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31. 发明申请

US20090212306A1 DEVICE FOR AN OPTOELECTRONIC COMPONENT AND MODULE WITH AN OPTOELECTRONIC COMPONENT AND A DEVICE 有权
标题翻译：光电元件与光电元件与器件的器件
公开(公告)号：US20090212306A1
公开(公告)日：2009-08-27
申请号：US11574055
申请日：2005-08-02
申请人： Georg Bogner , Michael Hiegler , Monika Rose , Günter Waitl , Manfred Wolf
发明人： Georg Bogner , Michael Hiegler , Monika Rose , Günter Waitl , Manfred Wolf
IPC分类号： H01L33/00 , G02B7/00
CPC分类号： H01L31/0203 , H01L31/02325 , H01L33/486 , H01L33/58 , H01L2224/48247 , H01L2224/73265 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An apparatus having at least one fixing element is specified, the fixing dement being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element.
摘要翻译：规定具有至少一个固定元件的装置，所述固定装置用于将所述装置固定到光电装置的壳体上，并且所述装置被设计为用于单独的光学元件的支架。

32. 发明授权

US08890306B2 Light-emitting diode 有权
标题翻译：发光二极管
公开(公告)号：US08890306B2
公开(公告)日：2014-11-18
申请号：US13808300
申请日：2011-05-24
申请人： Joachim Reill , Georg Bogner , Stefan Grötsch
发明人： Joachim Reill , Georg Bogner , Stefan Grötsch
IPC分类号： H01L23/15 , H01L23/08 , H01L33/64 , H01L25/075 , H05K1/02 , H01L23/10 , H05K1/05 , H01L33/62
CPC分类号： H01L25/13 , H01L25/0753 , H01L33/46 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/644 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H05K1/0203 , H05K1/05 , H05K3/445 , H05K2201/10106 , H05K2201/10409 , H01L2924/00014
摘要： A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier.
摘要翻译：发光二极管包括具有安装面的载体，并且包括金属基体和至少两个至少两个发光二极管芯片，其至少间接地固定在安装面上，其中金属基体的外表面包括所述至少两个发光二极管芯片彼此并联连接，所述至少两个发光二极管芯片嵌入在反射涂层中，所述反射涂层覆盖所述安装面和所述发光二极管的侧面二极管芯片，并且发光二极管芯片以其辐射出射表面突出出反射涂层，并且辐射出射表面背离载体。

33. 发明授权

US08283684B2 LED semiconductor body and use of an LED semiconductor body 有权
标题翻译： LED半导体体和使用LED半导体体
公开(公告)号：US08283684B2
公开(公告)日：2012-10-09
申请号：US12443155
申请日：2007-09-19
申请人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
发明人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
IPC分类号： H01L33/00
CPC分类号： H01L27/15 , H01L24/24 , H01L25/0756 , H01L25/167 , H01L33/08 , H01L2224/32145 , H01L2924/0002 , H01L2924/12036 , H01L2924/12041 , H01L2924/00
摘要： An LED semiconductor body includes a number of at least two radiation-generating active layers. Each active layer has a forward voltage, wherein the number of active layers is adapted to an operating voltage in such a way that the voltage dropped across a series resistor connected in series with the active layers is at most of the same magnitude as a voltage dropped across the LED semiconductor body. The invention furthermore describes various uses of the LED semiconductor body.
摘要翻译： LED半导体体包括多个至少两个辐射生成有源层。每个有源层具有正向电压，其中有源层的数量适应于工作电压，使得跨过与有源层串联连接的串联电阻器上的电压与电压下降最多相同的大小跨越LED半导体体。本发明还描述了LED半导体本体的各种用途。

34. 发明授权

US07838357B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US07838357B2
公开(公告)日：2010-11-23
申请号：US10494160
申请日：2002-10-28
申请人： Georg Bogner , Herbert Brunner , Gertrud Kräuter , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Gertrud Kräuter , Gunter Waitl
IPC分类号： H01L218/8238
CPC分类号： H01L33/486 , H01L33/483 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.
摘要翻译：具有壳体（2），布置在壳体主体的凹部（6）中的光电子半导体芯片（3），并具有电端子（1A，1B）的光电子部件，该半导体芯片导电地连接到电气引线框的端子。壳体（2）由封装材料形成，其具有在从UV范围的波长范围内具有高反射度的填料。

35. 发明申请

US20100270578A1 Light Emitting Diode Chip with Overvoltage Protection 有权
标题翻译：具有过压保护功能的发光二极管芯片
公开(公告)号：US20100270578A1
公开(公告)日：2010-10-28
申请号：US12742064
申请日：2008-12-09
申请人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
发明人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
IPC分类号： H01L33/62 , H01L33/00
CPC分类号： H01L25/167 , H01L23/60 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.
摘要翻译：发光二极管芯片包括用于防止过电压的装置，例如ESD保护装置。 ESD保护器件集成在发光二极管芯片的半导体层序列所在的载体上，并且基于对所述载体的特定区域的特定掺杂。作为示例，ESD保护装置被实施为通过电导体结构连接到半导体层序列的齐纳二极管。

36. 发明授权

US07429758B2 Optoelectronic component and method for producing it 有权
标题翻译：光电元件及其制造方法
公开(公告)号：US07429758B2
公开(公告)日：2008-09-30
申请号：US11141721
申请日：2005-05-31
申请人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
发明人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.
摘要翻译：一种光电元件，其具有基本壳体或框架（12）和至少一个半导体芯片（20），特别是辐射发射或接收半导体芯片，位于基本壳体的空腔（18）中。为了提高光电子部件（10）的效率，在半导体芯片周围的区域的空腔内设置反射器。这些反射器是由以下事实构成的：提供了至少部分地填充到空腔（18）中的填充化合物（28），填充化合物（28）的材料和数量被选择为使填充物由于填充化合物和基本壳体之间的粘合力，复合物呈现在腔体中从底部到顶部基本上锥形化的形式，并且填充化合物的锥形内部区域（30）用作反射器。

37. 发明申请

US20070253667A1 Optoelectronic Component with Multi-Part Housing Body 有权
标题翻译：多部件壳体的光电元件
公开(公告)号：US20070253667A1
公开(公告)日：2007-11-01
申请号：US10593794
申请日：2005-03-09
申请人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
发明人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
IPC分类号： H01L31/0203
CPC分类号： H01L33/60 , H01L31/0203 , H01L31/02325 , H01L33/486 , H01L33/54 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02292 , H01L2924/00
摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.
摘要翻译：提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13）导体材料（6,7）设置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器主体被预成型彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。

38. 发明授权

US06900511B2 Optoelectronic component and method for producing it 有权
公开(公告)号：US06900511B2
公开(公告)日：2005-05-31
申请号：US10611225
申请日：2003-06-27
申请人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
发明人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
IPC分类号： H01L23/02 , H01L31/0203 , H01L33/48 , H01L33/60 , H01L31/0232 , H01L23/495
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

39. 发明授权

US5999552A Radiation emitter component 失效
标题翻译：辐射发射器组件
公开(公告)号：US5999552A
公开(公告)日：1999-12-07
申请号：US9606
申请日：1998-01-20
申请人： Georg Bogner , Herbert Brunner , Heinz Haas , Johann Luft , Ernst Nirschl , Werner Spaeth , Norbert Stath , Wolfgang Teich
发明人： Georg Bogner , Herbert Brunner , Heinz Haas , Johann Luft , Ernst Nirschl , Werner Spaeth , Norbert Stath , Wolfgang Teich
IPC分类号： H01L33/56 , H01S3/00 , H01S5/00 , H01S5/022 , H01S3/18 , H01L33/00
CPC分类号： H01S5/02244 , H01S5/02228 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2933/0091 , H01L33/56
摘要： A radiation emitter component, in particular an infrared emitter component with a conventional light-emitting diode housing, includes two electrode connections, one of which has a well-shaped reflector. The housing has an optically transparent, electrically non-conducting encapsulation material. A semiconductor laser chip is fastened in a well-shaped reflector of the light-emitting diode housing. The semiconductor laser chip has a quantum well structure, in particular with a strained layer structure, for example MOVPE epitaxial layers with a layer sequence GaAlAs-InGaAs-GaAlAs. A diffusor material can be inserted into the optically transparent, electrically non-conducting material of the light-emitting diode housing. The diffusor material is constructed or inserted with regard to type and concentration in such a way that in connection with the semiconductor laser chip encapsulated in the light-emitting diode housing, a radiation characteristic curve or an increase of an effective emission surface is produced that is comparable to that of a conventional infrared light-emitting diode.
摘要翻译：辐射发射器部件，特别是具有传统发光二极管外壳的红外发射器部件包括两个电极连接件，其中之一具有良好形状的反射器。壳体具有光学透明的非导电封装材料。将半导体激光芯片紧固在发光二极管壳体的形状好的反射器中。半导体激光芯片具有量子阱结构，特别是具有应变层结构，例如具有层序列GaAlAs-InGaAs-GaAlAs的MOVPE外延层。漫射材料可以插入到发光二极管外壳的光学透明的非导电材料中。关于类型和浓度来构造或插入扩散材料，使得与封装在发光二极管外壳中的半导体激光器芯片有关，产生辐射特性曲线或有效发射表面的增加，即，与传统的红外发光二极管相当。

40. 发明授权

US09159889B2 Radiation-emitting component and method for producing radiation-emitting components 有权
标题翻译：辐射发射部件和用于产生辐射发射部件的方法
公开(公告)号：US09159889B2
公开(公告)日：2015-10-13
申请号：US13811846
申请日：2011-07-15
申请人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
发明人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
IPC分类号： H01L33/60 , H01L33/20 , H01L33/38 , H01L33/58 , G02F1/1335 , H01L25/075 , H01L33/40 , H01L33/46
CPC分类号： H01L33/60 , G02F1/133603 , H01L25/0753 , H01L25/0756 , H01L33/20 , H01L33/38 , H01L33/405 , H01L33/46 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.
摘要翻译：辐射发射部件包括半导体芯片，其具有第一主表面，与第一主表面相对的第二主表面和产生辐射的有源区域; 半导体芯片固定在第二主表面侧的载体; 输出层，布置在半导体芯片的第一主表面上，并在横向上形成与半导体芯片间隔开的横向输出表面，在输出层中形成在半导体芯片的方向上渐缩的凹部和偏转辐射在运行过程中从第一主表面向侧向输出表面的方向出现。

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