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1. 发明申请

US20100270578A1 Light Emitting Diode Chip with Overvoltage Protection 有权
标题翻译：具有过压保护功能的发光二极管芯片
公开(公告)号：US20100270578A1
公开(公告)日：2010-10-28
申请号：US12742064
申请日：2008-12-09
申请人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
发明人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
IPC分类号： H01L33/62 , H01L33/00
CPC分类号： H01L25/167 , H01L23/60 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.
摘要翻译：发光二极管芯片包括用于防止过电压的装置，例如ESD保护装置。 ESD保护器件集成在发光二极管芯片的半导体层序列所在的载体上，并且基于对所述载体的特定区域的特定掺杂。作为示例，ESD保护装置被实施为通过电导体结构连接到半导体层序列的齐纳二极管。

2. 发明授权

US08237192B2 Light emitting diode chip with overvoltage protection 有权
标题翻译：具有过压保护功能的发光二极管芯片
公开(公告)号：US08237192B2
公开(公告)日：2012-08-07
申请号：US12742064
申请日：2008-12-09
申请人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
发明人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
IPC分类号： H01L28/74 , H01L31/111
CPC分类号： H01L25/167 , H01L23/60 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.
摘要翻译：发光二极管芯片包括用于防止过电压的装置，例如ESD保护装置。 ESD保护器件集成在发光二极管芯片的半导体层序列所在的载体上，并且基于对所述载体的特定区域的特定掺杂。作为示例，ESD保护装置被实施为通过电导体结构连接到半导体层序列的齐纳二极管。

3. 发明申请

US20110188846A1 Illumination Unit 有权
标题翻译：照明单位
公开(公告)号：US20110188846A1
公开(公告)日：2011-08-04
申请号：US12989179
申请日：2009-04-16
申请人： Joerg Erich Sorg , Stefan Gruber
发明人： Joerg Erich Sorg , Stefan Gruber
IPC分类号： G03B15/06 , G03B15/02
CPC分类号： F21V33/0052 , F21Y2115/10 , H04M1/22
摘要： A luminous unit (1) for an optical recording device (13) comprising a light source (2) for generating radiation and a partly reflective element, which is disposed downstream of the light source (2) in a main emission direction (H) and subdivides a space into a first half-space facing the light source (2) and a second half-space remote from the light source (2), wherein the partly reflective element at least partly transmits the radiation coming from the light source (2) from the first half-space and at least partly reflects the external radiation coming from an opposite direction from the second half-space.
摘要翻译：一种用于光学记录装置（13）的发光单元（1），包括用于产生辐射的光源（2）和部分反射元件，所述光源单元设置在所述光源（2）的主发射方向（H）的下游，以及将空间细分成面向光源（2）的第一半空间和远离光源（2）的第二半空间，其中部分反射元件至少部分透射来自光源（2）的辐射，并且至少部分地反映来自与第二半空间相反的方向的外部辐射。

4. 发明授权

US08731392B2 Illumination unit 有权
标题翻译：照明单位
公开(公告)号：US08731392B2
公开(公告)日：2014-05-20
申请号：US12989179
申请日：2009-04-16
申请人： Joerg Erich Sorg , Stefan Gruber
发明人： Joerg Erich Sorg , Stefan Gruber
IPC分类号： G03B15/02 , G03B15/06
CPC分类号： F21V33/0052 , F21Y2115/10 , H04M1/22
摘要： A luminous unit (1) for an optical recording device (13) comprising a light source (2) for generating radiation and a partly reflective element, which is disposed downstream of the light source (2) in a main emission direction (H) and subdivides a space into a first half-space facing the light source (2) and a second half-space remote from the light source (2), wherein the partly reflective element at least partly transmits the radiation coming from the light source (2) from the first half-space and at least partly reflects the external radiation coming from an opposite direction from the second half-space.
摘要翻译：一种用于光学记录装置（13）的发光单元（1），包括用于产生辐射的光源（2）和部分反射元件，所述光源单元设置在所述光源（2）的主发射方向（H）的下游，以及将空间细分成面向光源（2）的第一半空间和远离光源（2）的第二半空间，其中部分反射元件至少部分透射来自光源（2）的辐射，并且至少部分地反映来自与第二半空间相反的方向的外部辐射。

5. 发明授权

US08994047B2 Arrangement comprising at least one optoelectronics semiconductor component 有权
标题翻译：包括至少一个光电半导体组件的布置
公开(公告)号：US08994047B2
公开(公告)日：2015-03-31
申请号：US12808165
申请日：2008-11-19
申请人： Georg Bogner , Stefan Gruber , Michael Zitzlsperger
发明人： Georg Bogner , Stefan Gruber , Michael Zitzlsperger
IPC分类号： H01L33/00 , H01L33/48 , H01L33/44 , H01L25/075
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/44 , H01L2224/48091 , H01L2224/48464 , H01L2924/00014
摘要： An arrangement having at least one optoelectronic semiconductor component includes a carrier element suitable for carrying the at least one optoelectronic semiconductor component. The arrangement comprises a housing body formed from a light-absorbing plastic. The housing body is arranged at the carrier element The housing body comprises an elevated region and a recessed region. An oblique flank is formed between the elevated and recessed regions. The recessed region reaches as far as the optoelectronic semiconductor component in order to reduce reflections.
摘要翻译：具有至少一个光电子半导体部件的布置包括适于承载至少一个光电子半导体部件的载体元件。该装置包括由吸光塑料形成的壳体。壳体设置在承载元件处。壳体包括升高区域和凹陷区域。在凸起和凹陷区域之间形成一个斜面。为了减少反射，凹陷区域达到光电子半导体部件的距离。

6. 发明授权

US09159889B2 Radiation-emitting component and method for producing radiation-emitting components 有权
标题翻译：辐射发射部件和用于产生辐射发射部件的方法
公开(公告)号：US09159889B2
公开(公告)日：2015-10-13
申请号：US13811846
申请日：2011-07-15
申请人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
发明人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
IPC分类号： H01L33/60 , H01L33/20 , H01L33/38 , H01L33/58 , G02F1/1335 , H01L25/075 , H01L33/40 , H01L33/46
CPC分类号： H01L33/60 , G02F1/133603 , H01L25/0753 , H01L25/0756 , H01L33/20 , H01L33/38 , H01L33/405 , H01L33/46 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.
摘要翻译：辐射发射部件包括半导体芯片，其具有第一主表面，与第一主表面相对的第二主表面和产生辐射的有源区域; 半导体芯片固定在第二主表面侧的载体; 输出层，布置在半导体芯片的第一主表面上，并在横向上形成与半导体芯片间隔开的横向输出表面，在输出层中形成在半导体芯片的方向上渐缩的凹部和偏转辐射在运行过程中从第一主表面向侧向输出表面的方向出现。

7. 发明申请

US20110002587A1 Housing for an Optoelectronic Component and Arrangement of an Optoelectronic Component in a Housing 有权
标题翻译：光电元件住房和房屋中光电元件的布置
公开(公告)号：US20110002587A1
公开(公告)日：2011-01-06
申请号：US12521352
申请日：2008-01-09
申请人： Georg Bogner , Stefan Gruber , Thomas Zeiler , Markus Kirsch
发明人： Georg Bogner , Stefan Gruber , Thomas Zeiler , Markus Kirsch
IPC分类号： G02B6/36
CPC分类号： H01L33/483 , H01L25/0753 , H01L25/167 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/00014
摘要： A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.
摘要翻译：塑料外壳设置在载体元件上，并设置有凹部，光电元件布置在该凹部中。在背离载体元件的一侧上，该凹部具有可以设置有透明盖的外部开口。可以在塑料壳体上提供一个或多个结构，以便相对于光电子部件定向盖和/或光学部件。

8. 发明申请

US20080251900A1 Conductor Frame For an Electronic Component and Method For the Production Thereof 有权
标题翻译：电子元件导体框架及其制造方法
公开(公告)号：US20080251900A1
公开(公告)日：2008-10-16
申请号：US11576054
申请日：2005-08-08
申请人： Karlheinz Arndt , Huey Ling Rena Lim , Georg Bogner , Stefan Gruber , Markus Schneider
发明人： Karlheinz Arndt , Huey Ling Rena Lim , Georg Bogner , Stefan Gruber , Markus Schneider
IPC分类号： H05K13/00 , H01L23/495
CPC分类号： H01L23/49541 , H01L23/495 , H01L23/49562 , H01L2924/0002 , Y10T29/49174 , H01L2924/00
摘要： Disclosed is a leadframe for at least one electronic component, comprising at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining a parallel offset between the retention tab and the adjacent region of lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.
摘要翻译：公开了一种用于至少一个电子部件的引线框架，包括至少两个电引线元件，每个电引线元件包括至少一个电引线接线片和至少一个保持接线片。提供在所述至少一个保持突片和所述引线元件之间的刻痕是限定所述保持突片和所述引线元件的相邻区域之间的平行偏移的刻痕。在引线元件和电引线接线片之间限定了额外的平行偏移，使得保持接线片和电引线接头位于共同的平面内。该分数使得能够容易地移除保持片，而不需要在引线元件和保持片之间存在不利的冲压间隙。

9. 发明授权

US08916900B2 Optoelectronic module and method of producing an optoelectronic module 有权
标题翻译：光电子模块及其制造方法
公开(公告)号：US08916900B2
公开(公告)日：2014-12-23
申请号：US13318504
申请日：2010-04-28
申请人： Georg Bogner , Stefan Gruber
发明人： Georg Bogner , Stefan Gruber
IPC分类号： H01L33/26 , H05K1/18 , H01L25/16
CPC分类号： H05K1/183 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H05K1/181 , H05K2201/10106 , H05K2201/10515 , H05K2201/10674 , H05K2201/10977 , H05K2203/049 , Y02P70/611 , H01L2924/00014
摘要： An optoelectronic module includes a radiation-emitting semiconductor component, an electrical component and a carrier substrate. The carrier substrate includes a top and a bottom, wherein first electrical connections are arranged on the bottom and second electrical connections are arranged on the top. The electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections. The radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate. The radiation-emitting semiconductor component furthermore includes conductive structures electrically conductively connected with the second electrical connections.
摘要翻译：光电子模块包括辐射发射半导体部件，电子部件和载体基板。载体基板包括顶部和底部，其中第一电连接布置在底部上，而第二电连接布置在顶部。电气部件布置在载体基板的顶部上并与第一电连接导电连接。辐射发射半导体部件布置在远离载体基板的电子部件侧。辐射发射半导体部件还包括与第二电连接导电连接的导电结构。

10. 发明申请

US20120056235A1 OPTOELECTRONIC MODULE AND METHOD OF PRODUCING AN OPTOELECTRONIC MODULE 有权
标题翻译：光电模块和生产光电模块的方法
公开(公告)号：US20120056235A1
公开(公告)日：2012-03-08
申请号：US13318504
申请日：2010-04-28
申请人： Georg Bogner , Stefan Gruber
发明人： Georg Bogner , Stefan Gruber
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H05K1/183 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H05K1/181 , H05K2201/10106 , H05K2201/10515 , H05K2201/10674 , H05K2201/10977 , H05K2203/049 , Y02P70/611 , H01L2924/00014
摘要： An optoelectronic module includes a radiation-emitting semiconductor component, an electrical component and a carrier substrate. The carrier substrate includes a top and a bottom, wherein first electrical connections are arranged on the bottom and second electrical connections are arranged on the top. The electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections. The radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate. The radiation-emitting semiconductor component furthermore includes conductive structures electrically conductively connected with the second electrical connections.
摘要翻译：光电子模块包括辐射发射半导体部件，电子部件和载体基板。载体基板包括顶部和底部，其中第一电连接布置在底部上，而第二电连接布置在顶部。电气部件布置在载体基板的顶部上并与第一电连接导电连接。辐射发射半导体部件布置在远离载体基板的电子部件侧。辐射发射半导体部件还包括与第二电连接导电连接的导电结构。

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