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1. 发明授权

US08283684B2 LED semiconductor body and use of an LED semiconductor body 有权
标题翻译： LED半导体体和使用LED半导体体
公开(公告)号：US08283684B2
公开(公告)日：2012-10-09
申请号：US12443155
申请日：2007-09-19
申请人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
发明人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
IPC分类号： H01L33/00
CPC分类号： H01L27/15 , H01L24/24 , H01L25/0756 , H01L25/167 , H01L33/08 , H01L2224/32145 , H01L2924/0002 , H01L2924/12036 , H01L2924/12041 , H01L2924/00
摘要： An LED semiconductor body includes a number of at least two radiation-generating active layers. Each active layer has a forward voltage, wherein the number of active layers is adapted to an operating voltage in such a way that the voltage dropped across a series resistor connected in series with the active layers is at most of the same magnitude as a voltage dropped across the LED semiconductor body. The invention furthermore describes various uses of the LED semiconductor body.
摘要翻译： LED半导体体包括多个至少两个辐射生成有源层。每个有源层具有正向电压，其中有源层的数量适应于工作电压，使得跨过与有源层串联连接的串联电阻器上的电压与电压下降最多相同的大小跨越LED半导体体。本发明还描述了LED半导体本体的各种用途。

2. 发明授权

US08203160B2 LED semiconductor body and use of an LED semiconductor body 有权
公开(公告)号：US08203160B2
公开(公告)日：2012-06-19
申请号：US12443155
申请日：2007-09-19
申请人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
发明人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
IPC分类号： H01L33/00
摘要： An LED semiconductor body includes a number of at least two radiation-generating active layers. Each active layer has a forward voltage, wherein the number of active layers is adapted to an operating voltage in such a way that the voltage dropped across a series resistor connected in series with the active layers is at most of the same magnitude as a voltage dropped across the LED semiconductor body. The invention furthermore describes various uses of the LED semiconductor body.

3. 发明申请

US20110240955A1 LED Semiconductor Body and Use of an LED Semiconductor Body 有权
标题翻译： LED半导体器件和LED半导体器件的使用
公开(公告)号：US20110240955A1
公开(公告)日：2011-10-06
申请号：US12443155
申请日：2007-09-19
申请人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
发明人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
IPC分类号： H01L27/15
CPC分类号： H01L27/15 , H01L24/24 , H01L25/0756 , H01L25/167 , H01L33/08 , H01L2224/32145 , H01L2924/0002 , H01L2924/12036 , H01L2924/12041 , H01L2924/00
摘要： An LED semiconductor body includes a number of at least two radiation-generating active layers. Each active layer has a forward voltage, wherein the number of active layers is adapted to an operating voltage in such a way that the voltage dropped across a series resistor connected in series with the active layers is at most of the same magnitude as a voltage dropped across the LED semiconductor body. The invention furthermore describes various uses of the LED semiconductor body.
摘要翻译： LED半导体体包括多个至少两个辐射生成有源层。每个有源层具有正向电压，其中有源层的数量适应于工作电压，使得跨过与有源层串联连接的串联电阻器上的电压与电压下降最多相同的大小跨越LED半导体体。本发明还描述了LED半导体本体的各种用途。

4. 发明申请

US20100084964A1 Arrangement and Method for Generating Mixed Light 有权
标题翻译：产生混合光的布置和方法
公开(公告)号：US20100084964A1
公开(公告)日：2010-04-08
申请号：US12524890
申请日：2008-01-30
申请人： Stefan Groetsch , Georg Bogner , Berthold Hahn , Volker Haerle , Kirstin Petersen
发明人： Stefan Groetsch , Georg Bogner , Berthold Hahn , Volker Haerle , Kirstin Petersen
IPC分类号： H01J1/62
CPC分类号： H01L33/508 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014
摘要： At least two semiconductor components emit electromagnetic radiation in different wavelength ranges. The superimposition of these electromagnetic radiations of all semiconductor components has at least one fraction in the visible wavelength range. At least one of the semiconductor components has a luminescence conversion element in the beam path.
摘要翻译：至少两个半导体部件发射不同波长范围的电磁辐射。所有半导体组件的这些电磁辐射的叠加在可见波长范围内至少有一个分数。至少一个半导体部件在光束路径中具有发光转换元件。

5. 发明授权

US5808323A Microoptical device with mirrors 失效
标题翻译：带镜子的微光学装置
公开(公告)号：US5808323A
公开(公告)日：1998-09-15
申请号：US625636
申请日：1996-03-29
申请人： Werner Spaeth , Stefan Groetsch , Ralf Moser , Georg Bogner
发明人： Werner Spaeth , Stefan Groetsch , Ralf Moser , Georg Bogner
IPC分类号： G02B27/09 , G02B27/14 , H01S3/00 , H01S3/101 , H01S5/00 , H01S5/40 , H01L33/00
CPC分类号： G02B19/0057 , G02B19/0028 , G02B27/1086 , G02B27/123 , H01S5/4025 , H01S3/005 , H01S5/005
摘要： The microoptical device has beam-parallelizing optics and a deflecting mirror configuration. The device converts a laser beam bundle, which is emitted by a laser diode strip structure or individual diode chips and which is comprised of a plurality of strip-shaped individual laser beams, into a rectangular or parallelogram-shaped laser beam bundle composed of parallelized strip-shaped individual laser beams arranged parallel next to one another. The beam-parallelizing optics may be a cylindrical lens, and the deflecting mirror configuration may be two rows of mirrors. The cylindrical lens and the rows of mirrors are preferably produced from a semiconductor material and they can therefore be produced cost effectively by means of methods used in semiconductor process engineering.
摘要翻译：微光器件具有光束并行光学元件和偏转镜配置。该装置将由激光二极管条状结构发射的激光束束或单独的二极管芯片转换成由平行四边形形状的激光束束组成的矩形或平行四边形的激光束束形的单个激光束彼此并排布置。光束平行化光学器件可以是柱面透镜，并且偏转镜配置可以是两排反射镜。柱面透镜和反射镜列优选由半导体材料制成，因此可以通过半导体工艺工程中使用的方法成本有效地制造。

6. 发明授权

US08664847B2 Arrangement and method for generating mixed light 有权
标题翻译：混合光的排列方法
公开(公告)号：US08664847B2
公开(公告)日：2014-03-04
申请号：US12524890
申请日：2008-01-30
申请人： Stefan Groetsch , Georg Bogner , Berthold Hahn , Volker Haerle , Kirstin Petersen
发明人： Stefan Groetsch , Georg Bogner , Berthold Hahn , Volker Haerle , Kirstin Petersen
IPC分类号： H05B33/02
CPC分类号： H01L33/508 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014
摘要： At least two semiconductor components emit electromagnetic radiation in different wavelength ranges. The superimposition of these electromagnetic radiations of all semiconductor components has at least one fraction in the visible wavelength range. At least one of the semiconductor components has a luminescence conversion element in the beam path.
摘要翻译：至少两个半导体部件发射不同波长范围的电磁辐射。所有半导体组件的这些电磁辐射的叠加在可见波长范围内至少有一个分数。至少一个半导体部件在光束路径中具有发光转换元件。

7. 发明申请

US20130135883A1 Optoelectronic Lighting Module and Motor Vehicle Headlight 有权
标题翻译：光电照明模块和机动车头灯
公开(公告)号：US20130135883A1
公开(公告)日：2013-05-30
申请号：US13700047
申请日：2011-06-24
申请人： Frank Singer , Thomas Haug , Alexander Sauerer , Hagen Luckner , Stefan Groetsch
发明人： Frank Singer , Thomas Haug , Alexander Sauerer , Hagen Luckner , Stefan Groetsch
IPC分类号： F21V29/00 , B60Q1/04
CPC分类号： F21V29/502 , B60Q1/04 , F21S41/141 , F21S41/19 , F21V19/004 , H01L33/641 , H01L2224/48091 , H05K1/0203 , H05K1/0306 , H05K1/142 , H05K3/0061 , H05K2201/09745 , H05K2201/10106 , H05K2201/10393 , H05K2201/10409 , H01L2924/00014
摘要： In at least one embodiment of the optoelectronic lighting module the lighting module has a cooling body, a printed circuit board, and a substrate. One or more optoelectronic semiconductor chips is/are arranged on a substrate upper face. The semiconductor chips are electrically connected to the substrate. At least one retaining device lies directly or indirectly on the substrate upper face and presses a substrate lower face against a cooling body upper face. The substrate is electrically connected to the printed circuit board. The retaining device is electrically insulated from the at least one semiconductor chip.
摘要翻译：在光电照明模块的至少一个实施例中，照明模块具有冷却体，印刷电路板和衬底。一个或多个光电子半导体芯片被布置在基板上表面上。半导体芯片电连接到基板。至少一个保持装置直接或间接地位于基板上表面上，并将基板下表面压靠在冷却体上表面上。基板电连接到印刷电路板。保持装置与至少一个半导体芯片电绝缘。

8. 发明申请

US20110116752A1 OPTOELECTRONIC MODULE AND OPTOELECTRONIC ARRANGEMENT 有权
标题翻译：光电模块和光电子装置
公开(公告)号：US20110116752A1
公开(公告)日：2011-05-19
申请号：US12922492
申请日：2009-04-17
申请人： Frank Singer , Stefan Groetsch
发明人： Frank Singer , Stefan Groetsch
IPC分类号： G02B6/36
CPC分类号： F21V17/10 , F21K9/00 , F21S41/141 , F21S41/25 , F21V5/04 , F21V17/06 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic module comprising: at least one light-emitting diode chip arranged on a carrier, and a mounting attachment fastened to the carrier and at least partly covering the light-emitting diode chip, and having a structured top which allows positioning of an optical element.
摘要翻译：一种光电模块，包括：布置在载体上的至少一个发光二极管芯片和紧固到所述载体的至少部分覆盖所述发光二极管芯片的安装附件，并且具有结构化顶部，其允许光学元件。

9. 发明申请

US20100038666A1 Lens Arrangement and LED Display Device 有权
标题翻译：镜头布置和LED显示设备
公开(公告)号：US20100038666A1
公开(公告)日：2010-02-18
申请号：US12520007
申请日：2007-12-21
申请人： Stefan Groetsch , Moritz Engl , Steffen Koehler , Simon Bluemel , Michael Hiegler , Thomas Zeiler
发明人： Stefan Groetsch , Moritz Engl , Steffen Koehler , Simon Bluemel , Michael Hiegler , Thomas Zeiler
IPC分类号： H01L33/00 , G02B9/04
CPC分类号： G02B7/028 , H01L33/58
摘要： A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.
摘要翻译：用于LED显示装置的透镜装置包括透镜。透镜具有第一透镜表面和光轴。光轴穿透透镜的第一透镜表面。此外，透镜装置包括透明过渡体，透明过渡体与第一透镜表面上的透镜牢固地连接，其比透镜更耐温，并且具有平行于透镜的光轴的光轴。

10. 发明授权

US07567597B2 Semiconductor device with a cooling element 有权
标题翻译：具有冷却元件的半导体器件
公开(公告)号：US07567597B2
公开(公告)日：2009-07-28
申请号：US10522518
申请日：2003-06-10
申请人： Stefan Groetsch
发明人： Stefan Groetsch
IPC分类号： H01S3/04 , H01S5/00
CPC分类号： H01S5/4025 , H01L23/473 , H01L2924/0002 , H01S5/02272 , H01S5/02423 , H01S5/02484 , H01L2924/00
摘要： A semiconductor device comprising a semiconductor component, particularly a power laser diode bar, disposed on a cooling element, wherein the cooling element contains in its interior a cooling channel for conducting a coolant. The coolant channel comprises in at least one region microstructures for effective heat transfer to the coolant. The semiconductor component substantially completely overlaps the region of the cooling channel comprising the microstructures. Disposed between the semiconductor component and the cooling element is an intermediate support so arranged and configured that it compensates for mechanical stresses between the semiconductor component and the cooling element occurring as a result of differing thermal expansions of the semiconductor component and the cooling element. The material of the cooling element particularly preferably has a high modulus of elasticity such that the compensation takes place substantially within the elastic strain regime.
摘要翻译：一种半导体器件，包括设置在冷却元件上的半导体部件，特别是功率激光二极管条，其中冷却元件在其内部包含用于引导冷却剂的冷却通道。冷却剂通道包括至少一个区域微结构，用于有效地传递给冷却剂。半导体部件与包括微结构的冷却通道的区域基本上完全重叠。设置在半导体部件和冷却元件之间的是中间支撑件，其被布置和构造成补偿由于半导体部件和冷却元件的不同的热膨胀而导致的半导体部件和冷却元件之间的机械应力。冷却元件的材料特别优选具有高弹性模量，使得补偿基本上在弹性应变状态内发生。

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