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    • 31. 发明申请
    • Method and apparatus for detecting defects
    • 检测缺陷的方法和装置
    • US20070064225A1
    • 2007-03-22
    • US11602247
    • 2006-11-21
    • Yukihiro ShibataShunji Maeda
    • Yukihiro ShibataShunji Maeda
    • G01N21/88
    • G01N21/9501G01N21/21
    • A method and apparatus for detecting a defect in which image signals of a same area of a sample are obtained by imaging the sample under different optical conditions, and the obtained image signals are analyzed and optical conditions are selected which modify a contrast in the image signal. Image signals of the sample under the selected optical conditions are obtained by imaging the sample with an inspection system, and the images under the selected optical conditions are evaluated to adjust optical conditions for inspection including an inspection threshold, which is greater than a maximum contrast difference among false defects detected at the step of obtaining and with which a maximum number of actual defects can be detected. A defect of the sample is detected by processing the image signals of the sample obtained through the inspection system under the adjusted optical conditions.
    • 一种检测缺陷的方法和装置,其中通过在不同光学条件下对样本进行成像而获得样品的相同区域的图像信号,并且分析所获得的图像信号,并且选择修改图像信号中的对比度的光学条件 。 通过用检查系统对样品进行成像获得样品的图像信号,并且在所选择的光学条件下评估图像以调整检查的光学条件,包括大于最大对比差的检查阈值 在获取步骤中检测到的虚假缺陷中,可以检测到最大数量的实际缺陷。 通过在调整光学条件下处理通过检查系统获得的样品的图像信号来检测样品的缺陷。
    • 32. 发明申请
    • Method and apparatus for detecting defects
    • 检测缺陷的方法和装置
    • US20070058164A1
    • 2007-03-15
    • US11478617
    • 2006-07-03
    • Yukihiro ShibataShunji MaedaHidetoshi Nishiyama
    • Yukihiro ShibataShunji MaedaHidetoshi Nishiyama
    • G01N21/88
    • G01N21/95607G01N2021/8822
    • This invention provides a defect inspection method and apparatus that can easily and quickly determine, from among a plurality of inspection conditions, a condition that allows for an inspection with high sensitivity. The inspection apparatus has a variety of optical functions to cover a variety of kinds of defects to be inspected (shape, material, nearby pattern, etc.). For each optical function, grayscale depths of defects that the operator wants detected and of pseudo defects that he or she wants undetected are accumulated for future use, so that conditions conducive to a higher sensitivity and a lower pseudo defect detection rate can be selected efficiently. Conditions that can be selected for optical systems include a bright-field illumination, a dark-field illumination and a bright-/dark-field composite illumination, illumination wavelength bands, polarization filters and spatial filters.
    • 本发明提供一种能够从多个检查条件中容易且快速地确定能够以高灵敏度进行检查的条件的缺陷检查方法和装置。 检查装置具有各种光学功能,可以覆盖要检查的各种缺陷(形状,材料,附近图案等)。 对于每个光学功能,操作者想要检测到的缺陷的灰度深度和他或她想要未检测到的伪缺陷被累积以供将来使用,使得可以有效地选择有利于更高灵敏度和更低伪缺陷检测率的条件。 可以选择用于光学系统的条件包括亮场照明,暗场照明和亮/暗场复合照明,照明波长带,偏振滤光器和空间滤光器。
    • 33. 发明申请
    • Method and apparatus for inspecting pattern defects
    • 检查图案缺陷的方法和装置
    • US20060290930A1
    • 2006-12-28
    • US11434070
    • 2006-05-16
    • Hidetoshi NishiyamaYukihiro ShibataShunji MaedaSachio Uto
    • Hidetoshi NishiyamaYukihiro ShibataShunji MaedaSachio Uto
    • G01N21/00
    • G01N21/95623
    • The present invention relates to a pattern defect inspection apparatus, wherein light emitted from an illumination source capable of outputting a plurality of wavelengths is linearly illuminated by an illuminating optical system. Diffracted or scattered light due to a circuit pattern or defect on a wafer is collected by an imaging optical system onto a line sensor and converted into a digital signal, and the defect is detected by a signal processing section. Then, the defect can be detected with high sensitivity since a surface to be formed by an optical axis of the illuminating optical system and an optical axis of the imaging optical system is almost collimated to a direction of a wiring pattern and further since an angle to be formed by the optical axis of the imaging optical system and the wafer is set to an angle with less diffracted light from the pattern. Thereby, the pattern defect inspection detecting various defects on the wafer with high sensitivity at high speed can be achieved.
    • 本发明涉及一种图案缺陷检查装置,其中从能够输出多个波长的照明源发射的光线由照明光学系统线性地照亮。 由于晶片上的电路图案或缺陷导致的衍射或散射光被成像光学系统收集到线传感器上并转换成数字信号,并且由信号处理部分检测缺陷。 然后,由于要由照明光学系统的光轴和成像光学系统的光轴形成的表面几乎准直到布线图案的方向,因此可以以高灵敏度检测缺陷,并且进一步由于与 由成像光学系统的光轴形成,并且将晶片设置成与来自图案的较少衍射光的角度。 由此,可以实现以高速度高灵敏度地检测晶片上的各种缺陷的图案缺陷检查。
    • 34. 发明授权
    • Method and apparatus for detecting defects
    • 检测缺陷的方法和装置
    • US07142294B2
    • 2006-11-28
    • US10020977
    • 2001-12-19
    • Yukihiro ShibataShunji Maeda
    • Yukihiro ShibataShunji Maeda
    • G01N21/00G06K9/00
    • G01N21/9501G01N21/21
    • An image of a sample that has high contrast both in large and fine pattern parts is acquired by using an optical system for coaxial bright field epi-illumination, forming the optical image of the sample with various transmission ratio of 0-th order diffracted light that is reflected regularly from the sample, and capturing the image by an image sensor. Optical conditioning is automatically set and in a short time by detecting a plurality of optical images of the sample under various conditions for the transmission ratio of the 0-th order diffracted light, evaluating quality of the detected images, and determining the transmission ratio of the 0-th order diffracted light showing the maximum defect detection sensitivity.
    • 通过使用用于同轴的亮场表面照明的光学系统来获得具有大的和精细图案部分中的高对比度的样本的图像,以0级衍射光的各种传输比形成样品的光学图像, 从样本中经常反射,并通过图像传感器捕获图像。 通过在各种条件下检测出0级衍射光的透射率,评估检测图像的质量,并确定检测到的图像的透射率,自动设置光学调理并且在短时间内检测样品的多个光学图像 表示最大缺陷检测灵敏度的0级衍射光。
    • 40. 发明申请
    • DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS
    • 缺陷检查方法和缺陷检查装置
    • US20090059216A1
    • 2009-03-05
    • US12136799
    • 2008-06-11
    • Yukihiro ShibataShunji MaedaShuichi Chikamatsu
    • Yukihiro ShibataShunji MaedaShuichi Chikamatsu
    • G01N21/88
    • G01N21/956G01N2021/8822
    • A defect inspection apparatus comprises: a stage which scans a sample in a horizontal plane; an illumination optical system which illuminates light at an oblique angle with respect to a normal of a sample surface, and illuminates light in a linear form on the sample at an angle inclined to a direction perpendicular to the scanning direction of the stage; a front scattered light detection optical system which is disposed in the same orientation as the scanning direction, positioned at an elevation angle where a specular reflection light from a pattern parallel to the scanning direction is not spatially detected, and detects scattered light from a region illuminated in the linear form; an image sensor detecting an image formed by the front scattered light detection optical system; and an image processing unit performing a comparison operation of the image detected by the image sensor, thereby determining a defect candidate.
    • 缺陷检查装置包括:在水平面扫描样品的台阶; 照射光学系统,其以相对于样品表面的法线倾斜的角度照射光,并以垂直于所述载物台的扫描方向的方向以样品的线性方式照射样品上的光; 以与扫描方向相同的方向设置的前散射光检测光学系统,位于与扫描方向平行的图案的镜面反射光未被空间检测的仰角处,并且检测来自被照射的区域的散射光 呈线形; 检测由前散射光检测光学系统形成的图像的图像传感器; 以及图像处理单元,执行由图像传感器检测到的图像的比较操作,从而确定缺陷候选。