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41. 发明申请

US20160293484A1 METHODS OF FORMING WIRING STRUCTURES 有权
标题翻译：形成接线结构的方法
公开(公告)号：US20160293484A1
公开(公告)日：2016-10-06
申请号：US15000302
申请日：2016-01-19
申请人： Jong-Jin Lee , Rak-Hwan Kim , Byung-Hee Kim , Jin-Nam Kim , Tsukasa Matsuda , Wan-Soo Park , Nae-In Lee , Jae-Won Chang , Eun-Ji Jung , Jeong-Ok Cha , Jae-Won Hwang , Jung-Ha Hwang
发明人： Jong-Jin Lee , Rak-Hwan Kim , Byung-Hee Kim , Jin-Nam Kim , Tsukasa Matsuda , Wan-Soo Park , Nae-In Lee , Jae-Won Chang , Eun-Ji Jung , Jeong-Ok Cha , Jae-Won Hwang , Jung-Ha Hwang
IPC分类号： H01L21/768
CPC分类号： H01L21/76882 , H01L21/76807 , H01L21/76843 , H01L21/76864 , H01L21/76877 , H01L23/522 , H01L23/5226 , H01L23/5283 , H01L23/53238
摘要： In a method of forming a wiring structure, a lower structure is formed on a substrate. An insulating interlayer is formed on the lower structure. The insulating interlayer is partially removed to form at least one via hole and a dummy via hole. An upper portion of the insulating interlayer is partially removed to form a trench connecting the via hole and the dummy via hole. A first metal layer filling the via hole and the dummy via hole is formed. A second metal layer filling the trench is formed on the first metal layer.
摘要翻译：在形成布线结构的方法中，在基板上形成下部结构。在下部结构上形成绝缘中间层。部分去除绝缘中间层以形成至少一个通孔和虚拟通孔。绝缘中间层的上部被部分地去除以形成连接通孔和虚拟通孔的沟槽。形成填充通孔和虚拟通孔的第一金属层。填充沟槽的第二金属层形成在第一金属层上。

42. 发明申请

US20160276267A1 METHODS OF FORMING WIRING STRUCTURES IN A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：在半导体器件中形成接线结构的方法
公开(公告)号：US20160276267A1
公开(公告)日：2016-09-22
申请号：US15018484
申请日：2016-02-08
申请人： Jong-Jin Lee , Rak-Hwan Kim , Byung-Hee Kim , Jin-Nam Kim , Tsukasa Matsuda , Nae-In Lee , Jeong-Ok Cha , Jung-Ha Hwang
发明人： Jong-Jin Lee , Rak-Hwan Kim , Byung-Hee Kim , Jin-Nam Kim , Tsukasa Matsuda , Nae-In Lee , Jeong-Ok Cha , Jung-Ha Hwang
IPC分类号： H01L23/522 , H01L21/285 , H01L23/532 , H01L21/768
CPC分类号： H01L23/5226 , H01L21/28556 , H01L21/76843 , H01L21/76862 , H01L21/76864 , H01L21/76873 , H01L21/76877 , H01L21/76897 , H01L23/53238
摘要： Methods of forming wiring structures and methods of manufacturing semiconductor devices include forming a lower structure on a substrate, forming an interlayer insulating film including an opening on the lower structure, forming a liner film on an inner surface of the opening, treating a surface of the liner film by an ion bombardment, and forming a first conductive film on the liner film. The first conductive film is formed to be at least partially filled in the opening through a reflow process. Related wiring structures and semiconductor devices are also discussed.
摘要翻译：形成布线结构的方法和制造半导体器件的方法包括在基板上形成下部结构，在下部结构上形成包括开口的层间绝缘膜，在开口的内表面上形成衬垫膜，通过离子轰击形成衬垫膜，并在衬垫膜上形成第一导电膜。第一导电膜通过回流工艺形成为至少部分地填充在开口中。还讨论了相关的布线结构和半导体器件。

43. 发明授权

US07915817B2 Double-sided light emitting device 有权
标题翻译：双面发光装置
公开(公告)号：US07915817B2
公开(公告)日：2011-03-29
申请号：US12349805
申请日：2009-01-07
申请人： Jin-Woo Park , Ho-Kyoon Chung , Sun-Hwa Kim , Byung-Hee Kim
发明人： Jin-Woo Park , Ho-Kyoon Chung , Sun-Hwa Kim , Byung-Hee Kim
IPC分类号： H01J1/62
CPC分类号： H01L51/5281 , H01L2251/5323
摘要： A double-sided light emitting device including lower and upper substrates, an emission element formed between an inner surface of the upper substrate and an inner surface of the lower substrate and emitting predetermined light, an upper layer of polarizing material disposed on at least one of inner and outer surfaces of the upper substrate, and a lower layer of polarizing material disposed on at least one of inner and outer surfaces of the lower substrate.
摘要翻译：一种双面发光装置，包括下基板和上基板，发射元件形成在上基板的内表面和下基板的内表面之间并发射预定的光，偏振材料的上层设置在至少一个上基板的内表面和外表面，以及设置在下基板的内表面和外表面中的至少一个上的偏振材料的下层。

44. 发明授权

US07876042B2 Double-sided light emitting device 有权
公开(公告)号：US07876042B2
公开(公告)日：2011-01-25
申请号：US12349793
申请日：2009-01-07
申请人： Jin-Woo Park , Ho-Kyoon Chung , Sun-Hwa Kim , Byung-Hee Kim
发明人： Jin-Woo Park , Ho-Kyoon Chung , Sun-Hwa Kim , Byung-Hee Kim
IPC分类号： H01J1/62
CPC分类号： H01L51/5281 , H01L2251/5323
摘要： A double-sided light emitting device including lower and upper substrates, an emission element formed between an inner surface of the upper substrate and an inner surface of the lower substrate and emitting predetermined light, an upper layer of polarizing material disposed on at least one of inner and outer surfaces of the upper substrate, and a lower layer of polarizing material disposed on at least one of inner and outer surfaces of the lower substrate.

45. 发明授权

US07749840B2 Methods of forming a semiconductor device including buried bit line 有权
标题翻译：形成包括掩埋位线的半导体器件的方法
公开(公告)号：US07749840B2
公开(公告)日：2010-07-06
申请号：US11757906
申请日：2007-06-04
申请人： Jong-Ho Yun , Byung-Hee Kim , Dae-Yong Kim , Hyun-Su Kim , Eun-Ji Jung , Eun-Ok Lee
发明人： Jong-Ho Yun , Byung-Hee Kim , Dae-Yong Kim , Hyun-Su Kim , Eun-Ji Jung , Eun-Ok Lee
IPC分类号： H01L21/336 , H01L21/425 , H01L21/44
CPC分类号： H01L27/10885 , H01L27/10876
摘要： A method of forming a buried interconnection includes removing a semiconductor substrate to form a groove in the semiconductor substrate. A metal layer is formed on inner walls of the groove using an electroless deposition technique. A silicidation process is applied to the substrate having the metal layer, thereby forming a metal silicide layer on the inner walls of the groove.
摘要翻译：形成掩埋布线的方法包括去除半导体衬底以在半导体衬底中形成凹槽。使用无电沉积技术在凹槽的内壁上形成金属层。对具有金属层的基板进行硅化处理，从而在槽的内壁上形成金属硅化物层。

46. 发明申请

US20070295995A1 METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING BURIED BIT LINES 有权
标题翻译：形成包含BINIIT位线的半导体器件的方法
公开(公告)号：US20070295995A1
公开(公告)日：2007-12-27
申请号：US11757906
申请日：2007-06-04
申请人： Jong-Ho Yun , Byung-Hee Kim , Dae-Yong Kim , Hyun-Su Kim , Eun-Ji Jung , Eun-Ok Lee
发明人： Jong-Ho Yun , Byung-Hee Kim , Dae-Yong Kim , Hyun-Su Kim , Eun-Ji Jung , Eun-Ok Lee
IPC分类号： H01L27/10 , H01L21/44
CPC分类号： H01L27/10885 , H01L27/10876
摘要： A method of forming a buried interconnection includes removing a semiconductor substrate to form a groove in the semiconductor substrate. A metal layer is formed on inner walls of the groove using an electroless deposition technique. A silicidation process is applied to the substrate having the metal layer, thereby forming a metal silicide layer on the inner walls of the groove.
摘要翻译：形成掩埋布线的方法包括去除半导体衬底以在半导体衬底中形成凹槽。使用无电沉积技术在凹槽的内壁上形成金属层。对具有金属层的基板进行硅化处理，从而在槽的内壁上形成金属硅化物层。

47. 发明申请

US20070284760A1 Chip and flat panel display apparatus comprising the same 审中-公开
标题翻译：芯片和平板显示装置
公开(公告)号：US20070284760A1
公开(公告)日：2007-12-13
申请号：US11784309
申请日：2007-04-06
申请人： Eun-Ah Kim , Byung-Hee Kim
发明人： Eun-Ah Kim , Byung-Hee Kim
IPC分类号： H01L23/29
CPC分类号： H01L24/10 , H01L21/56 , H01L23/3157 , H01L23/49811 , H01L24/13 , H01L24/83 , H01L27/3246 , H01L2224/0401 , H01L2224/0603 , H01L2224/06102 , H01L2224/13 , H01L2224/13099 , H01L2224/1403 , H01L2224/2929 , H01L2224/293 , H01L2224/2939 , H01L2224/2989 , H01L2224/83851 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A chip electrically connected to wires on a substrate without errors and a flat panel display apparatus including the chip is provided. The chip includes a plurality of bumps that protrude from the chip and have different heights. The flat panel display apparatus may include pads with variable heights on the top of wires of the apparatus.
摘要翻译：提供一种与基板上的导线电连接而没有错误的芯片和包括芯片的平板显示装置。芯片包括从芯片突出并具有不同高度的多个凸块。平板显示装置可以包括在设备的线的顶部具有可变高度的焊盘。

48. 发明授权

US06981772B2 Apparatus to align panels in projector 失效
标题翻译：投影机对准面板的装置
公开(公告)号：US06981772B2
公开(公告)日：2006-01-03
申请号：US10415363
申请日：2001-10-30
申请人： Byung-Hee Kim
发明人： Byung-Hee Kim
IPC分类号： G03B21/28 , G03B21/00 , G03B21/22 , G02F1/1335 , G02F1/1333
CPC分类号： H04N9/3141 , G02B7/00 , G03B21/145 , H04N9/3105
摘要： An apparatus is provided which maintains alignment of panels in a projector. The apparatus includes a synthesizing system holding device positioned at an upper portion of a synthesizing system of the projector which securely supports the synthesizing system and maintains a relative position of various components of the synthesizing system, even in the event of an external force or vibration applied to the projector. This apparatus can prevent deviation or misalignment between at least two or more prisms and panels in the synthesizing system of the projector, thereby improving reliability and durability of the projector and enhancing image quality.
摘要翻译：提供了一种保持投影仪中面板对准的装置。该装置包括位于投影仪的合成系统的上部的合成系统保持装置，即使在施加外力或振动的情况下，也可以稳固地支撑合成系统并保持合成系统的各种部件的相对位置投影机。该装置可以防止投影仪的合成系统中的至少两个或更多个棱镜和面板之间的偏移或不对准，从而提高投影机的可靠性和耐用性并提高图像质量。

49. 发明申请

US20050236979A1 Organic electroluminescence display device 有权
标题翻译：有机电致发光显示装置
公开(公告)号：US20050236979A1
公开(公告)日：2005-10-27
申请号：US11115329
申请日：2005-04-27
申请人： Won-Kyu Kwak , Byung-Hee Kim
发明人： Won-Kyu Kwak , Byung-Hee Kim
IPC分类号： H05B33/22 , H01L27/32 , H05B33/00
CPC分类号： H01L27/3246 , H01L27/3258 , H01L27/326
摘要： An organic electroluminescence display device comprising a wiring region, including a switching thin film transistor and a driving thin film transistor, and an emission region for emitting light. Light emitted from an organic thin film layer is emitted through the wiring region and the emission region.
摘要翻译：一种包括具有开关薄膜晶体管和驱动薄膜晶体管的布线区域和用于发光的发射区域的有机电致发光显示装置。从有机薄膜层发射的光通过布线区域和发射区域发射。

50. 发明授权

US06204902B1 Flexible plate liquid crystal display device 失效
标题翻译：柔性板液晶显示装置
公开(公告)号：US06204902B1
公开(公告)日：2001-03-20
申请号：US09225154
申请日：1999-01-04
申请人： Sun-Hwa Kim , Byung-Hee Kim , Seung-Gon Kang , Young-Il Choi
发明人： Sun-Hwa Kim , Byung-Hee Kim , Seung-Gon Kang , Young-Il Choi
IPC分类号： G02F11335
CPC分类号： G02F1/133305 , G02F1/133504 , G02F1/133553 , G02F1/13363 , G02F2001/133635
摘要： A flexible LCD device includes first and second substrates spaced away from each other in a parallel relationship. An electrode, an insulating layer, and an orientation layer are deposited on each substrate in order. A liquid crystal layer is formed between the first and second substrates. At least one of the first and second substrates is made of at least a sheet of retardation film or at least a sheet of diffuser film.
摘要翻译：柔性LCD装置包括以平行关系彼此间隔开的第一和第二基板。依次在每个基板上沉积电极，绝缘层和取向层。在第一和第二基板之间形成液晶层。第一和第二基板中的至少一个由至少一片延迟膜或至少一片扩散膜制成。

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