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    • 46. 发明授权
    • Deliberate semiconductor film variation to compensate for radial processing differences, determine optimal device characteristics, or produce small productions runs
    • 有意识的半导体薄膜变化来补偿径向处理差异,确定最佳设备特性,或产生小的生产运行
    • US06716647B2
    • 2004-04-06
    • US10013086
    • 2001-12-07
    • Toshiharu FurukawaMark C. HakeySteven J. HolmesDavid C. Horak
    • Toshiharu FurukawaMark C. HakeySteven J. HolmesDavid C. Horak
    • H01L2126
    • H01L22/20C23C16/04C23C16/513C23C16/52H01L21/31053H01L21/31116H01L21/32137H01L21/76229H01L21/8234Y10S438/911
    • Methods and apparatuses are disclosed that can introduce deliberate semiconductor film variation during semiconductor manufacturing to compensate for radial processing differences, to determine optimal device characteristics, or produce small production runs. The present invention radially varies the thickness and/or composition of a semiconductor film to compensate for a known radial variation in the semiconductor film that is caused by performing a subsequent semiconductor processing step on the semiconductor film. Additionally, methods and apparatuses are disclosed that can introduce deliberate semiconductor film variations to determine optimal device characteristics or produce small production runs. Introducing semiconductor film variations, such as thickness variations and/or composition variations, allow different devices to be made. A number of devices may be made having variations in semiconductor film. Because the semiconductor film has variations between the devices, device characteristics of the devices should be different. By measuring the device characteristics of devices having the variations, the device with the optimum device characteristic may be chosen, thereby indicating the appropriate semiconductor film thickness and/or composition. Moreover, small production runs of the same devices, having different characteristics, will allow the end user to select the appropriate devices for their needs.
    • 公开了可以在半导体制造期间引入有意的半导体膜变化以补偿径向处理差异,确定最佳器件特性或产生小的生产运行的方法和装置。 本发明径向地改变半导体膜的厚度和/或组成,以补偿半导体膜中已知的半导体膜的径向变化,这是通过在半导体膜上进行随后的半导体处理步骤引起的。另外,公开了可以 引入有意识的半导体薄膜变化以确定最佳的器件特性或产生小的生产运行。 引入半导体薄膜变化,例如厚度变化和/或组成变化,允许制造不同的装置。 可以制造多个器件,其具有半导体膜的变化。 因为半导体薄膜在器件之间有变化,所以器件的器件特性应该是不同的。 通过测量具有变化的器件的器件特性,可以选择具有最佳器件特性的器件,从而指示适当的半导体膜厚度和/或组成。 此外,相同设备的小生产运行具有不同的特性,将允许最终用户根据需要选择适当的设备。
    • 49. 发明授权
    • Methods of T-gate fabrication using a hybrid resist
    • 使用混合抗蚀剂的T型栅极制造方法
    • US06387783B1
    • 2002-05-14
    • US09299267
    • 1999-04-26
    • Toshiharu FurukawaMark C. HakeySteven J. HolmesDavid V. HorakPaul A. Rabidoux
    • Toshiharu FurukawaMark C. HakeySteven J. HolmesDavid V. HorakPaul A. Rabidoux
    • H01L2128
    • H01L29/42316H01L21/28581
    • Methods for forming a T-gate on a substrate are provided that employ a hybrid resist. The hybrid resist specifically is employed to define a base of the T-gate on the substrate with very high resolution. To define a base of the T-gate, a hybrid resist layer is deposited on the substrate. A mask having a reticle feature with an edge is provided and is positioned above the hybrid resist layer so that the edge of the reticle feature is above a desired location for the base of the T-gate. Thereafter, the hybrid resist layer is exposed to radiation through the mask, and the exposed hybrid resist layer is developed to define an opening therein for the base of the T-gate. Preferably the loop feature formed in the hybrid resist layer by the reticle feature during exposure is trimmed. The T-gate may be completed by employing any known T-gate fabrication techniques.
    • 提供了在衬底上形成T形栅的方法,其采用混合抗蚀剂。 采用混合抗蚀剂专门用于以非常高的分辨率在衬底上限定T形栅极的基极。 为了限定T栅极的基极,在衬底上沉积混合抗蚀剂层。 提供了具有边缘的掩模版特征的掩模,并且位于混合抗蚀剂层之上,使得掩模版特征的边缘高于用于T形栅极的基底的期望位置。 此后,混合抗蚀剂层通过掩模暴露于辐射,并且暴露的混合抗蚀剂层被显影以在T形栅极的底部限定开口。 优选地,在曝光期间通过掩模版特征在混合抗蚀剂层中形成的环形特征被修整。 T栅极可以通过采用任何已知的T栅极制造技术来完成。
    • 50. 发明授权
    • Hybrid resist based on photo acid/photo base blending
    • 基于光酸/光碱混合的混合抗蚀剂
    • US06338934B1
    • 2002-01-15
    • US09383452
    • 1999-08-26
    • Kuang-Jung R. ChenMark C. HakeySteven J. HolmesWu-Song HuangPaul A. Rabidoux
    • Kuang-Jung R. ChenMark C. HakeySteven J. HolmesWu-Song HuangPaul A. Rabidoux
    • G03F7004
    • G03F7/0045G03F7/095Y10S430/115Y10S430/12
    • A photo resist composition contains a polymer resin, a first photo acid generator (PAG) requiring a first dose of actinic energy to generate a first photo acid, and a photo base generator (PBG) requiring a second dose of actinic energy, different from the first dose, to generate a photo base. The amounts and types of components in the photo resist are selected to produce a hybrid resist image. Either the first photo acid or photo base acts as a catalyst for a chemical transformation in the resist to induce a solubility change. The other compound is formulated in material type and loading in the resist such that it acts as a quenching agent. The catalyst is formed at low doses to induce the solubility change and the quenching agent is formed at higher doses to counterbalance the presence of the catalyst. Accordingly, the same frequency doubling effect of conventional hybrid resist compositions may be obtained, however, either a line or a space may be formed at the edge of an aerial image. Feature size may also be influenced by incorporating a quenching agent into the resist composition that does not require photo generation.
    • 光致抗蚀剂组合物包含聚合物树脂,需要第一剂量的光化能以产生第一光酸的第一光酸产生剂(PAG)和需要第二剂量的光化能的光生碱剂(PBG),其不同于 第一剂量,以产生照相。 选择光抗蚀剂中组分的量和类型以产生混合抗蚀剂图像。 第一光酸或光碱作为抗蚀剂中化学转化的催化剂,以引起溶解度变化。 将另一种化合物配制成材料类型并加载到抗蚀剂中,使其用作淬火剂。 催化剂以低剂量形成以诱导溶解度变化,并且以较高剂量形成猝灭剂以平衡催化剂的存在。 因此,可以获得常规混合抗蚀剂组合物的相同的倍频效果,然而,可以在空间图像的边缘处形成线或空间。 通过将不需要光生成的抗蚀剂组合物中的淬火剂并入也可能影响特征尺寸。