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31. 发明专利

JP2005005331A Method and apparatus for inspection 有权
标题翻译：检查方法和装置
公开(公告)号：JP2005005331A
公开(公告)日：2005-01-06
申请号：JP2003164349
申请日：2003-06-09
申请人： Hisahiro Ito , Tadatomo Suga , Tokyo Electron Ltd , 寿浩伊藤 , 東京エレクトロン株式会社 , 唯知須賀
发明人： KOMATSU SHIGEKAZU , SUGA TADATOMO , ITO HISAHIRO , KATAOKA KENICHI
IPC分类号： G01R31/26 , G01R1/073 , G01R31/28 , H01L21/66
CPC分类号： G01R1/07357 , G01R31/2887
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for inspecting which can certainly conduct a Kelvin connection by forming a stable electric path between a probe and a device without damage or consumption and which can also certainly stably inspect without malfunction. SOLUTION: The method for inspecting includes a step of applying a voltage for fritting to a plurality of probe pairs 13 brought into contact with an electrode P of a device, and forming the electric path between the probes 13A, 13B of the plurality of the probe pairs 13 and the electrode P by utilizing a fritting phenomenon. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于检查的方法和装置，其可以通过在探针和装置之间形成稳定的电路而不损坏或消耗，并且也可以肯定地稳定地检查而无故障地进行开尔文连接。解决方案：检查方法包括向与装置的电极P接触的多个探针对13施加用于烧结的电压的步骤，并且在多个探针对13的探针13A，13B之间形成电通路的探针对13和电极P。版权所有（C）2005，JPO＆NCIPI

32. 发明专利

JP2014179421A Component jointing device 审中-公开
标题翻译：组件连接设备
公开(公告)号：JP2014179421A
公开(公告)日：2014-09-25
申请号：JP2013051681
申请日：2013-03-14
申请人： Alpha- Design Kk , アルファーデザイン株式会社 , Tadatomo Suga , 唯知須賀 , Masataka Mizukoshi , 正孝水越
发明人： SHIRATORI TOSHIYUKI , KAWASAKI KYO , SUGA TADATOMO , MIZUKOSHI MASATAKA
IPC分类号： H01L21/60
CPC分类号： H01L24/95 , H01L24/75 , H01L24/83
摘要： PROBLEM TO BE SOLVED: To miniaturize a device and improve productivity of the device while securing a good jointing state of an electrode terminal of an electronic component and an electrode of a substrate.SOLUTION: The component jointing device comprises: a base case 2 that has a first base 3 and a second base 4 that can be coupled with and separated from each other, and in which an arrangement space 7 for arranging a substrate 51 and plural electronic components 52 with different height inside while the first base is coupled with the second base is formed; oil 22 sealed in the arrangement space; an oil sealing material 19 sealing the oil in the arrangement space and deformed according to pressure of the oil; an oil hydraulic change part 14 for changing the pressure of the oil; and heaters 8, 24 for heating the base case 2. When the substrate and the plural electronic components are arranged in the arrangement space, heating is done and the plural electronic components are pressurized by the oil sealing material. Each electrode terminal 52a of the electronic component is pressed to each electrode 51a of each substrate, so that each electrode terminal is jointed to each electrode.
摘要翻译：要解决的问题：为了使装置小型化并提高装置的生产率，同时确保电子部件的电极端子和基板的电极的良好的接合状态。解决方案：部件接合装置包括：基部壳体2，其具有可以彼此耦合并分离的第一基座3和第二基座4，并且其中布置空间7用于布置基板51和具有不同高度的多个电子部件52，同时第一基座与第二基座基地形成; 油22密封在安排空间; 密封材料19，其密封所述布置空间中的油并根据油的压力而变形; 用于改变油压的油压变化部分14; 以及用于加热基底壳体2的加热器8,24。当基板和多个电子部件布置在布置空间中时，进行加热，并且多个电子部件被油封材料加压。电子部件的每个电极端子52a被按压到每个基板的每个电极51a，使得每个电极端子被连接到每个电极。

33. 发明专利

JP2014179419A Method for bonding electronic component 审中-公开
标题翻译：用于绑定电子元件的方法
公开(公告)号：JP2014179419A
公开(公告)日：2014-09-25
申请号：JP2013051679
申请日：2013-03-14
申请人： Alpha- Design Kk , アルファーデザイン株式会社 , Tadatomo Suga , 唯知須賀 , Masataka Mizukoshi , 正孝水越
发明人： SHIRATORI TOSHIYUKI , KAWASAKI KYO , SUGA TADATOMO , MIZUKOSHI MASATAKA
IPC分类号： H01L21/60 , H05K13/04
CPC分类号： H05K3/32 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/50 , H01L2224/29006 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29318 , H01L2224/2932 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32013 , H01L2224/75281 , H01L2224/75315 , H01L2224/75317 , H01L2224/7598 , H01L2224/83001 , H01L2224/83192 , H01L2224/83203 , H01L2224/83205 , H01L2224/83409 , H01L2224/83411 , H01L2224/83413 , H01L2224/83418 , H01L2224/8342 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8382 , H01L2224/8384 , H01L2924/12041 , H05K13/046 , H05K2203/0173 , H05K2203/0278 , H05K2203/1131 , H01L2924/00 , H01L2924/00014 , H01L2924/00015
摘要： PROBLEM TO BE SOLVED: To secure a good bonding state between an electronic component and an electrode terminal, to improve productivity, and to downsize a substrate.SOLUTION: A method for bonding an electronic component comprises steps of: applying a metal fine powder paste 4 to each of a plurality of electrodes 2 provided on a substrate 1 (application step); mounting each of a plurality of electronic components 5 having different heights on the plurality of electrodes (component mounting step); mounting an organic film 6 on the plurality of electronic components; uniforming the height of the organic film by applying a first pressure to the electronic component side by a pressing member 58 (organic film pressurizing step); and bonding each electrode terminal of the plurality of electronic components to each electrode of the substrate by applying a second pressure to the electronic component side by a pressurizing member 58 and by sintering the metal fine powder paste by heating the electronic component side for a prescribed time (bonding step).
摘要翻译：要解决的问题：确保电子部件和电极端子之间的良好的接合状态，以提高生产率和减小基板的尺寸。解决方案：一种用于接合电子部件的方法包括以下步骤：将金属细粉末膏4 到设置在基板1上的多个电极2的各个（涂敷工序）。在多个电极上安装具有不同高度的多个电子部件5中的每一个（部件安装步骤）; 将有机膜6安装在所述多个电子部件上; 通过按压部件58向电子部件侧施加第一压力使有机膜的高度均匀化（有机膜加压工序）; 并且通过加压构件58向电子部件侧施加第二压力并且通过将电子部件侧加热规定时间来烧结金属细粉末糊料，将多个电子部件的各电极端子接合到基板的各个电极（接合工序）。

34. 发明专利

JP2014086137A Cold cathode type ion source 审中-公开
标题翻译：冷阴极类型离子源
公开(公告)号：JP2014086137A
公开(公告)日：2014-05-12
申请号：JP2012231458
申请日：2012-10-19
申请人： Ran Technical Service Kk , ランテクニカルサービス株式会社 , Tadatomo Suga , 唯知須賀
发明人： MATSUMOTO YOSHIIE , SUGA TADATOMO
IPC分类号： H01J27/14 , H01J37/08
摘要： PROBLEM TO BE SOLVED: To provide a cold cathode type ion source which is constituted by using a member containing iron and can avoid or suppress emission of iron.SOLUTION: A cold cathode type ion source emitting gas ions includes an anode and a cathode, and at least a part of the surface of an anode and the surface of a cathode in contact with gas plasma is formed of a nonferrous material.
摘要翻译：要解决的问题：提供一种通过使用含铁成分构成的冷阴极型离子源，并且可以避免或抑制铁的排放。解决方案：发射气体离子的冷阴极型离子源包括阳极和阴极，以及阳极表面的至少一部分和与气体等离子体接触的阴极表面由有色金属材料形成。

35. 发明专利

JP2006080099A Bonding method and bonding device 审中-公开
标题翻译：接合方法和接合装置
公开(公告)号：JP2006080099A
公开(公告)日：2006-03-23
申请号：JP2002280607
申请日：2002-09-26
申请人： Tadatomo Suga , Toray Eng Co Ltd , 東レエンジニアリング株式会社 , 唯知須賀
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/60
CPC分类号： H01L24/81 , H01L2224/16 , H01L2224/75 , H01L2224/7501 , H01L2224/751 , H01L2224/75252 , H01L2224/75702 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/14 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide bonding method/device with which adhesion of a foreign material layer to a cleaned bonding face is properly prevented until bonding after bonded objects whose bonding faces are cleaned by an energy wave are taken out into the atmosphere and bonding in the atmosphere is securely and easily performed.
SOLUTION: In bonding the bonded objects having metallic bonding parts on a surface of a substrate, the bonding faces of the metallic bonding parts are cleaned by the energy wave. The atmosphere of the cleaned bonding face is substituted for special gas and a special film derived from special gas is formed on the bonding face. The metallic bonding parts are bonded while the special film is removed or destroyed in the atmosphere.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够适当地防止异物层与清洁的接合面的粘合的接合方法/装置，直到在通过能量波清洁接合面的接合物体被取出到大气中之后的接合之前并且可靠且容易地进行大气中的接合。解决方案：在基板表面上粘结具有金属粘结部分的粘结物体时，通过能量波清洁金属粘合部分的粘合面。清洁的粘合面的气氛代替特殊气体，在接合面上形成由特殊气体衍生的特殊膜。在大气中去除或破坏特殊薄膜的同时粘结金属粘合部分。版权所有（C）2006，JPO＆NCIPI

36. 发明专利

JP2006060150A Manufacturing method of wiring board 有权
标题翻译：接线板制造方法
公开(公告)号：JP2006060150A
公开(公告)日：2006-03-02
申请号：JP2004243053
申请日：2004-08-24
申请人： Matsushita Electric Ind Co Ltd , Namics Corp , Tadatomo Suga , Katsuhide Tsukamoto , ナミックス株式会社 , 勝秀塚本 , 松下電器産業株式会社 , 唯知須賀
发明人： SUGA TADATOMO , TSUKAMOTO KATSUHIDE , AOKURA ISAMU , YOSHII AKITO , KITAMURA MASAHIRO , YAMAGUCHI HIROSHI
IPC分类号： H05K3/46 , H01L23/12 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board capable of simply manufacturing the wiring board at a low cost with high reliability because of a few joints between different materials, with ease of minute wiring, and with less wire resistance because of employing a high groove aspect ratio. SOLUTION: The manufacturing method adopts a step wherein grooves and through-via holes are formed to an insulator sheet on the surface of which an exfoliable sheet is formed, conductor paste is filled into the grooves and through-via holes, and the exfoliable sheet is exfoliated. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够以低成本简单地制造布线板的布线板的制造方法，其由于不同材料之间的少量接合而具有高可靠性，易于布线，并且具有较少的布线因为采用了高槽宽度比。解决方案：制造方法采用在形成有可剥离片材的表面上的绝缘片上形成有沟槽和通孔的步骤，将导体膏填充到沟槽和通孔中，可剥离片材脱落。版权所有（C）2006，JPO＆NCIPI

37. 发明专利

AU4279301A Semiconductor device and fabrication method therefor 未知
公开(公告)号：AU4279301A
公开(公告)日：2001-10-30
申请号：AU4279301
申请日：2001-03-27
申请人： TOYO KOHAN CO LTD , TADATOMO SUGA
发明人： SUGA TADATOMO , SAIJO KINJI , OHSAWA SHINJI , OKAMOTO HIROAKI , YOSHIDA KAZUO
IPC分类号： H01L23/52 , H01L21/283 , H01L21/288 , H01L21/3205 , H01L21/60 , H01L21/768 , H01L23/31 , H01L23/485 , H01L21/3213
摘要： A method of efficiently and inexpensively fabricating a chip-size package having an electrode pitch expanded by forming a conductor wiring on the electrode forming surface side of a semiconductor chip, especially, a method for facilitating wiring and bump forming. A semiconductor device comprising a semi-conductor elements and conductor wirings formed on the semiconductor elements by etching wiring-forming metal foil; and a fabrication method for a semiconductor device comprising the steps of laminating wiring forming metal foil on the electrode forming surface side on the semiconductor, forming a resist wiring pattern on the metal foil, etching the metal foil, and slicing the device into individual elements.

38. 发明专利

JP2004093451A Probe method and probe device 审中-公开
公开(公告)号：JP2004093451A
公开(公告)日：2004-03-25
申请号：JP2002256746
申请日：2002-09-02
申请人： Hisahiro Ito , Kenichi Kataoka , Katsuya Okumura , Tadatomo Suga , Tokyo Electron Ltd , 伊藤寿浩 , 奥村勝弥 , 東京エレクトロン株式会社 , 片岡憲一 , 須賀唯知
发明人： SUGA TADATOMO , OKUMURA KATSUYA , ITO HISAHIRO , KATAOKA KENICHI , KOMATSU SHIGEKAZU , ABE YUICHI
IPC分类号： G01R1/06 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/66
CPC分类号： G01R1/07314 , G01R1/06766 , G01R31/2831 , G01R31/2886
摘要： PROBLEM TO BE SOLVED: To provide a probe method and a probe device as improvement of a conventional inspecting method in which a stylus pressure is given to break an oxide film of an electrode pad involving such a problem that the stylus pressure from a contact shoe may change the electric characteristics such as the transistor characteristics and a stylus pressure as large as breaking the oxide film of the electrode pad can not be given in case a soft material such as Low-k material having a low diffraction factor is used in the sub-layer of the electrode pad.
SOLUTION: The probe method consists of three processes, one in which the electrode pad P of a wafer W is subjected to a reduction process using a foaming gas, another in which the electrode pad P and a probe 144 are put in contact, and a third in which the electrode pad P and the probe 144 are put in electric continuity using fritting phenomenon.
COPYRIGHT: (C)2004,JPO

39. 发明专利

JP2004063999A Device and method for mounting electronic part, and pressing device and pressing method 有权
公开(公告)号：JP2004063999A
公开(公告)日：2004-02-26
申请号：JP2002223498
申请日：2002-07-31
申请人： Hisahiro Ito , Matsushita Electric Ind Co Ltd , Tadatomo Suga , 伊藤寿浩 , 松下電器産業株式会社 , 須賀唯知
发明人： SUGA TADATOMO , ITO HISAHIRO , AZUMA KAZUJI , YONEZAWA TAKAHIRO , EGUCHI SHINZO , OIDO YOSHIHISA , TOMITA KAZUYUKI
IPC分类号： H05K13/04 , H01L21/52 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a method of easily obtaining a pressure applied to an electronic part when the electronic part is mounted on a board in a reduced-pressure environment. SOLUTION: An electronic part mounting device holds the electronic part by a mounting head fitted on a shaft which is inserted into a reduced-pressure chamber, and mounts it on the board with a prescribed pressure. The electronic part mounting device is equipped with a head lifting mechanism giving a force to the shaft from outside the chamber and a load cell detecting a force produced between the shaft and the head lifting mechanism. Furthermore, an insertion opening through which the shaft is inserted is isolated from the outside by bellows. In the electronic part mounting device, the mounting head is made to descend and the output of the load cell is reset while the chamber is decompressed before a mounting operation is carried out (steps S31 to S33). By this setup, a force applied to the shaft from the bellows and the reduced-pressure environment can be neglected when a pressure applied on the electronic part at mounting is obtained. COPYRIGHT: (C)2004,JPO

40. 发明专利

JP2004128230A Electronic parts mounter and its manufacturing method 有权
公开(公告)号：JP2004128230A
公开(公告)日：2004-04-22
申请号：JP2002290544
申请日：2002-10-03
申请人： North:Kk , Tadatomo Suga , 株式会社ノース , 須賀唯知
发明人： SUGA TADATOMO , OHIRA HIROSHI , OSAWA KENJI , IIJIMA ASAO
IPC分类号： H01L23/12 , H01L25/04 , H01L25/18
CPC分类号： H01L2224/24137
摘要： PROBLEM TO BE SOLVED: To provide an electronic parts mounter that enhances the properties in high-frequency, quick response or the like and with high reliability, by enhancing the mounting density of electronic parts and reducing the length of wirings. SOLUTION: The mounter is at least provided with wiring portions 2a, 4 in which metal bumps 4 each having substantially a shape of conoid are formed at least in a portion of a plurality of wiring films 2a formed with a metal foil 2, an electronic part (IC)6 whose electrodes 8 are connected to the bumps 4 in the wiring portions 2a, 4, an interlayer insulating resin layer 10 enclosing and sealing the electronic part (IC)6 including the portion between the wiring films 2a and a portion opposite to the electrodes 8 so that the wiring films 2a of the wiring portions 2a, 4 are exposed, and wiring films 12a formed with a metal foil 12 which are arranged on a principal plane of the resin layer 10 opposite to the wiring portion 2a. COPYRIGHT: (C)2004,JPO

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