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    • 21. 发明专利
    • Thermosetting resin composition and prepreg and laminate using the same
    • 使用相同的热固性树脂组合物和PREPREG和层压板
    • JP2010106149A
    • 2010-05-13
    • JP2008279839
    • 2008-10-30
    • Hitachi Chem Co Ltd日立化成工業株式会社
    • TSUCHIKAWA SHINJIKOTAKE TOMOHIKOIZUMI HIROYUKIMURAI AKIRA
    • C08G59/40C08J5/24C08K3/22C08L63/00H05K1/03
    • PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is excellent in Tg, copper foil adhesion, heat resistance, moisture resistance, flame retardance, resistance to copper-brazing heat, low dielectric characteristic and low dielectric loss tangent, and application thereof, e.g. to a prepreg, a laminate, etc.
      SOLUTION: The thermosetting resin composition contains: (A) a compound which has an acidic substituent and an N-substituted maleimide group within its molecular structure and is prepared by reacting (a) a maleimide compound having at least two N-substituted maleimide groups within a molecule and (b) an amine compound having an acidic substituent represented by formula (1) (wherein R
      1 is a hydroxyl group, a carboxyl group or a sulfonic acid group which is an acidic substituent; R
      2 is a hydrogen atom, a 1-5C aliphatic hydrocarbon group, a halogen atom, a hydroxyl group, a carboxy group or a sulfonic acid group; and x and y are each an integer of 1-4); (B) an aralkyl-modified epoxy resin; and (C) a metal hydrate having a pyrolysis temperature of ≥300°C as components.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供Tg,铜箔粘合性,耐热性,耐湿性,阻燃性,耐铜钎焊热性,低介电特性和低介电损耗角正切性优异的热固性树脂组合物,以及 其应用,例如 预浸料,层压体等。热固性树脂组合物含有:(A)在其分子结构内具有酸性取代基的化合物和N-取代的马来酰亚胺基团,其通过使(a) 在分子内具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物和(b)具有由式(1)表示的酸性取代基的胺化合物(其中R 1 是羟基,羧基 或作为酸性取代基的磺酸基; R SB 2是氢原子,1-5C脂族烃基,卤素原子,羟基,羧基或磺酸基; x和y各自为1-4的整数); (B)芳烷基改性环氧树脂; 和(C)热分解温度≥300℃的金属水合物作为组分。 版权所有(C)2010,JPO&INPIT
    • 23. 发明专利
    • Thermosetting resin composition, as well as prepreg, laminated plate, and printed wiring board using the same
    • 热固性树脂组合物,作为PREPREG,层压板和使用它的印刷线路板
    • JP2008163308A
    • 2008-07-17
    • JP2007242503
    • 2007-09-19
    • Hitachi Chem Co Ltd日立化成工業株式会社
    • KOTAKE TOMOHIKOTSUCHIKAWA SHINJIAKIYAMA MASANORI
    • C08G59/40B32B15/092B32B27/38C08J5/24H05K1/03
    • PROBLEM TO BE SOLVED: To provide a thermosetting resin composition well-balanced in all of the properties of copper foil adhesiveness, heat resistance, moisture resistance, flame retardancy, the heat resistance in the state of contacting with copper, low dielectric characteristics, and low dielectric loss tangent property by improving solubility of a guanamine compound in an organic solvent in a process of producing the thermosetting resin composition, and to provide a prepreg, a laminated plate, and a printed wiring board using the compound.
      SOLUTION: The thermosetting resin composition comprises a 6-substituted guanamine compound (a), a phenolic compound (b), an epoxy resin (c) having at least two epoxy groups in one molecule, and an organic solvent (d) and exists as a homogeneous solution. The prepreg, the laminated plate, and the printed wiring board are manufactured using the thermosetting resin composition.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了提供在铜箔的粘合性,耐热性,耐湿性,阻燃性,与铜接触的状态下的耐热性,低介电特性的所有性能均衡的热固性树脂组合物 ,并且在制造热固性树脂组合物的过程中改善胍胺化合物在有机溶剂中的溶解度,并提供使用该化合物的预浸料,层压板和印刷线路板的低介电损耗角正切性。 解决方案:热固性树脂组合物包含6-取代的胍胺化合物(a),酚类化合物(b),在一个分子中具有至少两个环氧基的环氧树脂(c)和有机溶剂(d) 并作为均匀溶液存在。 使用热固性树脂组合物制造预浸料,层压板和印刷线路板。 版权所有(C)2008,JPO&INPIT
    • 24. 发明专利
    • Guanamine compound-comtaining solution, thermosetting resin composition and prepreg, laminated plate, and printed wiring board using the same
    • 胍胺化合物溶液,热固性树脂组合物和PREPREG,层压板和使用其的印刷线路板
    • JP2008150575A
    • 2008-07-03
    • JP2007204361
    • 2007-08-06
    • Hitachi Chem Co Ltd日立化成工業株式会社
    • KOTAKE TOMOHIKOTSUCHIKAWA SHINJIAKIYAMA MASANORI
    • C08L61/10C08J5/24C08K5/3492H05K1/03
    • PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that has improved solubility of a guanamine compound in solvent, when a thermosetting resin composition is prepared, and shows good balance in all properties, metal foil adhesion, heat resistance, humidity resistance, flame retardation, metal-adhering heat resistance, specific inductive capacity, and dielectric loss tangent, and provide prepreg, laminated plate and printed wiring board.
      SOLUTION: The thermosetting resin composition comprises blending a guanamine compound-containing homogeneous solution (A) which contains 6-substituted guanamine compound (a), a phenol resin (b) having a softening point of ≤120°C, and an organic solvent (c), and a thermosetting resin (B). Further, prepregs, laminated plate and printed wiring boards are provided by using the same.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 解决问题的方法为了提供一种热固性树脂组合物,其具有改善胍胺化合物在溶剂中的溶解性,当制备热固性树脂组合物时,在所有性能,金属箔粘附性,耐热性,耐湿性方面均显示出良好的平衡 ,阻燃性,金属粘附耐热性,电感率以及介电损耗角正切性,并提供预浸料,层压板和印刷电路板。 解决方案:热固性树脂组合物包括将含有6-取代胍胺化合物(a)的含胍胺化合物的均匀溶液(A),软化点≤120℃的酚醛树脂(b)和 有机溶剂(c)和热固性树脂(B)。 此外,通过使用它们提供预浸料,层压板和印刷线路板。 版权所有(C)2008,JPO&INPIT
    • 27. 发明专利
    • Prepreg, laminated plate, and printed wiring board using thermocurable resin composition
    • PREPREG,层压板和使用可热固化树脂组合物的印刷线路板
    • JP2012246395A
    • 2012-12-13
    • JP2011119505
    • 2011-05-27
    • Hitachi Chemical Co Ltd日立化成工業株式会社
    • MIYATAKE MASATOKOTAKE TOMOHIKONAGAI SHUNSUKETAKANEZAWA SHINMURAI AKIRAUCHIMURA RYOICHITAKAHARA NAOKI
    • C08J5/24C08G59/50C08K5/18C08K7/14C08K9/06C08L79/00C08L101/00H05K1/03
    • PROBLEM TO BE SOLVED: To provide a laminated plate and a printed wiring board which are excellent in heat resistance and insulation reliability and in which impregnating ability of a thermocurable resin and adhesion of a thermocurable resin with a glass cloth are good.SOLUTION: This prepreg for a printed wiring board is obtained by a method including: impregnating a glass cloth treated with (C) a silane coupling agent represented by General Formula (I) (where Rrepresents a 1-5C divalent hydrocarbon group, Rrepresents hydrogen or a 1-10C monovalent hydrocarbon group, X represents OCH, OCH, or OCH, m represents an integer of 0 to 5, and plural Xs and Rs when present in plurality may be the same as or different from each other) with a thermocurable resin composition containing (A) a compound containing an unsaturated maleimide group obtained by reacting (a) a maleimide compound having at least two N-substituted maleimide groups in the molecule with (b) an amine compound having at least two primary amino groups in the molecule and (B) a thermocurable resin; heating-drying the glass cloth; and converting the glass cloth into a B-stage.
    • 要解决的问题:提供耐热性和绝缘可靠性优异,并且其中耐热树脂的浸渍能力和耐热树脂与玻璃布的粘附性良好的层压板和印刷线路板。 解决方案:用于印刷线路板的该预浸料通过以下方法获得:浸渍用(C)由通式(I)表示的硅烷偶联剂(其中R 1 表示1-5C的二价烃基,R表示氢或1-10C一价烃基,X表示OCH 3 ,OC 2 H 5 或OC 3 H 7 ,m表示0〜5的整数,多个X和R 2 相同或不同)与含有(A)含有不饱和马来酰亚胺基团的化合物的热固性树脂组合物通过使(a)在分子中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物与(b) 分子中具有至少两个伯氨基的胺化合物和(B)热固性树脂; 加热干燥玻璃布; 并将玻璃布转换成B级。 版权所有(C)2013,JPO&INPIT
    • 29. 发明专利
    • Thermocurable resin composition, prepreg using the thermocurable resin composition, laminated plate, and printed wiring board
    • 可热固性树脂组合物,使用可热固化树脂组合物,层压板和印刷线路板
    • JP2012111930A
    • 2012-06-14
    • JP2011117322
    • 2011-05-25
    • Hitachi Chemical Co Ltd日立化成工業株式会社
    • TAKAHARA NAOKIOSE MASAHISAUCHIMURA RYOICHIKATO IKUHIKOMIYATAKE MASATOKOTAKE TOMOHIKO
    • C08G59/40C08J5/24C08K3/22C08L63/00H05K1/03
    • PROBLEM TO BE SOLVED: To provide a thermocurable resin composition satisfying moisture resistance and adhesion and imparting heat resistance relative to a temperature condition in a lead-free soldering or a reflow soldering and an advantageous thermal coefficient of linear expansion.SOLUTION: This thermocurable resin composition is a thermocurable resin composition containing: a compound (A) obtained by reacting a maleimide compound (a) having in one molecule thereof, at least two N-substituted maleimide group with an amine compound (b) having an acidic substituent represented by General Formula (1) (where, when Rexists in a plurality, Rs represent each independently any one of a hydroxy group, a carboxy group, and a sulfonic acid group which are an acidic substituent; when Rexists in a plurality, Rs represent independently any one of a hydrogen atom, a 1C-5C aliphatic hydrocarbon group, a halogen atom, a hydroxy group, a carboxy group, and a sulfonic acid group; and x and y are each an integer of 1 to 4) and having in the molecule structure thereof, an acidic substituent and an N-substituted maleimide group; an epoxy resin (B); a metal hydrate (C) having a thermal decomposition temperature of 300°C or higher; and a modified imidazole compound (D).
    • 要解决的问题:提供一种满足耐湿性和粘合性并且在无铅焊接或回流焊接中相对于温度条件赋予耐热性和有利的线性膨胀热系数的热固性树脂组合物。 解决方案:该热固性树脂组合物是含有下列化合物的热固性树脂组合物:通过使具有1分子的马来酰亚胺化合物(a),至少2个N-取代马来酰亚胺基与胺化合物(b )具有由通式(1)表示的酸性取代基(其中当R 1 存在于多个时,R 1 独立地表示作为酸性取代基的羟基,羧基和磺酸基中的任一个;当多个R 2 时,R SB SB = “POST”> 2 独立地表示氢原子,1C-5C脂族烃基,卤素原子,羟基,羧基和磺酸基中的任何一个; x和y分别为 每个为1至4的整数),并且在其分子结构中具有酸性取代基和N-取代的马来酰亚胺基团; 环氧树脂(B); 热分解温度为300℃以上的金属水合物(C) 和改性咪唑化合物(D)。 版权所有(C)2012,JPO&INPIT