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1. 发明专利

AU4279301A Semiconductor device and fabrication method therefor 未知
公开(公告)号：AU4279301A
公开(公告)日：2001-10-30
申请号：AU4279301
申请日：2001-03-27
申请人： TOYO KOHAN CO LTD , TADATOMO SUGA
发明人： SUGA TADATOMO , SAIJO KINJI , OHSAWA SHINJI , OKAMOTO HIROAKI , YOSHIDA KAZUO
IPC分类号： H01L23/52 , H01L21/283 , H01L21/288 , H01L21/3205 , H01L21/60 , H01L21/768 , H01L23/31 , H01L23/485 , H01L21/3213
摘要： A method of efficiently and inexpensively fabricating a chip-size package having an electrode pitch expanded by forming a conductor wiring on the electrode forming surface side of a semiconductor chip, especially, a method for facilitating wiring and bump forming. A semiconductor device comprising a semi-conductor elements and conductor wirings formed on the semiconductor elements by etching wiring-forming metal foil; and a fabrication method for a semiconductor device comprising the steps of laminating wiring forming metal foil on the electrode forming surface side on the semiconductor, forming a resist wiring pattern on the metal foil, etching the metal foil, and slicing the device into individual elements.

2. 发明专利

AU6320200A Safety device for closed cell and closed cell comprising the same 未知
公开(公告)号：AU6320200A
公开(公告)日：2001-03-05
申请号：AU6320200
申请日：2000-08-07
申请人： TOYO KOHAN CO LTD
发明人： KAWAMURA HIROAKI , KANEKO AKIRA , OKAMOTO HIROAKI , NISHIMURA KUNIO
IPC分类号： H01M2/12
摘要： A safety device for a closed cell, for preventing rupture due to a sudden increase of the inner pressure caused by overcharging and short circuit. The safety device can be manufactured at low cost and comprises a positive plate cap (16) including a pressure-receiving plate (18) constituting an innermost cap, a shield plate (20) constituting an intermediate cap, and a sealing plate (21) constituting an outermost cap. A projection (28) of the pressure-receiving plate (18), in a first flat joining face (27), is joined to a second flat joining face (29) of the shield plate (20), thus forming a central joining part (19). A C-shaped groove (31) is formed around the second flat joining face (29). A strength-weakening groove (32) bending in such a direction in which the groove (32) is opposed to the C-shaped groove (31) is formed surrounded by the C-shaped groove (31). Between both ends (32a) of the strength-weakening groove (32) and portions (31a) away from both ends of the C-shaped groove (31) by predetermined distance, narrow portions (33) to be bent are formed.

3. 发明专利

AU5104600A Process for producing printed wiring board, ic card and printed wiring substrate 未知
公开(公告)号：AU5104600A
公开(公告)日：2000-12-28
申请号：AU5104600
申请日：2000-06-02
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OKAMOTO HIROAKI , OHSAWA SHINJI
IPC分类号： H01L21/60 , H05K3/32 , H05K3/40 , H05K1/09 , G06K19/077

4. 发明专利

AU2185399A Method of forming protective coating on cell safety valve element, cell safety valve element coated with protective film, cell sealing plate using the element, and enclosed cell using the plate 未知
公开(公告)号：AU2185399A
公开(公告)日：1999-08-23
申请号：AU2185399
申请日：1999-01-29
申请人： TOYO KOHAN CO LTD
发明人： OKAMOTO HIROAKI , SUGIMOTO YOSHIYUKI , SAIJO KINJI , KAWAMURA HIROAKI
IPC分类号： H01M2/12
摘要： The present invention provide a method of forming a protection film of a safety valve element for battery which prevents from corroding a metal portion by covering protection film on the safety valve element for battery, a closing plate for a battery using same and a closed battery using same. A safety valve element of the present invention is composed of a safety valve element 10 comprising a metal substrate 1 having a perforated pore 4 and a metal foil 2 laminated on a metal substrate 1 so as to cover perforated pore 4 and a protection film 3 which is formed by coating an organic coating at least on one side of a safety valve element 10. Further, a closing plate puts a safety valve element 10 to provide a protection film 3 which is coated with organic film on a closing plate 6 of battery container to provide perforation 4 which is an opening of a safety valve so as to face perforations of a metal substrate 4 and perforation of a closing plate 7 and then to glue around perforation of a closing plate 7, and a closing plate of a battery is made. Furthermore, there is closed an opening of a battery container that fixes electrode which consist of positive electrode, negative electrode and separator, and a closed battery is made.

5. 发明专利

CA2319062A1 METHOD OF FORMING PROTECTIVE COATING ON CELL SAFETY VALVE ELEMENT, CELL SAFETY VALVE ELEMENT COATED WITH PROTECTIVE FILM, CELL SEALING PLATE USING THE ELEMENT, AND ENCLOSED CELL USING THE PLATE 未知
公开(公告)号：CA2319062A1
公开(公告)日：1999-08-12
申请号：CA2319062
申请日：1999-01-29
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , KAWAMURA HIROAKI , OKAMOTO HIROAKI , SUGIMOTO YOSHIYUKI
IPC分类号： H01M2/12
摘要： A method of forming a protective coating on a cell safety valve element by coating the cell safety valve element with a protective film to protect metal portions thereof against corrosion, a cell safety valve element coated with a protective film, a cell sealing plate using the element, and an enclosed cell using the plate. The safety valve element comprises a coating (3) obtained by applying an organic paint onto at least one surface of the cell safety valve element (10) consisting of a metal base plate (1) having a through hole (4) drilled therein and a metal foil (2) laminated on the metal base plate (1) so as to block the through hole (4). The sealing plate is formed by bringing the cell safety valve element (10), on which a protective coating (3) comprising an organic resin film is formed, into contact with a cell exterior can sealing plate (6), in which the through hole (4) acting as a safety valve port is drilled so that the through hole (4) in the metal base plate of the cell safety valve element (10) and the through hole (7) in the sealing plate face each other and bonding the both at a portion around the through hole (7) in the sealing plate to form the cell sealing plate. The enclosed cell is formed by fitting and supporting the cell sealing plate at the inner periphery of an opening of the cell exterior can in which are housed an electrode body consisting of a positive electrode, a negative electrode and a separator together with an electrolyte to block the opening in the cell exterior can.

6. 发明专利

AU1889899A Enclosed cell and sealer 未知
公开(公告)号：AU1889899A
公开(公告)日：1999-08-02
申请号：AU1889899
申请日：1999-01-14
申请人： TOYO KOHAN CO LTD
发明人： SUGIMOTO YOSHIYUKI , SAIJO KINJI , KAWAMURA HIROAKI , OKAMOTO HIROAKI , ISOBE YOSHIHIKO
IPC分类号： H01M2/12 , H01M2/34 , H01M6/10
摘要： ÄObjectÜ The object of the present invention is to provide a closed battery capable of readily releasing the internal pressure thereof and at the same time disconnecting the current thereof to effectively prevent itself from temperature rising and burst so that it may assure safety and reliability thereof, when, in such a completely closed battery, the internal pressure is elevated due to short circuit, overcharge, reverse charge, or the like. ÄMeans of SolutionÜ A closing member comprises valve element 5 formed of metal substrate 1, on which a plurality of perforated openings 3 are disposed along an endless circumference with narrow intervals between them, and metal foil 2 laminated to the inner surface of metal substrate 1 so as to close perforated openings 3. When the internal pressure of a closed battery is elevated, portions of the narrow intervals of the metal substrate, which are transformable by a small force, are elongated so as to cause a portion of the metal substrate encircled by the plurality of perforated openings 3 disposed on the endless circumference to be projected. The closing member having such structure is secured to the inner periphery of an open end portion of outer container 30 of the battery, which accommodates electrode element 32 consisting of positive electrode 32a, negative electrode 32c, and separator 32b, together with an electrolyte therein, so as to close the open end portion of outer container 30.

7. 发明公开

EP1393896A4 LAMINATED PLATE AND PART USING THE LAMINATED PLATE 审中-公开
标题翻译：层合板和本使用的部位
公开(公告)号：EP1393896A4
公开(公告)日：2007-01-10
申请号：EP02717134
申请日：2002-04-12
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OKAMOTO HIROAKI , OHSAWA SHINJI
IPC分类号： B32B27/16 , H05K3/00 , H05K3/38 , H05K3/46 , B32B27/00
CPC分类号： B32B15/08 , B32B27/16 , B32B27/281 , B32B38/0008 , B32B2037/0092 , B32B2305/55 , B32B2379/08 , B32B2457/08 , H05K3/0058 , H05K3/381 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0141 , H05K2201/0154 , H05K2203/065 , H05K2203/097 , Y10T428/31504
摘要： A laminated plate formed of a base material and a high molecular plate laminated with each other without using adhesive agent and a part using the laminated plate, wherein the laminated plate is formed by laminatedly sticking the base plate to the high molecular plate after applying an activating treatment onto the opposed surfaces of the base plate and the high molecular plate, and the part is formed by using the laminated plate.

8. 发明专利

CA2318183C ENCLOSED CELL AND SEALER 未知
公开(公告)号：CA2318183C
公开(公告)日：2007-05-15
申请号：CA2318183
申请日：1999-01-14
申请人： TOYO KOHAN CO LTD
发明人： KAWAMURA HIROAKI , SAIJO KINJI , OKAMOTO HIROAKI , ISOBE YOSHIHIKO , SUGIMOTO YOSHIYUKI
IPC分类号： H01M2/12 , H01M2/34 , H01M6/10 , H01M10/04
摘要： A completely-enclosed cell wherein if the internal pressure in the cell rise s because of shortcircuit, overcharging, or reverse charging, temperature rise and explosion of the cell is effectively prevented, the current is cut off, and the internal pressure is simultaneously and quickly released to ensure t he safety and reliability of the cell. The cell includes a sealer comprising a valve body (5) composed of a metal substrate (1) having through holes (3) ma de at narrow intervals in the endless periphery and a metal foil (2) formed on the inside surface of the metal substrate (1) to cover the through holes (3) and has a structure in which a narrow gap portion of a metal plate deformabl e even by a weak force of when the internal pressure increases elongates and t he portion surrounded by the through holes (3) projects. The sealer is fitted a nd supported to the inner periphery of an opening section of a cell case (30) containing an electrode assembly (32) having a positive plate (32a), a negative plate (32c), and a separator (32b) and an elctrolyte to close the opening section.

9. 发明专利

AU2226201A Semiconductor device and method for producing the same 未知
公开(公告)号：AU2226201A
公开(公告)日：2001-07-24
申请号：AU2226201
申请日：2000-12-26
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , OHSAWA SHINJI , OKAMOTO HIROAKI , YOSHIDA KAZUO
IPC分类号： H01L21/3205 , H01L21/3213 , H01L21/60 , H01L23/12 , H01L23/52

10. 发明专利

AU2226101A Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit 未知
公开(公告)号：AU2226101A
公开(公告)日：2001-07-24
申请号：AU2226101
申请日：2000-12-26
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , OHSAWA SHINJI , OKAMOTO HIROAKI , YOSHIDA KAZUO
IPC分类号： H01L21/3213 , H01L21/28 , H01L21/3205 , H01L21/60 , H01L21/768 , H01L23/52
摘要： A means for highly precisely and economically fabricating wiring on a semiconductor and highly precisely and economically forming a bump on an electrodes. (1) A semiconductor device comprising a semiconductor, a metal foil for fabricating wiring and conductor wiring on the semiconductor, and a method of fabricating a conductor wiring circuit on a semiconductor, comprising the steps of laying a metal foil for fabricating wiring on the electrode-forming side of the semiconductor, forming a resist wiring pattern by photo-etching the metal foil, etching the metal foil, and removing the resist to form the wiring. (2)A semiconductor device which comprises a multilayer metal foil for fabricating wiring in place of the metal foil for forming wiring of the semiconductor device described in (1); and a method of fabricating conductor wiring having a bump on a semiconductor, comprising the steps of the method described in (1) and further comprising the steps of forming a resist pattern for forming the bump by photo-etching the multilayer metal foil for forming the wiring, forming a bump by selective etching, and removing an etch-stop layer.

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