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    • 28. 发明授权
    • Methods of heat treatment and heat treatment apparatus for silicon oxide films
    • 氧化硅膜的热处理和热处理装置的方法
    • US06635589B2
    • 2003-10-21
    • US09286999
    • 1999-04-07
    • Shunpei YamazakiYasuhiko TakemuraMitsunori SakamaTomohiko SatoSatoshi TeramotoShigefumi Sakai
    • Shunpei YamazakiYasuhiko TakemuraMitsunori SakamaTomohiko SatoSatoshi TeramotoShigefumi Sakai
    • H01L2142
    • H01L21/28158C23C14/58C23C16/56H01L29/66757Y10S438/909Y10S438/91Y10S438/958
    • Silicon oxide films which are good as gate insulation films are formed by subjecting a silicon oxide film which has been formed on an active layer comprising a silicon film by means of a PVD method or CVD method to a heat treatment at 300-700° C. in a dinitrogen monoxide atmosphere, or in an NH3 or N2H4 atmosphere, while irradiating with ultraviolet light, reducing the hydrogen and carbon contents in the silicon oxide film and introducing nitrogen into the boundary with the silicon film in particular. Furthermore, silicon oxide films which are good as gate insulating films have been formed by subjecting silicon oxide films which have been formed on an active layer comprising a silicon film by means of a PVD method or CVD method to a heat treatment at 300-700° C. in an N2O atmosphere (or hydrogen nitride atmosphere) while irradiating with ultraviolet light, and then carrying out a heat treatment at 300-700° C. in a hydrogen nitride atmosphere (N2O atmosphere), and reducing the amount of hydrogen and carbon in the silicon oxide film and introducing nitrogen into the boundary with the silicon film in particular.
    • 作为栅极绝缘膜良好的氧化硅膜通过在300-700℃下通过PVD法或CVD法对形成在包含硅膜的有源层上的氧化硅膜进行热处理而形成。 在一氧化二氮气氛中,或在NH 3或N 2 H 4气氛中,同时用紫外线照射,降低氧化硅膜中的氢和碳含量,并将氮引入与硅膜的边界。 此外,作为栅极绝缘膜良好的氧化硅膜已经通过利用PVD法或CVD法在由硅膜的活性层上形成的氧化硅膜在300-700°的温度下进行热处理而形成 在氮氧化物气氛(N 2 O气氛)中在N2O气氛(或氮化氢气氛)中照射紫外线,然后在300-700℃下进行热处理,并减少氢和碳的量 在氧化硅膜中,特别是将氮引入与硅膜的边界。