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41. 发明专利

JPS5910286A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS5910286A
公开(公告)日：1984-01-19
申请号：JP11857082
申请日：1982-07-09
申请人： Hitachi Ltd
发明人： HATORI KAZUO , YASUDA YOUICHI
IPC分类号： H01L23/00 , H01L33/62
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2224/4823 , H01L2924/00014
摘要： PURPOSE:To enable to easily discriminate the lead polarity at the time of assembling products and after the assembly by a method wherein indices composed of a projection or a recess are provided respectively on the main and back surfces of a stem. CONSTITUTION:The index 23 composed of the projection 22 is provided on the main surface whereon a light emitting element 3 is fixed via the sub mount 2 of the stem 1, and the index 25 composed of the recess 24 on the back surface. The projection 22 and the recess 24 are provided on a line which makes an acute angle of theta between a line combining a pair of leads 5. The recognition of the projection 22 or the recess 24 makes it clear that the adjacent lead 5 is an anode lead, and that the distant lead 5 is a cathode lead. Thus, the projection 22 serves as the index 23 at the time of assembling products, and the recess 24 the index 25 for lead polarity recognition at the time of assembling products and in a finished product.
摘要翻译：目的：为了能够容易地区分在产品组装时和组装之后的引线极性，其中由突起或凹部组成的折射分别设置在杆的主背面和背面上。构成：由突起22构成的折射率23设置在发光元件3经由杆1的副安装座2固定的主面上，由背面上的凹部24构成的折射率25。突起22和凹部24设置在在组合一对引线5的线之间形成锐角θ的线上。突起22或凹部24的识别清楚，相邻引线5是阳极并且远距离的引线5是阴极引线。因此，在组装产品时，突起22用作索引23，并且凹部24在组装产品时用于铅极性识别的索引25和成品中。

42. 发明专利

JPS57122548A Stem 失效
标题翻译：干
公开(公告)号：JPS57122548A
公开(公告)日：1982-07-30
申请号：JP795881
申请日：1981-01-23
申请人： Hitachi Ltd
发明人： HATORI KAZUO , ENOMOTO USUKE
IPC分类号： H01L23/12 , H01L23/492
CPC分类号： H01L23/4924 , H01L2924/0002 , H01L2924/00
摘要： PURPOSE:To stabilize the characteristics of a stem by plating Ni on the surface of a flange made of iron series metal formed with an engaging hole for a heat sink and engaging fixedly a copper heat sink having no plating film, thereby preventing the decrease of the heat sink property of the stem. CONSTITUTION:A flange 2 of approximately rhombic shape made of iron series metal formed with mounting holes for a heat sink 4 and a lead 6 and coated with an Ni-plating layer 1 is used for the stem of a can sealing apparatus. The copper heat sink 4 is engaged with the hole plated with Ni on the inner surface and is caulked. Then, the lead 6 is inserted through glass bead into the mounting hole, is the heat treated, and is molten and secured to a glass layer 5. At this time the heat sink 4 is mutually diffused at the engaged part of the layer 1, and is rigidly hermetically joined. since the plating layer is not formed on the surface to be mounted with the heat sink 4, no void is produced in the pellet mounting part, thereby preventing the unstable decrease in the heat radiation and the characteristics.
摘要翻译：目的：为了通过在形成有用于散热器的接合孔的铁系金属制成的凸缘的表面上镀Ni来稳定杆的特性，并且固定地固定有不具有镀膜的铜散热器，从而防止了茎的散热性能。构成：在罐式密封装置的杆上使用由形成有散热器4的安装孔的铁系金属构成的大致菱形的凸缘2和涂有镀镍层1的引线6。铜散热器4与内表面上镀Ni的孔接合并且被铆接。然后，引线6通过玻璃珠插入安装孔中，进行热处理，熔融并固定在玻璃层5.此时，散热片4在层1的被接合部分相互扩散，并刚性地加密。由于在要安装在散热片4的表面上没有形成镀层，所以在颗粒安装部分中不会产生空隙，从而防止热辐射的不稳定的降低和特性。

43. 发明专利

JPS55166973A ASSEMBLING METHOD OF LIGHT EMITTING SEMICONDUCTOR DEVICE WITH OPTICAL FIBER 失效
公开(公告)号：JPS55166973A
公开(公告)日：1980-12-26
申请号：JP7465279
申请日：1979-06-15
申请人： HITACHI LTD
发明人： YASUDA YOUICHI , SAKAMOTO MAKOTO , HATORI KAZUO , ICHIKI MASAHIRO , UCHIYAMA ATSUSHI
IPC分类号： G02B6/42 , H01L33/48 , H01S5/00
摘要： PURPOSE:To improve the efficiency and yield of work for regulating the position of the optical fiber by mounting the optical fiber at the cylindrical fiber holder, rotating the fiber holder with respect to the supporting member, and axially moving it. CONSTITUTION:An optical fiber 5 is fixedly mounted on a cylindrical fiber holder 6 beforehand, a fiber retainer 7 at the supporting member assembled with a light emitting semiconductor element 1 is formed to have an inner diameter adapted for the fiber holder 6, the fiber holder 6 is inserted into the fiber retainer 7, the element 1 is operated, the fiber holder 6 is rotated while monitoring the fiber input at the other end of the optical fiber 5, and axially and longitudinally moved to fix the fiber output at the maximum position.

44. 发明专利

JPS5559408A PHOTOELECTRIC TRANSDUCER 失效
公开(公告)号：JPS5559408A
公开(公告)日：1980-05-02
申请号：JP13164278
申请日：1978-10-27
申请人： HITACHI LTD
发明人： ENOMOTO USUKE , HATORI KAZUO , MATSUMOTO HIROYUKI , OOTA MASAYA
IPC分类号： G02B7/00 , H01L31/02
摘要： PURPOSE:To readily and accurately perform optical axis alignment at the time of assembling light emitting elements by providing the portion of positioning lens optical axis and the photo detecting and light emitting part of an optical transducer to the flange built-in with the optical transducer. CONSTITUTION:The bottom of a flange 1 is protruded in circular form and with the outside circumference of this circular positioning part 8 as a guide, ring-welding of a cap 6 to the flange 1 is accomplished. Here, the stem is positioned by the positioning part 8 in the lower part of the flange 1 and therefore a light emitting pellet 2 is positioned to the central axis of the flange 1, thus it becomes simple and accurate to assemble the element pellet 2 by aligning its light emitting part to the optical axis of the lens system in which the element is to be assembled. Hence, the higher efficieny of assembling work may be achieved and the light emitting element display device of superior quality even glow may be obtained.

45. 发明专利

JP2001160610A MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND CONTROLLING METHOD OF LEAD FRAME FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001160610A
公开(公告)日：2001-06-12
申请号：JP34334399
申请日：1999-12-02
申请人： HITACHI LTD
发明人： ITO KAZUTOSHI , OHASHI TAKEYA , HATORI KAZUO
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To prevent a soldering failure from occurring between a lead frame of Cu or Cu alloy and a semiconductor element so as to improve a semiconductor device in yield. SOLUTION: In a method for manufacturing a semiconductor device in which a semiconductor element is soldered on the surface of a lead frame of Cu or Cu alloy, the thickness of an oxide film on the surface of the lead frame is measured before a soldering process, and when the oxide film is not as thick as required, the lead frame is heated in a reducing atmosphere so as to make an oxide film located on its surface as thick as required, and then a soldering operation is carried out when the oxide film gets as thick as required.

46. 发明专利

JP2000216171A PELLET BONDING METHOD AND APPARATUS, AND RESIN SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000216171A
公开(公告)日：2000-08-04
申请号：JP1395599
申请日：1999-01-22
申请人： HITACHI LTD
发明人： ITO KAZUTOSHI , OHASHI TAKEYA , HATORI KAZUO
IPC分类号： H01L21/52
摘要： PROBLEM TO BE SOLVED: To properly bond a semiconductor pellet and a lead frame substrate with use of solder. SOLUTION: In this method, prior to placement of a lead frame substrate in a pellet bonding stage 4, concentrations of H2 and O2 gases are measured in a forming gas within the pellet bonding stage 4. In this case, pellet bonding is carried out only when the H2 gas concentration is between 17 and 20% and the O2 gas concentration is 150 ppm or less. In the semiconductor device, a void rate in a solder joint part is set to be 3% or less.

47. 发明专利

JP2000031346A POWER SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000031346A
公开(公告)日：2000-01-28
申请号：JP19837698
申请日：1998-07-14
申请人： HITACHI LTD
发明人： ISHII TOSHIAKI , EGUCHI KUNIYUKI , MOGI AKIRA , ISHII SHIGERU , HATORI KAZUO , ARAI KATSUO , NAKAJO TAKUYA
IPC分类号： H01L23/29 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a power semiconductor device which provides a high connection reliability even at a temperature of 150 deg.C or above for a long time. SOLUTION: The essential components of an epoxy resin component 13 molding a semiconductor element and a part of a lead frame 2 are epoxy resin, setting agent, and inorganic filler, while, among the inorganic filler, at least one kind of zinc boric acid compound represented by 4ZnO.B2O3.H2O or 2ZnO.3B2O3.3.5H2O is blended by 1-10 wt.% relative to the epoxy resin component 13.

48. 发明专利

JPH11145363A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11145363A
公开(公告)日：1999-05-28
申请号：JP30392297
申请日：1997-11-06
申请人： HITACHI LTD
发明人： ITO KAZUTOSHI , OHASHI TAKEYA , HONDA TAKU , HATORI KAZUO
IPC分类号： H01L23/32 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To form a solder layer which bonds a pellet in uniform thickness and prevent irregularities of thermal fatigue inspection level by arranging a flowing-out preventing means for preventing the flowing-out of solder on the periphery of a surface, on which a semiconductor element on a lead frame board is fixed. SOLUTION: A protruding part 9 is arranged on the upper surface of a header part 2 of a lead frame 1, so as to surround the periphery of a region on which a pellet 3 is solder-bonded. This protruding part 9 prevents flowing-out of a fused solder in a pellet bonding process. The region on which the pellet is bonded is composed of a metal to which base metal can be soldered, and a region on which the pellet is not bonded is composed of a metal which does not have bonding property. A metallic layer which does not have bonding property with solder is arranged so as to surround the pellet. From such a constitution, position deviation of the pellet which is to be caused by solder flowing-out in the bonding process is excluded, and irregularities of thermal fatigue inspection level be can be also prevented.

49. 发明专利

JPH07169797A METHOD AND STRUCTURE FOR BONDING 失效
公开(公告)号：JPH07169797A
公开(公告)日：1995-07-04
申请号：JP31348993
申请日：1993-12-14
申请人： HITACHI LTD
发明人： KAJIWARA RYOICHI , TAKAHASHI TOSHIYUKI , KATO MITSUO , TAKAHASHI KAZUYA , HATORI KAZUO , YAMADA TOMIO , MARUTA MINORU
IPC分类号： H01L21/60 , H01L21/607
摘要： PURPOSE:To provide a bonding method which does not damage a terminal board and a metal wire at all in a bonding operation and which does not cause a bonding defect after the bonding operation. CONSTITUTION:In a bonding method, a bump 7 is compression-bonded to a connecting terminal 1 by using a bonding tool 5, the surface of the bump 7 is then flattened, and a metal wire 10 is expression-bonded to the bump 7 whose surface has been flattened. In the bonding method, the material of the bump 7 is selected from a material whose hardness is nearly equal to, or lower than, the hardness of the metal wire 10, and the bump 7 whose surface has been flattened is shaped in such a way that its diameter is larger than the diameter of the metal wire 10 and that its thickness is large. Then, the metal wire 10 is bonded in such a way that a bonding part is embedded in the flat surface of the bump 7 by an ultrasonic expression-bonding operation at room temperature.

50. 发明专利

JPH0431258A ELECTRONIC PART MOUNTING TAPE 失效
公开(公告)号：JPH0431258A
公开(公告)日：1992-02-03
申请号：JP13383590
申请日：1990-05-25
申请人： HITACHI LTD , AKITA DENSHI KK , HITACHI TOBU SEMICONDUCTOR LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： TAKAHASHI TOSHIHARU , NAGAMINE TORU , SHINTANI TOSHIYUKI , TANBA TSUTOMU , MUTO AKIRA , HATORI KAZUO , YAMADA TOMIO , HOSHI AKIRO
IPC分类号： B65D85/86 , B65D73/02 , B65D85/38 , H05K13/02
摘要： PURPOSE:To effectively receive parts per unit roll of tape so as to reduce packaging cost and improve efficiency in mounting electronic parts on a wiring board by arranging electronic part mounting positions in a number of rows on a tape. CONSTITUTION:Enbossings 3 for mounting electronic parts are arranged in a number of rows, the electronic parts 4 are received in these embossings 3 and a cover tape 5 is laid thereon to effect sealing thereof with adhesive agent, etc. Such tape is shipped in a condition of being wound on a reel, etc. When the electronic parts are received in the tape or removed therefrom for mounting on a wiring board, the mounting positions are moved by feed holes 2. Since the mounted electronic parts are arranged in a number of rows, the reception or mounting efficiency is improved in comparison with the parts in a single row.

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