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1. 发明专利

JP2012228884A Prepreg, and laminate 审中-公开
标题翻译： PREPREG和LAMINATE
公开(公告)号：JP2012228884A
公开(公告)日：2012-11-22
申请号：JP2012141850
申请日：2012-06-25
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： TAKANEZAWA SHIN , INADA TEIICHI , MORITA KOJI , SAKAI KAZUNAGA , INOUE YASUO
IPC分类号： B29B15/08 , B32B5/28 , B32B15/08
摘要： PROBLEM TO BE SOLVED: To provide a prepreg that can improve adhesion between prepregs without need of a low-molecular-weight component to be newly added for enhancing the fluidity of the resin and in a wide controllable range of the fluidity and also can improve the solder heat resistance in the case of a kind of resin highly filled with an inorganic filler, to provide a laminate including the prepreg, and to provide a process for producing the laminate.SOLUTION: The prepreg is produced by impregnating a reinforcing material with a resin and has through-holes. The laminate is formed by superposing two or more prepregs comprising the reinforcing material and the resin, on each other, and by disposing a metal foil on one side or both sides of the superposed prepregs to apply heat and pressure. The prepreg has through-holes in the thickness direction of the reinforcing material and the through-holes are filled with the resin.
摘要翻译：要解决的问题：提供一种可以提高预浸料坯之间的粘附性的预浸料，而不需要新添加的低分子量组分，以提高树脂的流动性，并且在流动性的宽可控范围内，以及可以提高在高填充无机填料的树脂的情况下的焊料耐热性，从而提供包含该预浸料的层压体，并提供层叠体的制造方法。解决方案：通过用树脂浸渍增强材料并具有通孔来制备预浸料坯。通过将包含增强材料和树脂的两个或更多个预浸料彼此叠置并且通过在叠置的预浸料的一侧或两侧上设置金属箔以加热和加压来形成层压体。预浸料坯在增强材料的厚度方向上具有通孔，并且通孔填充有树脂。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012162735A Thermosetting resin composition and method for producing the same, and prepreg and laminated plate using the same 有权
标题翻译：热固性树脂组合物及其制造方法，以及使用它们的预浸和层压板
公开(公告)号：JP2012162735A
公开(公告)日：2012-08-30
申请号：JP2012099186
申请日：2012-04-24
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： MORITA KOJI , TAKANEZAWA SHIN , SAKAI KAZUNAGA , EJIRI TAKAKO , TSUCHIKAWA SHINJI , AKIYAMA MASANORI , KOTAKE TOMOHIKO
IPC分类号： C08L101/00 , C08J5/24 , C08K7/22 , C08K9/04
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can reduce the coefficient of thermal expansion while suppressing an increase in volume fraction of an inorganic filler; a method for producing the same; and a prepreg using the thermosetting resin composition; and a laminated plate using the prepreg.SOLUTION: This thermosetting resin composition contains a thermosetting resin (A) and an inorganic porous material (B), where a part of the thermosetting resin (A) is impregnated in pores of the porous material (B); and the ratio (e/e) of the elastic modulus (e) of the porous material (B) at 25°C to the elastic modulus (e) of the cured product of the thermosetting resin (A) at 25°C is 5-100. The prepreg and the laminated plate using this are also provided.
摘要翻译：要解决的问题：提供一种能够降低热膨胀系数同时抑制无机填料的体积分数的增加的热固性树脂组合物; 其制造方法; 和使用该热固性树脂组合物的预浸料; 和使用该预浸料的层压板。解决方案：该热固性树脂组合物含有热固性树脂（A）和无机多孔材料（B），其中一部分热固性树脂（A）浸渍在多孔材料（B）的孔中; 和弹性模量（e B ）的比例（e B / e A < / SB>）与25℃下的热固性树脂（A）的固化物的弹性模量（e A ）相比，是5-100。还提供了预浸料和使用它的层压板。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2009280823A Resin composition, prepreg, laminate, and wiring board 有权
标题翻译：树脂组合物，PREPREG，层压板和接线板
公开(公告)号：JP2009280823A
公开(公告)日：2009-12-03
申请号：JP2009160940
申请日：2009-07-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MORITA KOJI , TAKANEZAWA SHIN , SAKAI KAZUNAGA , KONDO YUSUKE
IPC分类号： C08G59/20 , C08G59/40 , C08J5/24 , H05K1/03
CPC分类号： H05K1/0326 , C08G59/26 , C08J5/24 , H05K2201/068 , Y10T442/20
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive resin composition having a low thermal expansion, a prepreg, a laminate and a wiring board. SOLUTION: The resin composition is used for production of the laminate and contains an insulative resin having an aromatic ring. The inter-crosslink molecular weight of the insulative resin determined from a shear modulus at Tg or higher of the insulative resin having the aromatic ring is 300 to 1,000 at the stage after production of the laminate. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有低热膨胀率的廉价树脂组合物，预浸料，层压板和布线板。解决方案：树脂组合物用于生产层压体，并且含有具有芳环的绝缘树脂。由具有芳环的绝缘树脂的Tg以上的剪切弹性模量确定的绝缘性树脂的交联间分子量在层叠体的制造阶段为300〜1000。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009024177A Film with resin, laminate and wiring board 有权
标题翻译：树脂，层压板和布线板
公开(公告)号：JP2009024177A
公开(公告)日：2009-02-05
申请号：JP2008204303
申请日：2008-08-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MORITA KOJI , TAKANEZAWA SHIN , SAKAI KAZUNAGA , KONDO YUSUKE
IPC分类号： C08G59/20 , B32B15/08 , B32B15/092 , C08G59/40 , C08J5/24 , H05K1/03
CPC分类号： H05K1/0326 , C08G59/26 , C08J5/24 , H05K2201/068 , Y10T442/20
摘要： PROBLEM TO BE SOLVED: To provide resin composition which is inexpensive and lowly heat-expandable, and to provide a prepreg, a laminate and a wiring board.
SOLUTION: The resin composition is for use in producing laminates and is an insulating resin containing one or more crystalline epoxy resin having aromatic ring, preferably, containing a multi-cyclic compound, in which the molecular weight of segments between the crosslinked sites of the insulating resin, as determined from shear moduli at temperature not lower than the Tg of the insulating resin having aromatic rings, is 300-1,000, in the stage after manufacturing the laminate, and a film with the resin composition applied to the film.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供廉价且低热膨胀的树脂组合物，并提供预浸料，层压板和布线板。解决方案：该树脂组合物用于生产层压体，并且是含有一种或多种具有芳环的结晶环氧树脂的绝缘树脂，优选含有多环化合物，其中交联位点之间的链段的分子量在制造层叠体后的阶段中，绝缘树脂的绝对重量在300℃以上，在不低于具有芳香环的绝缘树脂的Tg的温度下，由剪切模量确定。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2008120989A Prepreg and laminate 审中-公开
标题翻译： PREPREG和LAMINATE
公开(公告)号：JP2008120989A
公开(公告)日：2008-05-29
申请号：JP2007156587
申请日：2007-06-13
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANEZAWA SHIN , INADA TEIICHI , MORITA KOJI , SAKAI KAZUNAGA , INOUE YASUO
IPC分类号： C08J5/24 , B32B15/08 , C08K3/22 , C08L87/00
摘要： PROBLEM TO BE SOLVED: To provide a prepreg that can improve adhesion between prepregs without need of a low-molecular weight component to be additionally added for enhancing the fluidity of the resin and in a wide controllable range of the fluidity and also can improve the solder heat resistance in the case of a resin system highly filled with an inorganic filler, to provide a laminate comprising the prepreg and to provide a process for producing the laminate. SOLUTION: The prepreg is produced by impregnating a reinforcing material with a resin and has through-holes. The laminate is formed by laying two or more plies of prepreg comprising the reinforcing material and the resin one upon another, superposing a metal foil on one side or both sides of the multi-laid prepregs and applying heat and pressure wherein the prepreg has through-holes in the thickness direction of the reinforcing material and the through-holes are filled with the resin. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：待解决的问题：提供一种预浸料，其可以提高预浸料坯之间的粘合性，而不需要另外添加低分子量组分，以提高树脂的流动性，并且在流动性的宽可控范围内，并且还可以在高填充无机填料的树脂体系的情况下提高焊料耐热性，提供包含预浸料的层压体，并提供层合体的制造方法。解决方案：通过用树脂浸渍增强材料并具有通孔来制备预浸料坯。层压体通过将包含增强材料和树脂的两层或更多层预浸料叠置在另一层上，在多层预浸料坯的一侧或两侧叠置金属箔并施加热和压力而形成，其中预浸料坯具有通孔，增强材料的厚度方向的孔和通孔被树脂填充。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007009169A Prepreg, and laminate board and print circuit board by using the same 审中-公开
标题翻译： PREPREG和层压板和打印电路板使用相同
公开(公告)号：JP2007009169A
公开(公告)日：2007-01-18
申请号：JP2005318772
申请日：2005-11-01
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NARABE YOSHIYUKI , SAKAI KAZUNAGA , SATO YOSHINORI
IPC分类号： C08J5/24 , B32B15/08 , C08G59/62 , H05K1/03 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a halogen-free prepreg excellent in heat resistance, flame retardance, punching-out property and insulation property, and a laminate board and printed circuit board by using the same.
SOLUTION: This prepreg is obtained by impregnating a thermosetting resin composition containing a phenol resin in a paper substrate impregnation-treated in advance with a composition containing an alkoxysilane derivative and/or the condensate of the alkoxysilane derivative, and heating for drying, and the laminate board and printed circuit board by using the same are also obtained.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供耐热性，阻燃性，冲孔性和绝缘性优异的无卤预浸料，以及通过使用它们的层压板和印刷电路板。解决方案：该预浸料通过在含有烷氧基硅烷衍生物和/或烷氧基硅烷衍生物的缩合物的组合物预先浸渍处理的纸基材中浸渍含有酚醛树脂的热固性树脂组合物，并进行干燥加热，并且也获得了通过使用它们的层压板和印刷电路板。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2004123894A Laminate 审中-公开
公开(公告)号：JP2004123894A
公开(公告)日：2004-04-22
申请号：JP2002289602
申请日：2002-10-02
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SATO YOSHINORI , NARABE YOSHIYUKI , SAKAI KAZUNAGA
IPC分类号： C08J5/24 , B29B15/12 , B29C70/88 , B32B15/08 , B32B27/04 , C08K5/5435 , C08L61/08 , H05K1/03
CPC分类号： B32B15/08 , B29B15/122 , B29C70/885 , B32B27/04 , B32B27/06 , B32B38/08 , B32B2038/0076 , B32B2260/021 , B32B2260/046 , B32B2305/08 , B32B2307/3065 , B32B2311/12 , B32B2398/10 , H05K1/0366 , H05K2201/0239
摘要： PROBLEM TO BE SOLVED: To obtain a laminate such as a thermosetting resin laminate, a thermosetting resin copper-clad laminate, etc., having an improved level of heat resistance and causing no bad condition such as swelling in a reflow process, etc., by impregnating a substrate such as a halogen-free phenol resin copper-clad laminate, etc., with a thermosetting resin containing no halogen-based flame retardant, heating and drying the substrate to give prepreg, piling a predetermined number of prepregs, optionally superposing a copper foil on its one side or both sides and laminating the copper foil to the substrate by heating under pressure.
SOLUTION: In the laminate obtained by impregnating the substrate with the thermosetting resin containing no halogen-based flame retardant, heating and drying the substrate to give the prepreg, piling the predetermined number of the prepregs, optionally superposing a copper foil on its one side or both sides and laminating the copper foil to the substrate by heating under pressure, a substrate obtained by impregnation with a solution containing an alkoxysilane derivative and/or its condensate is used as the substrate to give the laminate.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2007314782A Resin composition, prepreg, laminated board and wiring board 有权
标题翻译：树脂组合物，PREPREG，层压板和接线板
公开(公告)号：JP2007314782A
公开(公告)日：2007-12-06
申请号：JP2007116605
申请日：2007-04-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MORITA KOJI , TAKANEZAWA SHIN , SAKAI KAZUNAGA , KONDO YUSUKE
IPC分类号： C08G59/24 , C08G59/50 , C08G59/62 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition low in cost and low in thermal expansion, a prepreg, a laminated board and a wiring board. SOLUTION: The resin composition used for manufacturing the laminated board contains an insulating resin having aromatic ring, of which the molecular weight between bridging points obtained from modulus of shearing elasticity at its Tg (glass transition temperature) or higher, is 300-1,000 in the step after the manufacture of the laminated board. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供低成本和低热膨胀的树脂组合物，预浸料，层压板和布线板。解决方案：用于制造层压板的树脂组合物含有具有芳环的绝缘树脂，其Tg值（玻璃化转变温度）以上的剪切弹性模量的桥接点之间的分子量为300〜在制造层压板之后的步骤中为1,000。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007009170A Resin composition, and prepreg, laminate board and printed wiring board using the same 审中-公开
标题翻译：树脂组合物，和PREPREG，层压板和印刷线路板
公开(公告)号：JP2007009170A
公开(公告)日：2007-01-18
申请号：JP2005318773
申请日：2005-11-01
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SATO YOSHINORI , NARABE YOSHIYUKI , SAKAI KAZUNAGA
IPC分类号： C08L63/00 , B32B15/08 , C08J5/24 , C08K5/521 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition having a good preservation stability of varnish and a prepreg using the same and also capable of producing a laminate board having a good heat resistance, punching processability and flame retardance, and the prepreg, laminate board and printed wiring board using the same.
SOLUTION: This resin composition is provided by containing a dry oil-modified resol type resin, a melamine-modified novolac type phenol resin, a phosphate ester and an epoxy resin, and having 400-1,000 g/eq epoxy equivalent of the epoxy resin. The prepreg, laminate board and printed wiring board using the same are also provided.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了提供一种具有良好的清漆保存稳定性的树脂组合物和使用该树脂的预浸料，并且还能够制备具有良好耐热性，冲孔加工性和阻燃性的层压板，以及预浸料，层压板和使用其的印刷线路板。解决方案：该树脂组合物通过含有干油改性甲阶酚醛树脂，三聚氰胺改性酚醛树脂型酚醛树脂，磷酸酯和环氧树脂，并且具有400-1,000g /当量环氧当量的环氧树脂。还提供了预浸料，层压板和使用其的印刷线路板。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2006045377A Adhesive composition, copper foil with the adhesive, and copper-clad laminate given by using the same 审中-公开
标题翻译：胶粘组合物，带粘合剂的铜箔和使用它的铜箔层压板
公开(公告)号：JP2006045377A
公开(公告)日：2006-02-16
申请号：JP2004229266
申请日：2004-08-05
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SATO YOSHINORI , NARABE YOSHIYUKI , SAKAI KAZUNAGA
IPC分类号： C09J129/14 , B32B15/08 , C09J7/02 , C09J11/04 , C09J163/00 , C09J175/04
摘要： PROBLEM TO BE SOLVED: To provide a copper-clad laminate comprising a phenolic bonded paper laminate, capable of maintaining excellent tracking resistance and flame retardancy, even though a large amount of a flame retardant is not mixed into a resin composition for prepregs, to provide an adhesive composition suitable for producing the copper-clad laminate, and to provide copper foil with the adhesive.
SOLUTION: This adhesive composition contains polyvinyl butyral, a polyisocyanate resin, an epoxy resin, and aluminum hydroxide as essential components. The copper foil with the adhesive is obtained by using the adhesive composition as a varnish, applying it to one of surfaces of copper foil, and drying. The phenolic bonded paper copper-clad laminate is obtained by together molding the copper foil with the adhesive and the prepregs piled in a prescribed number.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使大量的阻燃剂不混入预浸料用树脂组合物中，为了提供能够保持优异的耐追踪性和阻燃性的包含酚醛键合纸叠层的覆铜层压板，以提供适于生产覆铜层压板的粘合剂组合物，并提供具有粘合剂的铜箔。解决方案：该粘合剂组合物含有聚乙烯醇缩丁醛，多异氰酸酯树脂，环氧树脂和氢氧化铝作为必需组分。通过使用粘合剂组合物作为清漆，将其施加到铜箔的一个表面上并干燥来获得具有粘合剂的铜箔。通过将铜箔与粘合剂一起成型并将预浸料堆放成规定数量来获得酚醛键合纸覆铜层压板。版权所有（C）2006，JPO＆NCIPI

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