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21. 发明授权

US08419964B2 Apparatus and method for edge bevel removal of copper from silicon wafers 有权
标题翻译：用于从硅晶片去除铜的边缘斜面的设备和方法
公开(公告)号：US08419964B2
公开(公告)日：2013-04-16
申请号：US12199412
申请日：2008-08-27
申请人： Kousik Ganesan , Shanthinath Ghongadi , Tariq Majid , Aaron Labrie , Steven T. Mayer
发明人： Kousik Ganesan , Shanthinath Ghongadi , Tariq Majid , Aaron Labrie , Steven T. Mayer
IPC分类号： H01L21/302
CPC分类号： H01L21/6708 , H01L21/02068 , H01L21/02087 , H01L21/0209 , H01L21/32134 , H01L21/67745 , H01L21/68735 , H01L21/68785
摘要： Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems provide the thin layer of pre-rinsing liquid before applying etchant at the edge bevel region of the wafer. The etchant is less diluted and diffuses faster through a thinned layer of rinsing liquid. An edge bevel removal embodiment involving that is particularly effective at reducing process time, narrowing the metal taper and allowing for subsequent chemical mechanical polishing, is disclosed.
摘要翻译：描述了用于从半导体晶片的边缘斜面区域去除金属的化学蚀刻方法和相关模块。在晶片的边缘斜面区域上施加蚀刻剂之前，该方法和系统提供了薄层的预漂洗液体。蚀刻剂较少稀释，并通过稀薄的冲洗液层更快地扩散。公开了一种边缘斜面去除实施例，其涉及在减少加工时间，使金属锥度变窄并允许随后的化学机械抛光方面特别有效。

22. 发明申请

US20110284386A1 THROUGH SILICON VIA FILLING USING AN ELECTROLYTE WITH A DUAL STATE INHIBITOR 有权
标题翻译：通过使用电解液与双态抑制剂进行填充的硅
公开(公告)号：US20110284386A1
公开(公告)日：2011-11-24
申请号：US13110488
申请日：2011-05-18
申请人： Mark J. Willey , Steven T. Mayer
发明人： Mark J. Willey , Steven T. Mayer
IPC分类号： C25D5/02 , C25D19/00 , C25D3/38
CPC分类号： C25D3/38 , C25D5/022 , C25D7/123 , C25D21/12 , H01L21/2885 , H01L21/76879 , H01L21/76898 , H01L23/53228 , H01L2924/0002 , H01L2924/00
摘要： A method for electrofilling large, high aspect ratio recessed features with copper without depositing substantial amounts of copper in the field region is provided. The method allows completely filling recessed features having aspect ratios of at least about 5:1 such as at least about 10:1, and widths of at least about 1 μm in a substantially void-free manner without depositing more than 5% of copper in the field region (relative to the thickness deposited in the recessed feature). The method involves contacting the substrate having one or more large, high aspect ratio recessed features (such as a TSVs) with an electrolyte comprising copper ions and an organic dual state inhibitor (DSI) configured for inhibiting copper deposition in the field region, and electrodepositing copper under potential-controlled conditions, where the potential is controlled not exceed the critical potential of the DSI.
摘要翻译：提供了一种用于电镀大量，高纵横比的凹陷特征与铜而不在现场区域中沉积大量铜的方法。该方法允许以基本无空隙的方式完全填充具有至少约5:1的纵横比（例如至少约10:1）和至少约1μm的宽度的凹陷特征，而不沉积超过5％的铜场区域（相对于沉积在凹陷特征中的厚度）。该方法包括将具有一个或多个大的，高纵横比的凹陷特征（例如TSV）的基底与包含铜离子的电解质和被配置用于抑制场区中的铜沉积的有机双态抑制剂（DSI）接触，以及电沉积在电势控制条件下，电位控制的铜不超过DSI的临界电位。

23. 发明申请

US20090277801A1 Photoresist-free metal deposition 有权
标题翻译：无光致抗蚀剂金属沉积
公开(公告)号：US20090277801A1
公开(公告)日：2009-11-12
申请号：US11890541
申请日：2007-08-06
申请人： Steven T. Mayer , John Stephen Drewery , Eric G. Webb
发明人： Steven T. Mayer , John Stephen Drewery , Eric G. Webb
IPC分类号： B23H3/00 , B05D3/00 , C25B9/00
CPC分类号： C25D5/022 , C25F5/00 , H05K3/07 , H05K3/108 , H05K2203/0108 , H05K2203/0392 , H05K2203/0537 , H05K2203/0713
摘要： Selectively accelerated or selectively inhibited metal deposition is performed to form metal structures of an electronic device. A desired pattern of an accelerator or of an inhibitor is applied to the substrate; for example, by stamping the substrate with a patterned stamp or spraying a solution using an inkjet printer. In other embodiments, a global layer of accelerator or inhibitor is applied to a substrate and selectively modified in a desired pattern. Thereafter, selective metal deposition is performed.
摘要翻译：进行选择性加速或选择性抑制金属沉积以形成电子器件的金属结构。将所需的促进剂或抑制剂的图案施加到基材上; 例如，通过用图案化的印模冲压基板或使用喷墨打印机喷涂溶液。在其它实施方案中，将全局加速剂或抑制剂层施加到基底上并以期望的图案选择性地修饰。此后，进行选择性金属沉积。

24. 发明授权

US07531079B1 Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation 失效
标题翻译：通过选择性搅拌均匀电解抛光镶嵌IC结构的方法和装置
公开(公告)号：US07531079B1
公开(公告)日：2009-05-12
申请号：US11065708
申请日：2005-02-23
申请人： Steven T. Mayer , John S. Drewery
发明人： Steven T. Mayer , John S. Drewery
IPC分类号： C25F3/16
CPC分类号： B23H5/08 , C25F3/16 , H01L21/32125 , H01L21/7684
摘要： The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.
摘要翻译：本发明涉及在大范围的特征尺寸上具有凹陷和凸起特征的金属表面的平坦化的装置和方法。本发明通过增加相对于凹陷区域的凸起区域中的流体搅拌来实现。也就是说，作为金属膜轮廓上的仰角的函数来搅动或更换电抛光浴液的搅动。海拔越高，浴液的运动或汇率越高。在本发明的优选方法中，通过使用在电解抛光过程中在晶片表面上移动（接近或接触）的微孔电解抛光垫来实现该搅拌。因此，本发明的方法是电抛光方法，其在一些情况下包括机械抛光元件。

25. 发明授权

US07405163B1 Selectively accelerated plating of metal features 有权
标题翻译：选择性加速电镀金属功能
公开(公告)号：US07405163B1
公开(公告)日：2008-07-29
申请号：US10824069
申请日：2004-04-13
申请人： John Stephen Drewery , Steven T. Mayer
发明人： John Stephen Drewery , Steven T. Mayer
IPC分类号： H01L21/303
CPC分类号： H05K3/184 , H01L21/4846 , H05K3/045 , H05K3/107 , H05K2203/054 , H05K2203/072
摘要： An accelerator solution is globally applied to a workpiece to form an accelerator film, and then a portion of the accelerator film is selectively removed from the workpiece to form an acceleration region having a higher concentration of accelerator. The higher concentration of accelerator causes metal to deposit at a faster rate in the acceleration region than in a non-accelerated region for the duration of metal deposition. To make a metal feature, a resist layer is applied to a workpiece surface and patterned to form a recessed region and a field region. Then, a metal seed layer is deposited on the workpiece surface. An accelerator solution is applied so that an accelerator film forms on the metal seed layer. A portion of the accelerator film is selectively removed from the field region, leaving another portion of the accelerator film in the recessed region. Then, copper is electroplated onto the workpiece, and the copper plates at an accelerated rate in the recessed region, resulting in a greater thickness of copper in the recessed region compared to copper in the field region. A wet etch is performed to remove copper from the field region. Then, the resist is removed from the field region, resulting in a coarse copper wire.
摘要翻译：将加速器溶液全局应用于工件以形成加速剂膜，然后将一部分加速剂膜从工件中选择性地除去，形成加速剂浓度较高的加速区域。在金属沉积期间，较高浓度的促进剂会导致金属在加速区域以比非加速区域更快的速率沉积。为了形成金属特征，将抗蚀剂层施加到工件表面并图案化以形成凹陷区域和场区域。然后，金属种子层沉积在工件表面上。施加促进剂溶液，使得在金属种子层上形成促进剂膜。加速膜的一部分从场区域选择性地去除，另外部分加速器膜在凹陷区域中。然后，在凹陷区域中以铜加速的方式将铜电镀到工件上，铜板以加速的速度电镀，导致与凹陷区域中的铜相比，凹陷区域中的铜的厚度更大。执行湿蚀刻以从场区域去除铜。然后，从场区域去除抗蚀剂，导致粗铜线。

26. 发明授权

US06709565B2 Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation 有权
标题翻译：通过选择性搅拌均匀电解抛光镶嵌结构的方法和装置
公开(公告)号：US06709565B2
公开(公告)日：2004-03-23
申请号：US09967075
申请日：2001-09-28
申请人： Steven T. Mayer , Robert J. Contolini , Eliot K. Broadbent , John S. Drewery
发明人： Steven T. Mayer , Robert J. Contolini , Eliot K. Broadbent , John S. Drewery
IPC分类号： B23H1100
CPC分类号： B23H5/08 , H01L21/32115 , H01L21/3212 , H01L21/32134
摘要： The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.
摘要翻译：本发明涉及在大范围的特征尺寸上具有凹陷和凸起特征的金属表面的平坦化的装置和方法。本发明通过增加相对于凹陷区域的凸起区域中的流体搅拌来实现。也就是说，作为金属膜轮廓上的仰角的函数来搅动或更换电抛光浴液的搅动。海拔越高，浴液的运动或汇率越高。在本发明的优选方法中，通过使用在电解抛光过程中在晶片表面上移动（接近或接触）的微孔电解抛光垫来实现该搅拌。因此，本发明的方法是电抛光方法，其在一些情况下包括机械抛光元件。

27. 发明授权

US06402923B1 Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element 有权
标题翻译：使用可变场成形元件对集成电路进行均匀电镀的方法和装置
公开(公告)号：US06402923B1
公开(公告)日：2002-06-11
申请号：US09537467
申请日：2000-03-27
申请人： Steven T. Mayer , Richard Hill , Alain Harrus , Evan Patton , Robert Contolini , Steve Taatjes , Jon Reid
发明人： Steven T. Mayer , Richard Hill , Alain Harrus , Evan Patton , Robert Contolini , Steve Taatjes , Jon Reid
IPC分类号： C25D500
CPC分类号： C25D17/08 , C25D7/123 , C25D17/001 , C25D17/008 , C25D17/12 , Y10S204/07
摘要： An electrochemical reactor is used to electrofill damascene architecture for integrated circuits. A shield is used to screen the applied field during electroplating operations to compensate for potential drop along the radius of a wafer. The shield establishes an inverse potential drop in the electrolytic fluid to overcome the resistance of a thin film seed layer of copper on the wafer.
摘要翻译：电化学反应器用于集成电路的大马士革结构。在电镀操作期间使用屏蔽来屏蔽施加的场，以补偿沿着晶片半径的电位降。屏蔽层在电解液中建立反向电位降，以克服晶片上铜的薄膜晶种层的电阻。

28. 发明授权

US06379842B1 Mixed lithium manganese oxide and lithium nickel cobalt oxide positive electrodes 失效
标题翻译：混合锂锰氧化物和锂镍钴氧化物正极
公开(公告)号：US06379842B1
公开(公告)日：2002-04-30
申请号：US09413744
申请日：1999-10-06
申请人： Steven T. Mayer
发明人： Steven T. Mayer
IPC分类号： H01M458
CPC分类号： H01M4/525 , H01M4/131 , H01M4/133 , H01M4/505 , H01M10/0525
摘要： Positive electrodes including a lithium nickel cobalt metal oxide are disclosed. The lithium nickel cobalt metal oxides have the general formula LixNiyCOzMnO2, where M is selected from the group consisting of aluminum, titanium, tungsten, chromium, molybdenum, magnesium, tantalum, silicon, and combinations thereof, x is between about 0 and about 1 and can be varied within this range by electrochemical insertion and extraction, the sum of y+z+n is about 1, n ranges between above 0 to about 0.25, y and z are both greater than 0, and the ratio z/y ranges from above 0 to about 1/3. Also disclosed are composite positive electrodes including the above-described lithium nickel cobalt metal oxides together with a lithium manganese metal oxide of the formula LixMn2−rM1rO4, where r is a value between 0 and 1 and M1 is chromium, titanium, tungsten, nickel, cobalt, iron, tin, zinc, zirconium, silicon, or a combination thereof.
摘要翻译：公开了包括锂镍钴金属氧化物的正电极。锂镍钴金属氧化物具有通式LixNiyCOzMnO2，其中M选自铝，钛，钨，铬，钼，镁，钽，硅及其组合，x为约0至约1，以及可以在该范围内通过电化学插入和提取而变化，y + z + n的和为约1，n在0至约0.25之间，y和z都大于0，z / y的比率范围为高于0至约1/3。还公开了包括上述锂镍钴金属氧化物和式LixMn2-rM1rO4的锂锰金属氧化物的复合正电极，其中r是0和1之间的值，M1是铬，钛，钨，镍，钴，铁，锡，锌，锆，硅或其组合。

29. 发明授权

US06201924B1 Disk-assisted editing for recorded video material 失效
标题翻译：用于录制视频素材的磁盘辅助编辑
公开(公告)号：US06201924B1
公开(公告)日：2001-03-13
申请号：US08482905
申请日：1995-06-07
申请人： Stephen E. Crane , LeeAnn Heringer , Michael Shinsky , Gerald A. Raitzer , Michael A. Ogrinc , Steven T. Mayer
发明人： Stephen E. Crane , LeeAnn Heringer , Michael Shinsky , Gerald A. Raitzer , Michael A. Ogrinc , Steven T. Mayer
IPC分类号： H04N576
CPC分类号： G11B27/024 , G11B27/028 , G11B27/032 , G11B27/034 , G11B27/34 , G11B2220/20 , G11B2220/2525 , G11B2220/90
摘要： A disk-assisted system for editing video tapes. Source material from video tapes is logged onto random access storage such as a hard disk drive using of a Macintosh-based computer system. At any one time, only a small portion of the tape material is stored as video frames on the computer disk. By software control, material is cached back and forth between the computer disk and the video tape. Thus editing is accomplished and an edit decision list constructed for compilation of the final video production. This provides the advantage of fast access time for editing of the material which is on the disk while allowing actual physical editing at the end of the project of the actual video tape material. The processes of logging the material onto the disk and editing the final tape are performed automatically.
摘要翻译：用于编辑录像带的磁盘辅助系统。来自视频磁带的源材料被记录到使用基于Macintosh的计算机系统的随机存取存储器例如硬盘驱动器上。在任何一个时间，只有一小部分磁带材料作为视频帧存储在计算机磁盘上。通过软件控制，材料在计算机磁盘和录像带之间来回缓存。因此编辑完成并且为编译最终的视频制作而构造的编辑决定列表。这提供了用于编辑磁盘上的材料的快速访问时间的优点，同时允许在实际录像带材料的项目结束时的实际物理编辑。将材料记录到磁盘上并编辑最终磁带的过程自动执行。

30. 发明授权

US5898564A Capacitor with a composite carbon foam electrode 失效
标题翻译：电容器用复合碳泡沫电极
公开(公告)号：US5898564A
公开(公告)日：1999-04-27
申请号：US760852
申请日：1996-12-02
申请人： Steven T. Mayer , Richard W. Pekala , James L. Kaschmitter
发明人： Steven T. Mayer , Richard W. Pekala , James L. Kaschmitter
IPC分类号： H01B1/04 , H01G9/04
CPC分类号： H01G11/24 , H01G11/30 , H01G11/34 , H01G11/42 , H01G11/46 , Y02E60/13
摘要： Carbon aerogels used as a binder for granularized materials, including other forms of carbon and metal additives, are cast onto carbon or metal fiber substrates to form composite carbon thin film sheets. The thin film sheets are utilized in electrochemical energy storage applications, such as electrochemical double layer capacitors (aerocapacitors), lithium based battery insertion electrodes, fuel cell electrodes, and electrocapacitive deionization electrodes. The composite carbon foam may be formed by prior known processes, but with the solid partides being added during the liquid phase of the process, i.e. prior to gelation. The other forms of carbon may include carbon microspheres, carbon powder, carbon aerogel powder or particles, graphite carbons. Metal and/or carbon fibers may be added for increased conductivity. The choice of materials and fibers will depend on the electrolyte used and the relative trade off of system resistivity and power to system energy.
摘要翻译：用作颗粒状材料（包括其他形式的碳和金属添加剂）的粘合剂的碳气凝胶被浇铸到碳或金属纤维基材上以形成复合碳薄膜片。薄膜片用于电化学储能应用，例如电化学双层电容器（aerocapacitors），锂基电池插入电极，燃料电池电极和电容去离子电极。复合碳泡沫可以通过先前已知的方法形成，但是在该方法的液相期间，即在凝胶化之前加入固体成分。碳的其他形式可以包括碳微球，碳粉，碳气凝胶粉或石墨碳。可以加入金属和/或碳纤维以增加导电性。材料和纤维的选择将取决于所使用的电解质和系统电阻率和功率对系统能量的相对折衷。

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