connected, the whole structure is washed with water, thereby removing the KBr substrate.
    • 薄膜传感器元件包括:具有开口部的传感器保持基板和附着在其上的多层膜,至少由电极膜A,具有(100)面取向的电极膜B和存在于电极之间的压电电介质氧化膜 膜A和电极膜B.结果,可以获得可用于加速度传感器元件和热电型红外线传感器元件的小,轻,高精度和便宜的薄膜传感器元件。 在平板KBr基板的表面上,通过等离子体MOCVD方法形成导电NiO的岩盐晶体结构氧化物,其垂直方向相对于衬底表面<100>晶体取向。 通过溅射法,在该表面上通过外延生长形成PZT膜,在其上形成Ni-Cr电极膜。 接下来,将多层膜结构反转并粘接到具有开口部的粘合剂的传感器基板。 连接电极连接后,整个结构用水清洗,从而除去KBr基板。
    • 7. 发明授权
    • Chemical vapor deposition process for producing oxide thin films
    • 用于生产氧化物薄膜的化学气相沉积工艺
    • US5712001A
    • 1998-01-27
    • US619076
    • 1996-03-20
    • Eiji FujiiAtsushi TomozawaHideo ToriiRyoichi Takayama
    • Eiji FujiiAtsushi TomozawaHideo ToriiRyoichi Takayama
    • C30B25/10C23C16/40C23C16/455C23C16/50C23C16/509C30B25/16B05D3/06
    • C23C16/45561C23C16/406C23C16/455C23C16/5096
    • The present invention relates to a process for producing crystallographic oriented oxide thin films having an NaCl-type structure, a spinel structure or a Wurtzite structure used as a buffer layer to obtain a functional oxide thin film such as a superconductive oxide thin film and a ferroelectric thin film, and a chemical vapor deposition apparatus used therefor. A rotatable substrate holder is provided in a reaction chamber. The substrate holder, which holds substrates thereunder, includes a substrate heater. The substrate holder is grounded to provide an electrode. Another electrode, which is connected to a high frequency power source, is located opposing the substrate holder in the reaction chamber. At a side wall of the reaction chamber, an exhaust is arranged. In a plasma electric discharge area formed between the substrate holder and the electrode, a material gas supplier is located, having a predetermined tilt angle .theta. with respect to the substrate holder.
    • 本发明涉及一种制备具有NaCl型结构,尖晶石结构或纤锌矿结构的晶体取向氧化物薄膜的方法,该结构用作缓冲层以获得诸如超导氧化物薄膜和铁电体之类的功能氧化物薄膜 薄膜和用于其的化学气相沉积设备。 可旋转的基板保持器设置在反应室中。 保持基板的基板支架包括基板加热器。 衬底保持器接地以提供电极。 连接到高频电源的另一个电极与反应室中的衬底保持器相对定位。 在反应室的侧壁处布置排气。 在形成在基板支架和电极之间的等离子体放电区域中,相对于基板支架具有预定的倾斜角度θ的材料气体供应器。
    • 10. 发明授权
    • Thin film thermistor element and method for the fabrication of thin film thermistor element
    • 薄膜热敏电阻元件及制造薄膜热敏电阻元件的方法
    • US06475604B1
    • 2002-11-05
    • US09584768
    • 2000-06-01
    • Eiji FujiiAtsushi TomozawaHideo ToriiRyoichi Takayama
    • Eiji FujiiAtsushi TomozawaHideo ToriiRyoichi Takayama
    • H01C700
    • H01C17/12H01C7/023Y10T428/24917
    • A thin film thermistor element 10 is formed by forming on a backing substrate 11 of alumina a thermistor thin film 12 and a pair of comb electrodes 13 and 14 formed of a thin film of Pt. The thermistor thin film 12, which is formed of, for example, complex oxide of Mn—Co—Ni, has either a spinel type crystal structure which is priority oriented or oriented mainly in a (100) surface or a bixbite type crystal structure which is priority oriented in a (100) or (111) surface. Alternatively, the thermistor thin film is formed of LaCoO3 and has a rhombohedral bixbite type crystal structure. This makes it possible to hold the variation in resistance value low thereby to achieve high accuracy, and the deterioration with time can be held low and the high temperature durability can be improved, for the achievement of high reliability.
    • 通过在氧化铝的背衬基板11上形成热敏电阻薄膜12和由Pt的薄膜形成的一对梳状电极13和14来形成薄膜热敏电阻元件10。 由例如Mn-Co-Ni的复合氧化物形成的热敏电阻薄膜12具有尖晶石型晶体结构,其优先取向或主要在(100)表面取向或双键型晶体结构中,其中, 在(100)或(111)表面优先考虑。 或者,热敏电阻薄膜由LaCoO 3形成,并且具有菱形双峰型晶体结构。 这使得可以将电阻值的变化保持为低,从而实现高精度,并且,为了实现高可靠性,能够将劣化随时间变低,提高耐高温性。