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    • 2. 发明授权
    • Method for manufacturing semiconductor device having metal silicide
    • 具有金属硅化物的半导体器件的制造方法
    • US07109108B2
    • 2006-09-19
    • US10938500
    • 2004-09-13
    • Yasuhiko TakemuraHongyong ZhangSatoshi Teramoto
    • Yasuhiko TakemuraHongyong ZhangSatoshi Teramoto
    • H01L21/4763
    • H01L27/12H01L27/124H01L29/458H01L29/4908H01L29/66757H01L29/78621H01L29/78696Y10S257/90
    • A thin film transistor device reduced substantially in resistance between the source and the drain by incorporating a silicide film, which is fabricated by a process comprising forming a gate insulator film and a gate contact on a silicon substrate, anodically oxidizing the gate contact, covering an exposed surface of the silicon semiconductor with a metal, and irradiating an intense light such as a laser beam to the metal film either from the upper side or from an insulator substrate side to allow the metal coating to react with silicon to obtain a silicide film. The metal silicide layer may be obtained otherwise by tightly adhering a metal coating to the exposed source and drain regions using an insulator formed into an approximately triangular shape, preferably 1 μm or less in width, and allowing the metal to react with silicon.A high performance TFT can be realized. The metal silicide layer achieves favorable contact with the source and the drain, and, since it has a lower resistivity than silicon, the parasitic resistance between the source and drain regions can be considerably lowered.
    • 薄膜晶体管器件通过并入硅化物膜而在源极和漏极之间的电阻基本上减小,该硅化物膜通过包括在硅衬底上形成栅极绝缘膜和栅极接触的方法制造,阳极氧化栅极接触,覆盖 用金属暴露硅半导体的表面,并从激光束的上侧或从绝缘体基板侧向金属膜照射激光等强光,使金属被膜与硅反应,得到硅化物膜。 金属硅化物层可以通过使用形成为大致三角形形状的绝缘体(优选为1μm以下)的宽度紧密地将金属涂层紧密地粘附到暴露的源极和漏极区域,并且允许金属与硅反应来获得。 可以实现高性能TFT。 金属硅化物层实现与源极和漏极的良好接触,并且由于其具有比硅更低的电阻率,所以源极和漏极区域之间的寄生电阻可以显着降低。