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    • 28. 发明授权
    • Selective oxidation of silicon in diode, TFT, and monolithic three dimensional memory arrays
    • 二极管,TFT和单片三维存储阵列中硅的选择性氧化
    • US07276403B2
    • 2007-10-02
    • US11237162
    • 2005-09-28
    • S. Brad Herner
    • S. Brad Herner
    • H01L21/84
    • H01L27/1021H01L21/84H01L27/105H01L27/1052H01L27/115H01L27/11521H01L27/11568H01L27/12
    • The present invention relates to use of selective oxidation to oxidize silicon in the presence of tungsten and/or tungsten nitride in memory cells and memory arrays. This technique is especially useful in monolithic three dimensional memory arrays. In one aspect of the invention, the silicon of a diode-antifuse memory cell is selectively oxidized to repair etch damage and reduce leakage, while exposed tungsten of adjacent conductors and tungsten nitride of a barrier layer are not oxidized. In some embodiments, selective oxidation may be useful for gap fill. In another aspect of the invention, TFT arrays made up of charge storage memory cells comprising a polysilicon/tungsten nitride/tungsten gate can be subjected to selective oxidation to passivate the gate polysilicon and reduce leakage.
    • 本发明涉及选择性氧化在存在于存储器单元和存储器阵列中的钨和/或氮化钨存在下氧化硅的用途。 这种技术在单片三维存储器阵列中特别有用。 在本发明的一个方面,二极管 - 反熔断存储器单元的硅被选择性地氧化以修复蚀刻损伤并减少泄漏,而相邻导体的暴露的钨和阻挡层的氮化钨不被氧化。 在一些实施方案中,选择性氧化可用于间隙填充。 在本发明的另一方面,可以对包括多晶硅/氮化钨/钨栅极的电荷存储单元组成的TFT阵列进行选择性氧化,以钝化栅多晶硅并减少泄漏。