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1. 发明授权

US07405163B1 Selectively accelerated plating of metal features 有权
标题翻译：选择性加速电镀金属功能
公开(公告)号：US07405163B1
公开(公告)日：2008-07-29
申请号：US10824069
申请日：2004-04-13
申请人： John Stephen Drewery , Steven T. Mayer
发明人： John Stephen Drewery , Steven T. Mayer
IPC分类号： H01L21/303
CPC分类号： H05K3/184 , H01L21/4846 , H05K3/045 , H05K3/107 , H05K2203/054 , H05K2203/072
摘要： An accelerator solution is globally applied to a workpiece to form an accelerator film, and then a portion of the accelerator film is selectively removed from the workpiece to form an acceleration region having a higher concentration of accelerator. The higher concentration of accelerator causes metal to deposit at a faster rate in the acceleration region than in a non-accelerated region for the duration of metal deposition. To make a metal feature, a resist layer is applied to a workpiece surface and patterned to form a recessed region and a field region. Then, a metal seed layer is deposited on the workpiece surface. An accelerator solution is applied so that an accelerator film forms on the metal seed layer. A portion of the accelerator film is selectively removed from the field region, leaving another portion of the accelerator film in the recessed region. Then, copper is electroplated onto the workpiece, and the copper plates at an accelerated rate in the recessed region, resulting in a greater thickness of copper in the recessed region compared to copper in the field region. A wet etch is performed to remove copper from the field region. Then, the resist is removed from the field region, resulting in a coarse copper wire.
摘要翻译：将加速器溶液全局应用于工件以形成加速剂膜，然后将一部分加速剂膜从工件中选择性地除去，形成加速剂浓度较高的加速区域。在金属沉积期间，较高浓度的促进剂会导致金属在加速区域以比非加速区域更快的速率沉积。为了形成金属特征，将抗蚀剂层施加到工件表面并图案化以形成凹陷区域和场区域。然后，金属种子层沉积在工件表面上。施加促进剂溶液，使得在金属种子层上形成促进剂膜。加速膜的一部分从场区域选择性地去除，另外部分加速器膜在凹陷区域中。然后，在凹陷区域中以铜加速的方式将铜电镀到工件上，铜板以加速的速度电镀，导致与凹陷区域中的铜相比，凹陷区域中的铜的厚度更大。执行湿蚀刻以从场区域去除铜。然后，从场区域去除抗蚀剂，导致粗铜线。

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