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    • 39. 发明申请
    • Semiconductor device having shallow B-doped region and its manufacture
    • 具有浅B掺杂区域的半导体器件及其制造
    • US20070232039A1
    • 2007-10-04
    • US11607927
    • 2006-12-04
    • Tomohiro KuboKenichi OkabeTomonari Yamamoto
    • Tomohiro KuboKenichi OkabeTomonari Yamamoto
    • H01L21/425
    • H01L21/823807H01L21/823814
    • A method for manufacturing a semiconductor device has the steps of: (a) implanting boron (B) ions into a semiconductor substrate; (b) implanting fluorine (F) or nitrogen (N) ions into the semiconductor device; (c) after the steps (a) and (b) are performed, executing first annealing with a heating time of 100 msec or shorter relative to a region of the semiconductor substrate into which ions were implanted; and (d) after the step (c) is performed, executing second annealing with a heating time longer than the heating time of the first annealing, relative to the region of the semiconductor substrate into which ions were implanted. The method for manufacturing a semiconductor device is provided which can dope boron (B) shallowly and at a high concentration.
    • 制造半导体器件的方法具有以下步骤:(a)将硼(B)离子注入到半导体衬底中; (b)将氟(F)或氮(N)离子注入到半导体器件中; (c)在执行步骤(a)和(b)之后,相对于其中注入离子的半导体衬底的区域,以100msec或更短的加热时间执行第一退火; 和(d)在执行步骤(c)之后,相对于其中注入离子的半导体衬底的区域,以比第一退火的加热时间长的加热时间执行第二退火。 提供半导体器件的制造方法,其能够以高浓度浓缩硼(B)。