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    • 31. 发明授权
    • Low ceiling temperature process for a plasma reactor with heated source of a polymer-hardening precursor material
    • 具有聚合物硬化前体材料的加热源的等离子体反应器的低天花板温度过程
    • US06818140B2
    • 2004-11-16
    • US10002397
    • 2001-10-31
    • Jian Ding
    • Jian Ding
    • H01L2100
    • H01J37/32871C23C16/517H01F2029/143H01J37/32082H01J37/321H01J37/32146H01J37/32165H01J37/32458H01J37/32467H01J37/32522H01J37/32688H01J37/32706H01J2237/3343H01J2237/3345H01J2237/3346H01J2237/3382H01L21/31116H01L21/6831
    • A high plasma density etch process for etching an oxygen-containing layer overlying a non-oxygen containing layer on a workpiece in a plasma reactor chamber, by providing a chamber ceiling overlying the workpiece and containing a semiconductor material, supplying into the chamber a process gas containing etchant precursor species, polymer precursor species and hydrogen, applying plasma source power into the chamber, and cooling the ceiling to a temperature range at or below about 150 degrees C. The etchant and polymer precursor species contain fluorine, and the chamber ceiling semiconductor material includes a fluorine scavenger precursor material. Preferably, the process gas includes at least one of CHF3 and CH2F2. Preferably, the process gas further includes a species including an inert gas, such as HeH2 or Ar. If the chamber is of the type including a heated fluorine scavenger precursor material, this material is heated to well above the polymer condensation temperature, while the ceiling is cooled. In some cases, the plasma source power applicator is an inductive antenna overlying the semiconductor ceiling, and the ceiling has a cooling/heating apparatus contacting the ceiling through semiconductor rings. The inductive antenna in this case constitutes inductive elements between adjacent ones of the semiconductor rings.
    • 一种高等离子体密度蚀刻工艺,用于在等离子体反应器室中蚀刻覆盖工件上的非含氧层的含氧层,通过提供覆盖在工件上并容纳半导体材料的室顶部,向腔室供应工艺气体 包含蚀刻剂前体物质,聚合物前体物质和氢气,将等离子体源功率施加到室中,并将天花板冷却到约150℃或以下的温度范围。蚀刻剂和聚合物前体物质含有氟,并且室顶部半导体材料 包括氟清除剂前体材料。 优选地,工艺气体包括CHF 3和CH 2 F 2中的至少一种。 优选地,处理气体还包括包含惰性气体的物质,例如HeH 2或Ar。 如果室是包括加热的氟清除剂前体材料的类型,则将该材料加热到高于聚合物冷凝温度,同时天花板被冷却。 在一些情况下,等离子体源功率施加器是覆盖在半导体天花板上的感应天线,天花板具有通过半导体环接触天花板的冷却/加热设备。 在这种情况下,感应天线在相邻的半导体环之间构成感应元件。
    • 32. 发明授权
    • Tunable process for selectively etching oxide using fluoropropylene and a hydrofluorocarbon
    • 使用氟丙烯和氢氟烃选择性地蚀刻氧化物的可调谐方法
    • US06183655B2
    • 2001-02-06
    • US09049862
    • 1998-03-27
    • Ruiping WangGerald Z. YinRobert W. WuJian Ding
    • Ruiping WangGerald Z. YinRobert W. WuJian Ding
    • C03C2568
    • H01L21/31116
    • A plasma etch process, particularly applicable to a self-aligned contact etch or other advanced structures requiring high-selectivity to nitride or other non-oxide materials and producing no etch stop. The process is preferably performed in a high-density plasma reactor for etching holes with either high or low aspect rations. In this process, hexafluoropropylene (C3F6) is the principal etching gas and another hydrofluorocarbon such as CH2F2 or C3H2F6 is added at least in part for its polymer-forming ability, which increases selectivity of etching oxide to nitride. The process gas also includes a substantial amount of an inactive gas such as argon. The process gas mixture can be balanced between the active etching gas and the polymer former in proportions to optimize selectivity over other materials without the occurrence of etch stop in narrow contact holes and with a wide process window.
    • 等离子体蚀刻工艺,特别适用于需要对氮化物或其他非氧化物材料的高选择性并且不产生蚀刻停止的自对准接触蚀刻或其它高级结构。 该方法优选在高密度等离子体反应器中进行,用于蚀刻具有高或低纵横比的孔。 在该方法中,六氟丙烯(C 3 F 6)是主要的蚀刻气体,并且至少部分地由于其聚合物形成能力而添加另一种氢氟烃,例如CH 2 F 2或C 3 H 2 F 6,这增加了蚀刻氧化物对氮化物的选择性。 工艺气体还包括大量惰性气体如氩气。 工艺气体混合物可以在有效蚀刻气体和聚合物成型剂之间以比例平衡,以优于其它材料的选择性,而不会在狭窄的接触孔和宽的工艺窗口中发生蚀刻停止。
    • 34. 发明授权
    • Protective coating for dielectric material on wafer support used in
integrated circuit processing apparatus and method of forming same
    • 用于集成电路处理装置的晶片支架上的电介质材料的保护涂层及其形成方法
    • US5560780A
    • 1996-10-01
    • US420620
    • 1995-04-12
    • Robert WuJian Ding
    • Robert WuJian Ding
    • C23C4/10H01L21/302H01L21/3065H01L21/683C23C16/00B25B11/00H01H3/00H01G3/00
    • H01L21/6831
    • Improvements in a wafer support apparatus used for electrostatic clamping of a wafer to the wafer support, and a method of making same, are disclosed wherein a dielectric material, formed on the surface of a wafer support facing the wafer to facilitate the electrostatic clamping, has a protective coating formed over the dielectric material to provide protection to the dielectric material against chemical attack from chemicals used during the processing of the semiconductor wafer. In a preferred embodiment, the protective coating comprises an aluminum compound, such as an oxide of aluminum or aluminum nitride, having a thickness ranging from about 1 micron to about 30 microns, but not exceeding about 50% of the thickness of the dielectric material so as to not interfere with the electrostatic charge used for clamping the wafer to the wafer support.
    • 公开了将用于将晶片静电夹持到晶片支架的晶片支撑装置的改进及其制造方法,其中形成在面向晶片的晶片支架的表面上以便于静电夹持的电介质材料具有 形成在电介质材料上的保护涂层,以提供对电介质材料的保护,防止在半导体晶片的加工过程中所使用的化学品的化学侵蚀。 在优选的实施方案中,保护性涂层包括铝化合物,例如铝或氮化铝的氧化物,其厚度范围为介电材料的厚度的约1微米至约30微米,但不超过约50% 以免干扰用于将晶片夹持在晶片支架上的静电电荷。