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    • 27. 发明授权
    • Integrated semiconductor circuit having transistors that are switched with different frequencies
    • 具有以不同频率切换的晶体管的集成半导体电路
    • US06816432B2
    • 2004-11-09
    • US10146582
    • 2002-05-15
    • Robert FeurleDominique Savignac
    • Robert FeurleDominique Savignac
    • G11C800
    • H01L27/10873H01L21/823462H01L27/10894H01L27/10897
    • It is known to adapt the dimensions of transistors, in particular a layer thickness of a local gate oxide in a manner dependent on an operating voltage. Therefore, semiconductor circuits having transistors with different operating voltages are provided with transistors having gate oxides of different thicknesses. This allows the gate oxide thickness to be influenced even more extensively. In this case, account is taken of the fact that infrequently addressed transistors, in particular memory transistors given the same gate oxide thickness, have a significantly longer lifetime than frequently switched transistors. An integrated semiconductor circuit having transistors whose gate oxide thicknesses are adapted to the switching frequency having different magnitudes, is proposed.
    • 已知以取决于工作电压的方式适应晶体管的尺寸,特别是局部栅极氧化物的层厚度。 因此,具有不同工作电压的晶体管的半导体电路设置有具有不同厚度的栅极氧化物的晶体管。 这允许栅极氧化物厚度更广泛地影响。 在这种情况下,考虑到这样一个事实,即不常寻址的晶体管,特别是赋予相同栅极氧化物厚度的存储器晶体,具有比频率切换晶体管显着更长的寿命。 提出了具有栅极氧化物厚度适应于具有不同幅度的开关频率的晶体管的集成半导体电路。
    • 28. 发明授权
    • Method for fabricating an integrated circuit, in particular an antifuse
    • 用于制造集成电路的方法,特别是反熔丝
    • US06458631B1
    • 2002-10-01
    • US10079045
    • 2002-02-19
    • Axel BrintzingerUlrich FreyJürgen LindolfDominique SavignacStefan DankowskiMatthias LehrJochen MüllerKamel Ayadi
    • Axel BrintzingerUlrich FreyJürgen LindolfDominique SavignacStefan DankowskiMatthias LehrJochen MüllerKamel Ayadi
    • H01L2182
    • H01L23/5256H01L2924/0002H01L2924/00
    • The present invention provides a method for fabricating an integrated circuit, comprising the following steps: preparing a circuit substrate (1); providing a metallization region (10a) comprising a first metal in the circuit substrate (1); providing a first insulation layer (25) above the metallization region (10a); forming an opening (13) in the insulating layer (25) in order to uncover at least part of the surface of the metallization region (10a); depositing a functional layer (15′) above the resulting structure; depositing a second insulating layer (35) above the resulting structure, in such a manner that the opening (13) is filled; polishing-back of the second insulating layer (35) and of the functional layer (15′) in order to uncover the surface of the first insulating layer (25); forming a contact (11a′) in the second insulating layer (35) inside the opening (13) in order to make contact with the functional layer (15′); and providing an interconnect (40a) for electrical connection of the contact (11a′).
    • 本发明提供一种制造集成电路的方法,包括以下步骤:制备电路基板(1); 在所述电路基板(1)中提供包括第一金属的金属化区域(10a); 在所述金属化区域(10a)之上提供第一绝缘层(25); 在所述绝缘层(25)中形成开口(13),以便露出所述金属化区域(10a)的所述表面的至少一部分; 在所得结构上沉积功能层(15'); 以所述开口(13)填充的方式在所得结构上方沉积第二绝缘层(35); 第二绝缘层(35)和功能层(15')的抛光以便露出第一绝缘层(25)的表面; 在所述开口(13)内部的所述第二绝缘层(35)中形成接触(11a'),以与所述功能层(15')接触。 以及提供用于电连接触头(11a')的互连(40a)。
    • 29. 发明授权
    • Integrated memory having memory cells and buffer capacitors
    • 具有存储单元和缓冲电容器的集成存储器
    • US06456522B1
    • 2002-09-24
    • US09953729
    • 2001-09-17
    • Robert FeurleDominique Savignac
    • Robert FeurleDominique Savignac
    • G11C700
    • H01L29/66181H01L27/10805H01L27/10861H01L27/10897
    • An integrated memory includes memory cells each having a selector transistor and a storage capacitor. In each memory cell, the storage capacitor is connected to one of a plurality of column lines through the selector transistor, and a control terminal of the selector transistor is connected to one of a plurality of row lines. Buffer capacitors are each connected to a contact to another one of the column lines. The buffer capacitors are disposed in such a way that a connection between the respective buffer capacitor and the contact is disposed parallel to another one of the row lines. As a result, a permanently high dielectric strength is ensured through the use of the buffer capacitors.
    • 集成存储器包括各自具有选择晶体管和存储电容器的存储单元。 在每个存储单元中,存储电容器通过选择晶体管连接到多条列线之一,并且选择晶体管的控制端连接到多行行之一。 缓冲电容器各自连接到另一个列线的触点。 缓冲电容器以这样的方式设置,使得各个缓冲电容器和触点之间的连接平行于另一条行线设置。 结果,通过使用缓冲电容器确保了永久的高介电强度。
    • 30. 发明授权
    • Semiconductor memory configuration with a bit-line twist
    • 半导体存储器配置有位线扭曲
    • US06310399B1
    • 2001-10-30
    • US09514268
    • 2000-02-28
    • Robert FeurleSabine MandelDominique SavignacHelmut Schneider
    • Robert FeurleSabine MandelDominique SavignacHelmut Schneider
    • H01L2348
    • H01L27/10885H01L23/5225H01L27/10891H01L27/10897H01L2924/0002Y10S257/907H01L2924/00
    • A semiconductor memory configuration includes bit lines in a bit-line plane, a further plane different from the bit-line plane, word lines, and a memory cell area adjacent the bit-line plane, some of the bit lines having a twist running alongside others of the bit lines being untwisted, pairs of the some of the bit lines with a twist each respectively defining a twist bit-line pair, the twist bit-line pair having contacts for crossing one bit line of the twist bit-line pair over another bit line of the twist bit-line pair and over the memory-cell area through the further plane, the untwisted others of the bit lines having dummy contacts leading from the bit-line plane to the further plane. The dummy contacts lead to the word-line plane to give the word lines a homogeneous environment. The further plane can be a word-line plane including the word lines. The bit lines in the twist-free area can be approximately from 150 nm to 250 nm wide, preferably 200 nm. The twist area can only include the twist of the bit lines. The bit lines in the twist area can be approximately from 250 nm to 350 nm wide, preferably, 330 nm wide. The bit lines can have spacing from 150 to 180 nm wide. The bit lines, the word lines, the contacts, and the dummy contacts can be made from copper or aluminum.
    • 半导体存储器配置包括位线平面中的位线,不同于位线平面的另一个平面,字线和与位线平面相邻的存储单元区域,一些位线沿着一条扭转 位线中的其他位线被解捻,一些位线的对成对分别限定扭转位线对,扭转位线对具有用于使扭转位线对的一个位线交叉的触点 扭转位线对的另一个位线和通过另一个平面的存储单元区域之后,未扭绞的其它位线具有从位线平面引导到另一个平面的虚拟触点。 虚拟触点导致字线平面,使字线成为均匀的环境。 另外的平面可以是包括字线的字线平面。 无捻区域中的位线可以约为150nm至250nm宽,优选为200nm。 扭曲区域只能包括位线的扭曲。 扭转区域中的位线可以约为250nm至350nm宽,优选为330nm宽。 位线可以具有150至180nm宽的间距。 位线,字线,触点和虚拟触点可以由铜或铝制成。