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1. 发明申请

US20070253667A1 Optoelectronic Component with Multi-Part Housing Body 有权
标题翻译：多部件壳体的光电元件
公开(公告)号：US20070253667A1
公开(公告)日：2007-11-01
申请号：US10593794
申请日：2005-03-09
申请人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
发明人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
IPC分类号： H01L31/0203
CPC分类号： H01L33/60 , H01L31/0203 , H01L31/02325 , H01L33/486 , H01L33/54 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02292 , H01L2924/00
摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.
摘要翻译：提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13）导体材料（6,7）设置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器主体被预成型彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。

2. 发明授权

US08735930B2 Optoelectronic component with multi-part housing body 有权
标题翻译：具有多部分外壳的光电元件
公开(公告)号：US08735930B2
公开(公告)日：2014-05-27
申请号：US10593794
申请日：2005-03-09
申请人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Höfer
发明人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Höfer
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L31/0203 , H01L31/02325 , H01L33/486 , H01L33/54 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02292 , H01L2924/00
摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.
摘要翻译：提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13）导体材料（6,7）被布置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器体被预成型彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。

3. 发明申请

US20050214968A1 Method for fixing a semiconductor chip in a plastic housing body, optoelectronic semiconductor component 有权
标题翻译：将半导体芯片固定在塑料外壳主体中的方法，光电半导体部件
公开(公告)号：US20050214968A1
公开(公告)日：2005-09-29
申请号：US10514461
申请日：2004-05-14
申请人： Gunter Waitl , Georg Bogner , Michael Hiegler , Matthias Winter
发明人： Gunter Waitl , Georg Bogner , Michael Hiegler , Matthias Winter
IPC分类号： H01L21/52 , H01L21/60 , H01L23/08 , H01L33/62 , H01L21/50
CPC分类号： H01L33/62 , H01L21/52 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/29007 , H01L2224/2908 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01063 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12041 , H01L2924/157 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/01029 , H01L2924/00012 , H01L2924/01049 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 μm, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5.
摘要翻译：辐射发射或接收半导体芯片9被软焊接以安装在引线框架2上，预成型的塑料密封剂5（所谓的预成型封装）被注射成型。通过使用以小于10um的层厚施加的低熔点焊料3，可以在很大程度上进行焊接工艺而不会对塑料密封剂5造成热损伤。

4. 发明申请

US20050110010A1 Opto-electronic element with a metallized carrier 审中-公开
标题翻译：具有金属化载体的光电子元件
公开(公告)号：US20050110010A1
公开(公告)日：2005-05-26
申请号：US10952138
申请日：2004-09-28
申请人： Matthias Winter , Georg Bogner , Stefan Gruber
发明人： Matthias Winter , Georg Bogner , Stefan Gruber
IPC分类号： H01L21/60 , H01L29/08 , H01L33/62 , H01S5/02
CPC分类号： H01S5/02272 , H01L24/32 , H01L24/83 , H01L33/62 , H01L2224/32225 , H01L2224/32245 , H01L2224/83001 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01S5/0213 , H01L2924/00
摘要： In an optoelectronic component, having a semiconductor body (1) which includes a substrate (2) and a layer system (3) deposited on the substrate (2), a main surface of the semiconductor body (1) on the opposite side from the substrate (2) being secured to a support (4) by means of a soldered join (7), and the support (4) having a metallization (5) on the side facing the semiconductor body (1), wherein the metallization (5) is silver-free. Also disclosed is an optoelectronic component having a thin-film semiconductor body (8) which is secured to a support (4) by means of a soldered join (7), and the support (4) has a metallization (5) on the side facing the semiconductor body (8), in which the metallization (5) is silver-free.
摘要翻译：在具有半导体本体（1）的光电子部件中，所述半导体本体（1）包括衬底（2）和沉积在所述衬底（2）上的层系统），所述半导体本体（1）的与所述衬底衬底（2）通过焊接接头（7）固定到支撑件（4）上，并且支撑体（4）在面对半导体本体（1）的一侧上具有金属化（5），其中金属化（5））是无银的。还公开了具有通过焊接接头（7）固定到支撑件（4）的薄膜半导体本体（8）的光电子部件，并且支撑件（4）在侧面具有金属化（5）面向其中金属化（5）是无银的半导体本体（8）。

5. 发明授权

US07586190B2 Optoelectronic component and a module based thereon 有权
标题翻译：光电组件和基于此的模块
公开(公告)号：US07586190B2
公开(公告)日：2009-09-08
申请号：US10529626
申请日：2003-09-29
申请人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll , Matthias Winter
发明人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll , Matthias Winter
IPC分类号： H01L23/34
CPC分类号： H01L33/64 , H01L33/486 , H01L2224/48091 , H01L2224/48465 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic component (1) having a semiconductor arrangement (4) which emits and/or receives electromagnetic radiation and which is arranged on a carrier (22) which is thermally conductively connected to a heat sink (12). External electrical connections (9) are connected to the semiconductor arrangement (4), where the external electrical connections (9) are arranged in electrically insulated fashion on the heat sink (12) at a distance from the carrier (22). This results in an optimized component in terms of the dissipation of heat loss and the radiation of light and also in terms of making electrical contact and the packing density in modules.
摘要翻译：一种具有发射和/或接收电磁辐射的半导体装置（4）的光电子部件（1），其布置在导热连接到散热器（12）的载体（22）上。外部电连接（9）连接到半导体装置（4），其中外部电连接（9）以绝缘方式布置在散热器（12）上距载体（22）一定距离处。这导致了热耗散和光辐射的优化组件，以及在模块中的电接触和包装密度方面。

6. 发明授权

US08110437B2 Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof 有权
标题翻译：用于将半导体芯片附着在塑料密封剂中的方法，光电子半导体部件及其制造方法
公开(公告)号：US08110437B2
公开(公告)日：2012-02-07
申请号：US10514461
申请日：2003-05-14
申请人： Gunter Waitl , Georg Bogner , Michael Hiegler , Matthias Winter
发明人： Gunter Waitl , Georg Bogner , Michael Hiegler , Matthias Winter
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L21/52 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/29007 , H01L2224/2908 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01063 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12041 , H01L2924/157 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/01029 , H01L2924/00012 , H01L2924/01049 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 μm, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5.
摘要翻译：辐射发射或接收半导体芯片9被软焊接以安装在引线框架2上，预成型的塑料密封剂5（所谓的预成型封装）被注射成型。通过使用以小于10μm的层厚度施加的低熔点焊料3，可以在很大程度上进行焊接工艺，而不会对塑料密封剂5造成热损伤。

7. 发明授权

US07271425B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US07271425B2
公开(公告)日：2007-09-18
申请号：US10535794
申请日：2003-11-27
申请人： Karlheinz Arndt , Georg Bogner , Günter Waitl , Matthias Winter
发明人： Karlheinz Arndt , Georg Bogner , Günter Waitl , Matthias Winter
IPC分类号： H01L29/22
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.
摘要翻译：本发明涉及一种含有光电子芯片（1）并包含芯片载体（2）的光电子部件，芯片载体（2）具有芯片固定在其上的中心区域（3），并且包括端子（41,42,43,44）向外从芯片载体（2）的中心区域延伸至外部，其中芯片和芯片载体的部分被主体（5）包围，并且其中主体的突起和纵向轴线的突出部分在芯片和芯片载体之间的接触平面上的端子相对于芯片的中心点基本上是点对称的。本发明还涉及包括所述部件的装置。组件的对称构型的优点在于降低了组织的热力学诱导故障的风险。

8. 发明申请

US20060138621A1 Optoelectronic component and a module based thereon 有权
标题翻译：光电组件和基于此的模块
公开(公告)号：US20060138621A1
公开(公告)日：2006-06-29
申请号：US10529626
申请日：2003-09-29
申请人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll , Matthias Winter
发明人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll , Matthias Winter
IPC分类号： H01L23/02
CPC分类号： H01L33/64 , H01L33/486 , H01L2224/48091 , H01L2224/48465 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic component (1) having a semiconductor arrangement (4) which emits and/or receives electromagnetic radiation and which is arranged on a carrier (22) which is thermally conductively connected to a heat sink (12). External electrical connections (9) are connected to the semiconductor arrangement (4), where the external electrical connections (9) are arranged in electrically insulated fashion on the heat sink (12) at a distance from the carrier (22). This results in an optimized component in terms of the dissipation of heat loss and the radiation of light and also in terms of making electrical contact and the packing density in modules.
摘要翻译：一种具有发射和/或接收电磁辐射的半导体装置（4）的光电子部件（1），其布置在导热连接到散热片（12）的载体（22）上。外部电连接（9）连接到半导体装置（4），其中外部电连接（9）以绝缘方式布置在散热器（12）上距载体（22）一定距离处。这导致了热耗散和光辐射的优化组件，以及在模块中的电接触和包装密度方面。

9. 发明申请

US20060049477A1 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US20060049477A1
公开(公告)日：2006-03-09
申请号：US10535794
申请日：2003-11-27
申请人： Karlheinz Arndt , Georg Bogner , Gunter Waitl , Matthias Winter
发明人： Karlheinz Arndt , Georg Bogner , Gunter Waitl , Matthias Winter
IPC分类号： H01L31/0203
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.
摘要翻译：本发明涉及一种含有光电子芯片（1）并包含芯片载体（2）的光电子部件，芯片载体（2）具有芯片固定在其上的中心区域（3），并且包括端子（41,42,43,44）向外从芯片载体（2）的中心区域延伸至外部，其中芯片和芯片载体的部分被主体（5）包围，并且其中主体的突起和纵向轴线的突出部分在芯片和芯片载体之间的接触平面上的端子相对于芯片的中心点基本上是点对称的。本发明还涉及包括所述部件的装置。组件的对称构型的优点在于降低了组织的热力学诱导故障的风险。

10. 发明授权

US08571239B2 MEMS microphone 有权
标题翻译： MEMS麦克风
公开(公告)号：US08571239B2
公开(公告)日：2013-10-29
申请号：US13282668
申请日：2011-10-27
申请人： Gregor Feiertag , Anton Leidl , Wolfgang Pahl , Matthias Winter , Christian Siegel
发明人： Gregor Feiertag , Anton Leidl , Wolfgang Pahl , Matthias Winter , Christian Siegel
IPC分类号： H04R25/00 , H04R9/08
CPC分类号： H04R19/005 , H01L24/97 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/1461 , H04R1/2884 , H01L2924/00 , H01L2224/0401
摘要： A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the −3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.
摘要翻译：一种麦克风包，其中MEMS麦克风芯片（MIC）安装在基板（SUB）上并且相对于基板用盖（ABD）密封。麦克风芯片的膜（MMB）通过声道连接到基板中的声音输入开口（SEO）。由于声音入口开口和通道的横截面和长度的限定尺寸的确定，形成声学低通滤波器，其-3dB衰减点明显低于麦克风膜的天然共振，包。

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