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    • 4. 发明申请
    • Semiconductor device and method for producing it
    • 半导体装置及其制造方法
    • US20070138468A1
    • 2007-06-21
    • US11705710
    • 2007-02-14
    • Shunpei YamazakiNaoaki YamaguchiSetsuo Nakajima
    • Shunpei YamazakiNaoaki YamaguchiSetsuo Nakajima
    • H01L31/00
    • H01L27/12H01L27/124H01L27/1277H01L27/14609H01L29/42384H01L29/4908H01L29/66765
    • Disclosed is a technique of improving the heat resistance of the aluminum gate electrode in bottom-gate-type TFT of which the active layer is made of a crystalline silicon film. A pattern of a laminate of a titanium film 102 and an aluminum film 103 is formed on a glass substrate 101. The pattern is to give a gate electrode 100. Then, the titanium film 102 is side-etched. Next, the layered substrate is heated to thereby intentionally form hillocks and whiskers on the surface of the aluminum pattern 103. Next, the aluminum pattern 103 acting as an anode is subjected to anodic oxidation to form an oxide film 105 thereon. The anodic oxidation extends to the lower edge of the aluminum pattern 103, at which the titanium layer was side-etched. Next, a gate-insulating film 106 and an amorphous silicon film are formed. A mask is formed over the pattern, which is to give the gate electrode, and then a nickel acetate solution is applied to the layered structure. Thus, nickel is kept in contact with the surface of the structure. Next, this is heated to induce crystal growth in the silicon film from the region contacted with nickel to the masked region. In the bottom-gate-type TFT thus produced, the active layer is made of a crystalline silicon film. In this process, since the anodic oxide film is formed as in FIG. 1(C), aluminum does neither melt to flow away nor diffuse away. Thus, the heat resistance of the aluminum electrode formed is improved.
    • 公开了一种提高活性层由结晶硅膜制成的底栅型TFT中的铝栅电极的耐热性的技术。 在玻璃基板101上形成钛膜102和铝膜103的叠层图案。图案是给予栅电极100.然后,对钛膜102进行侧蚀刻。 接下来,加热层叠基板,从而有意地在铝图案103的表面上形成小丘和晶须。接下来,将用作阳极的铝图案103进行阳极氧化以在其上形成氧化膜105。 阳极氧化延伸到铝图案103的下边缘,钛层被侧蚀刻。 接下来,形成栅极绝缘膜106和非晶硅膜。 在图案上形成掩模,得到栅电极,然后将乙酸镍溶液施加到层状结构。 因此,镍与结构的表面保持接触。 接下来,将其加热以在与镍接触的区域中的硅膜中引起晶体生长至掩蔽区域。 在如此制造的底栅型TFT中,有源层由结晶硅膜制成。 在该方法中,由于阳极氧化膜如图1所示那样形成。 如图1(C)所示,铝既不熔化,也不会流失。 因此,形成的铝电极的耐热性得到改善。
    • 5. 发明授权
    • Electro-optical device
    • 电光装置
    • US07206053B2
    • 2007-04-17
    • US11073752
    • 2005-03-08
    • Hongyong ZhangNaoaki YamaguchiYasuhiko Takemura
    • Hongyong ZhangNaoaki YamaguchiYasuhiko Takemura
    • G02F1/1343
    • G02F1/136286G02F1/136209G02F1/136213G02F1/136227G02F2201/121G02F2201/40
    • An auxiliary capacitor for a pixel of an active matrix type liquid crystal display is provided without decreasing the aperture ratio. A transparent conductive film for a common electrode is formed under a pixel electrode constituted by a transparent conductive film with an insulation film provided there between. Further, the transparent conductive film for the common electrode is maintained at fixed potential, formed so as to cover a gate bus line and a source bus line, and configured such that signals on each bus line are not applied to the pixel electrode. The pixel electrode is disposed so that all edges thereof overlap the gate bus line and source bus line. As a result, each of the bus lines serves as a black matrix. Further, the pixel electrode overlaps the transparent conductive film for the common electrode to form a storage capacitor.
    • 提供一种用于有源矩阵型液晶显示器的像素的辅助电容器,而不会降低开口率。 用于公共电极的透明导电膜形成在由透明导电膜构成的像素电极之间,其间设置有绝缘膜。 此外,用于公共电极的透明导电膜保持固定电位,形成为覆盖栅极总线和源极总线,并且被配置为使得每个总线上的信号不被施加到像素电极。 像素电极被设置成使得其所有边缘与栅极总线和源极总线重叠。 结果,每条总线作为黑矩阵。 此外,像素电极与用于公共电极的透明导电膜重叠形成存储电容器。
    • 6. 发明授权
    • Method of manufacturing a TFT with laser irradiation
    • 用激光照射制造TFT的方法
    • US07166503B2
    • 2007-01-23
    • US10917373
    • 2004-08-13
    • Hongyong ZhangHideto OhnumaNaoaki YamaguchiYasuhiko Takemura
    • Hongyong ZhangHideto OhnumaNaoaki YamaguchiYasuhiko Takemura
    • H01L21/00
    • H01L27/1296H01L27/1214H01L27/127H01L29/66757H01L29/78618
    • In a thin film transistor (TFT), a mask is formed on a gate electrode, and a porous anodic oxide is formed in both sides of the gate electrode using a relatively low voltage. A barrier anodic oxide is formed between the gate electrode and the porous anodic oxide and on the gate electrode using a relatively high voltage. A gate insulating film is etched using the barrier anodic oxide as a mask. The porous anodic oxide is selectively etched after etching barrier anodic oxide, to obtain a region of an active layer on which the gate insulating film is formed and the other region of the active layer on which the gate insulating film is not formed. An element including at least one of oxygen, nitrogen and carbon is introduced into the region of the active layer at high concentration in comparison with a concentration of the other region of the active layer. Further, N- or P-type impurity is introduced into the active layer. Accordingly, high resistance impurity regions are formed in both sides of a channel forming region.
    • 在薄膜晶体管(TFT)中,在栅电极上形成掩模,并且使用相对低的电压在栅电极的两侧形成多孔阳极氧化物。 在栅电极和多孔阳极氧化物之间以及使用较高电压的栅电极上形成阻挡阳极氧化物。 使用阻挡阳极氧化物作为掩模蚀刻栅极绝缘膜。 在蚀刻阻挡阳极氧化物之后,选择性地蚀刻多孔阳极氧化物,以获得其上形成栅极绝缘膜的有源层的区域和不形成栅极绝缘膜的有源层的另一区域。 与活性层的其他区域的浓度相比,包含氧,氮和碳中的至少一种的元素以高浓度被引入活性层的区域。 此外,将N型或P型杂质引入有源层。 因此,在沟道形成区域的两侧形成高电阻杂质区域。