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21. 发明专利

JP2008229846A Device and method for polishing, and top ring 审中-公开
标题翻译：抛光和顶环的装置和方法
公开(公告)号：JP2008229846A
公开(公告)日：2008-10-02
申请号：JP2008161081
申请日：2008-06-20
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KIMURA NORIO , YASUDA HOZUMI
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for polishing capable of preventing excess and deficiency of the polishing quantity at a peripheral edge of a semi-conductor wafer 4, performing polishing with a high degree of flatness, and intentionally increasing/decreasing the polishing quantity at the peripheral edge of the semi-conductor wafer 4, and to provide a top ring. SOLUTION: This polishing device is provided with a table 5 with polishing cloth attached on its upper surface, the top ring 1 holding an object to be polished, a first regulator regulating air pressure for giving a pressing force to the top ring 1, a guide ring 3 arranged vertically movably around the top ring 1, and a second regulator regulating air pressure for giving the pressing force to the guide ring 3 independently from the first one. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：为了提供能够防止半导体晶片4的周缘处的抛光量过多和不足的抛光装置和方法，以高度的平坦度进行抛光，并且有意地增加/减少半导体晶片4的周缘处的抛光量，并提供顶环。解决方案：该抛光装置设置有在其上表面上安装有抛光布的工作台5，保持待抛光对象的顶环1，调节用于向顶环1施加按压力的空气压力的第一调节器设置在顶环1周围可垂直移动的导向环3，以及调节空气压力的第二调节器，以独立于第一调节环3向导环3施加压力。版权所有（C）2009，JPO＆INPIT

22. 发明专利

JP2007308807A Electrolytic treating device and electric field state control method 审中-公开
标题翻译：电解处理装置和电场状态控制方法
公开(公告)号：JP2007308807A
公开(公告)日：2007-11-29
申请号：JP2007213896
申请日：2007-08-20
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： MAKINO NATSUKI , MISHIMA KOJI , KUNISAWA JUNJI , INOUE HIROAKI , KIMURA NORIO , ODAGAKI MITSUKO , TSUJIMURA MANABU , MATSUDA TETSURO , KANEKO HISAFUMI , MORITA TOSHIYUKI , OKUMURA KATSUYA
IPC分类号： C25D17/10 , C25D7/12 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic treating device which makes it possible to obtain the in-plane distribution of a desired plating film thickness by positively controlling the electric field state of the surface of a substrate to be treated and an electric field state control method for the same.
SOLUTION: A plating liquid 10 is filled between an anode 38 and the substrate W to be treated and a high-resistance structure 4 having the electrical conductivity lower than the electrical conductivity of the plating liquid 10 is installed between the anode 38 and the substrate W. The electric field on the surface of the substrate W is controlled by adjusting the thickness of the high resistant structure 4 or the shape of the high resistant structure 4 on a plane surface.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种电解处理装置，其可以通过积极地控制待处理的基板的表面的电场状态和电流来获得期望的镀膜厚度的面内分布场状态控制方法相同。解决方案：在阳极38和待处理的基板W之间填充电镀液10，将具有比电镀液10的导电性低的导电率的高电阻结构4安装在阳极38和通过在平面上调整高阻结构体4的厚度或耐高压结构体4的形状来控制基板W的表面上的电场。版权所有（C）2008，JPO＆INPIT

23. 发明专利

JP2006339665A Apparatus for manufacturing semiconductor substrate 审中-公开
标题翻译：制造半导体基板的装置
公开(公告)号：JP2006339665A
公开(公告)日：2006-12-14
申请号：JP2006169432
申请日：2006-06-19
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： KIMURA NORIO , MISHIMA KOJI , KUNISAWA JUNJI , MAKINO NATSUKI , TSUJIMURA MANABU , MATSUDA TETSURO , KANEKO HISAFUMI , OKUMURA KATSUYA
IPC分类号： H01L21/288 , C25D7/12 , C25D19/00 , H01L21/304 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor substrate suitable for a small-scaled manufacturing line, which can produce various products in small amounts, cope with a large change of the number of products, produce products having a short product life, and is capable of changing the function flexibly or updating the apparatus. SOLUTION: The apparatus for manufacturing the semiconductor substrate is equipped with a loader/unloader 120, a plurality of treatment units such as a plating film-forming film unit 113, and a transfer mechanism (robots 131-134) which transfers the semiconductor substrate between the units. The mounting portion of each unit has a guide. Each unit can be loaded to the apparatus for manufacturing the semiconductor substrate, or removed from the apparatus for manufacturing the semiconductor substrate, and exchanged for other units, by moving along the guide. The apparatus for manufacturing the semiconductor substrate is comprised by freely combining the units needed in the semiconductor manufacturing processes. And the units performing distinct treatments in the apparatus for manufacturing the semiconductor substrate can be exchanged each other. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供适合于能够少量生产各种产品的适合于小规模生产线的半导体基板的设备，可以应对产品数量的大量变化，生产具有产品寿命短，并且能够灵活地改变功能或更新设备。解决方案：用于制造半导体衬底的装置装备有装载器/卸载器120，多个处理单元如镀膜形成膜单元113和转移机构（机器人131-134）半导体衬底之间的单元。每个单元的安装部分都有一个导轨。每个单元可以被加载到用于制造半导体衬底的装置中，或者从用于制造半导体衬底的装置中移除，并且通过沿导向件移动而被交换到其它单元。用于制造半导体衬底的装置包括通过自由组合半导体制造工艺中所需的单元。并且在用于制造半导体衬底的装置中执行不同处理的单元可以彼此交换。版权所有（C）2007，JPO＆INPIT

24. 发明专利

JP2006272546A Polishing apparatus and method 审中-公开
标题翻译：抛光装置和方法
公开(公告)号：JP2006272546A
公开(公告)日：2006-10-12
申请号：JP2006157961
申请日：2006-06-07
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TSUJIMURA MANABU , KIMURA NORIO
IPC分类号： B24B37/04 , B24B21/00 , B24B37/00 , B24B37/10 , B24B37/20 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a so-called rotary type polishing apparatus having a rotary polishing table and a polishing method, wherein a polishing pad can be automatically changed without stopping a CMP process. SOLUTION: The polishing apparatus comprises a polishing table 10 for performing a turning or circulating motion, a top ring 14 which is arranged movable vertically above the polishing table 10, and holds a substrate W so as to mount and dismount it, a pair of rolls 22, 30 which can integrally move together with the polishing table 10 so as to rotate, and a polishing pad 36 which is wound around the one roll 22 and is taken up onto the other roll 30, and moves along the upper surface of the polishing table 10. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种所谓的具有旋转抛光台和抛光方法的旋转式抛光装置，其中抛光垫可以自动地改变而不停止CMP处理。解决方案：抛光装置包括用于进行转动或循环运动的抛光台10，可以在抛光台10上方垂直移动的顶环14，并且保持基板W以安装和拆卸它; 能够与抛光台10一起移动以便旋转的一对辊22,30，以及卷绕在一个辊22上并被卷绕到另一个辊30上并沿上表面移动的抛光垫36 的研磨台10.版权所有（C）2007，JPO＆INPIT

25. 发明专利

JP2005034992A Detection method of polishing endpoint 审中-公开
标题翻译：抛光端点检测方法
公开(公告)号：JP2005034992A
公开(公告)日：2005-02-10
申请号：JP2004315995
申请日：2004-10-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KIMURA NORIO , SAKATA FUMIHIKO , TAKAHASHI YOSHIMIZU
IPC分类号： B24B49/10 , B24B37/013 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a method which can detect an end point of polishing that becomes difficult to be detected by reciprocating a top ring. SOLUTION: In the polishing end point detection method, a polishing object 14 is polished into a flat and mirror face by pressing the top ring 13 holding the polishing object 14 on a piece of polishing cloth 11 bonded on a rotating turntable 12. The detection method comprises the steps of reciprocating the top ring 13 over the turntable 12 by a swing mechanism, detecting the current values of a turntable drive motor 16 at predetermined positions which are away in the same distance from the rotation center of the turntable 12 over which the top ring reciprocates, comparing the current values with the average value of the previously detected current values at the same positions, and detecting the change of polishing frictional force. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以通过使顶环往复运动来检测难以检测的抛光终点的方法。解决方案：在抛光终点检测方法中，通过将保持抛光对象14的顶环13压在接合在旋转转台12上的一块抛光布11上，将抛光对象14抛光成平面和镜面。检测方法包括以下步骤：通过摆动机构使顶环13在转台12上方往复运动，在与转台12的旋转中心相距离的预定位置处检测转盘驱动电动机16的电流值其中顶环往复运动，将当前值与先前检测到的当前值在相同位置的平均值进行比较，并检测抛光摩擦力的变化。版权所有（C）2005，JPO＆NCIPI

26. 发明专利

JP2004312036A Device and method of polishing 有权
标题翻译：装置和抛光方法
公开(公告)号：JP2004312036A
公开(公告)日：2004-11-04
申请号：JP2004177568
申请日：2004-06-15
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： OKUMURA KATSUYA , AOKI RIICHIRO , YAJIMA HIROMI , KODERA MASAKO , MISHIMA SHIRO , SHIGETA ATSUSHI , HIROSE MASAYOSHI , KIMURA NORIO , ISHIKAWA SEIJI
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a device and a method of polishing capable of carrying out a clean and dried object after the object for polishing is polished, cleaned and dried. SOLUTION: There are provided a polishing device which carries out the clean and dried object S for polishing, after the object S for polishing is carried in and cleaned, wherein the polishing sections 13, 14 which polish the object S, a cleaning section 15 which cleans and dries the object S for polishing after polished and a thickness gauge which measures the thickness of the object S for polishing. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供抛光，清洁和干燥抛光后的抛光对象的清洁和干燥物体的抛光装置和方法。提供一种抛光装置，其在进行用于抛光的物体S被进行和清洁之后，执行用于抛光的清洁和干燥物体S，其中抛光物体S的抛光部分13,14清洁清洗干燥被抛光对象物S的部分15和测量被研磨物S的厚度的厚度计。版权所有（C）2005，JPO＆NCIPI

27. 发明专利

JP2003080457A Cutting tool and manufacturing method therefor 审中-公开
标题翻译：切割工具及其制造方法
公开(公告)号：JP2003080457A
公开(公告)日：2003-03-18
申请号：JP2001272085
申请日：2001-09-07
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KIMURA NORIO , INOUE HIROAKI
IPC分类号： B24B53/12 , B24D3/00 , B24D3/06 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To certainly prevent dropping off of abrasive grains and to align a projected height of the abrasive grains by more strongly gripping the abrasive grains such as diamond by more uniform force, thereby to inhibit dispersion of CMP process performance in the case where they are used, for example, as a dresser additionally provided on the CMP device.
SOLUTION: Plating is applied in such a state that a part of the abrasive grains 44 is fitted into the large number of through holes 42a provided in an abrasive grain holder 42 and the abrasive grains 44 are fixed to the abrasive grain holder 42 by a plating film 46.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了确保防止磨粒的脱落，并且通过更均匀的力通过更强力地夹持诸如金刚石的磨料颗粒来对准磨粒的突出高度，从而在CMP工艺性能的分散它们例如用作另外设置在CMP装置上的修整器。解决方案：在将磨粒44的一部分嵌入到设置在磨粒保持器42中的大量贯通孔42a中的状态下进行电镀，将磨粒44通过镀层固定在磨粒保持架42上电影46。

28. 发明专利

JP2000077373A Cleaning method and polishing system for substrate 有权
标题翻译：基板清洗方法及抛光系统
公开(公告)号：JP2000077373A
公开(公告)日：2000-03-14
申请号：JP24679998
申请日：1998-09-01
申请人： Ebara Corp , 株式会社荏原製作所
发明人： WADA TAKETAKA , HIYAMA HIROKUNI , KIMURA NORIO
IPC分类号： H01L21/304 , B08B3/08 , B24B37/34 , B24B53/007 , B24B53/017 , H01L21/00
CPC分类号： B24B37/345 , B08B3/08 , B24B53/017 , H01L21/67051 , Y10S134/902
摘要： PROBLEM TO BE SOLVED: To perform cleaning of a substrate or dressing of a polishing tool efficiently without aggregating abrasive grains contained in the substrate or tool by supplying cleaning liquid to the plane of the substrate being polished such that pH of polishing liquid is not varied abruptly.
SOLUTION: A unit 40 for supplying cleaning liquid to each nozzle 28, 30, 32 of a rough cleaning system comprises a first cleaning liquid tank 42 storing first cleaning liquid having a pH of about 10 for polishing liquid of silica slurry, and a second cleaning liquid tank 44 storing second neutral cleaning liquid. They are combined on the downstream side of flow regulation valves 48a, 48b and branched to be coupled with respective nozzles 28, 30, 32. Opening of the flow regulation valves 48a, 48b can be regulated by means of a controller or a timer such that only the first cleaning liquid is supplied at first, ratio of the second cleaning liquid increases gradually and only the second neutral cleaning liquid is supplied finally.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：通过向被抛光的基板的平面供应清洁液体，使抛光液的pH不突然变化，有效地进行基材或抛光工具的修整，而不会聚集包含在基材或工具中的磨料颗粒。解决方案：用于向粗清洗系统的每个喷嘴28,30,32提供清洗液的单元40包括：第一清洗液箱42，其存储pH值为约10的第二清洗液，用于抛光二氧化硅浆液的液体;以及第二清洗存储第二中性清洁液的液体箱44。它们组合在流量调节阀48a，48b的下游侧，并分支以与相应的喷嘴28,30,32连接。流量调节阀48a，48b的打开可以通过控制器或定时器来调节，使得首先仅供给第一清洗液，第二清洗液的比例逐渐增加，最后仅供给第二中性清洗液。

29. 发明专利

JP2014059305A Glass substrate for imprinting, method for forming resist pattern, inspection method and inspection apparatus for glass substrate for imprinting 有权
标题翻译：用于印刷的玻璃基板，用于形成电阻图案的方法，用于印刷的玻璃基板的检查方法和检查装置
公开(公告)号：JP2014059305A
公开(公告)日：2014-04-03
申请号：JP2013206146
申请日：2013-10-01
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HATAKEYAMA MASAKI , KIMURA NORIO
IPC分类号： G01N23/225 , H01J37/22 , H01J37/29 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide an inspection method and an inspection apparatus for a glass substrate for imprinting, by which high sensitivity, a high-speed and a high throughput of inspection can be achieved.SOLUTION: The inspection method aims to inspect a glass substrate 30 for imprinting, which has a patterned surface 11 with a rugged pattern and a flat surface as a back surface of the patterned surface 11, both surfaces coated with a transparent conductive film 20. The method includes: an electron beam irradiation step of irradiating the patterned surface 11 of the glass substrate 30 for imprinting mounted on a stage with an electron beam having a predetermined irradiation area; an electron detection step of simultaneously detecting a plurality of electrons generating from the patterned surface by the irradiation with the electron beam through a detection surface having a plurality of pixels; and a defect detection step of acquiring an image of the patterned surface 11 based on the electrons detected by the detection surface and detecting a defect in the patterned surface 11. In the defect detection step, a foreign substance present on the patterned surface 11 is detected based on a difference between a signal when a mirror electron is detected in the electron detection step and a signal when a secondary emission electron is detected.
摘要翻译：要解决的问题：提供一种用于压印的玻璃基板的检查方法和检查装置，其可以实现高灵敏度，高速度和高检查吞吐量。解决方案：检查方法旨在检查玻璃用于压印的基板30，其具有凹凸图案的图案化表面11和作为图案化表面11的背面的平坦表面，两个表面都涂覆有透明导电膜20.该方法包括：电子束照射步骤，用于印刷的玻璃基板30的图案化表面11安装在具有预定照射区域的电子束的台上; 电子检测步骤，通过具有多个像素的检测表面同时检测由电子束照射从图案化表面产生的多个电子; 以及缺陷检测步骤，基于由检测表面检测的电子获取图案化表面11的图像，并检测图案化表面11中的缺陷。在缺陷检测步骤中，检测存在于图案化表面11上的异物基于在电子检测步骤中检测到镜电子的信号与检测到二次发射电子时的信号之间的差异。

30. 发明专利

JP2014052379A Specimen observation method and device, and inspection method and device using them 有权
标题翻译：标本观察方法和装置，以及使用它们的检查方法和装置
公开(公告)号：JP2014052379A
公开(公告)日：2014-03-20
申请号：JP2013203667
申请日：2013-09-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HATAKEYAMA MASACHIKA , MURAKAMI TAKESHI , NAITO YOSHIHIKO , TERAO KENJI , KIMURA NORIO , WATANABE KENJI
IPC分类号： G01N23/225 , H01J37/09 , H01J37/20 , H01J37/22 , H01J37/244 , H01J37/28 , H01J37/29
CPC分类号： H01J37/28 , H01J37/22 , H01J37/244 , H01J37/29 , H01J2237/24475 , H01J2237/24585 , H01J2237/24592 , H01J2237/2805 , H01J2237/2806 , H01J2237/2817 , H01L22/12
摘要： PROBLEM TO BE SOLVED: To provide a technique capable of improving observation ability of a specimen using an electron beam in an energy region conventionally not interested.SOLUTION: The sample observation method comprises: irradiating a specimen with an electron beam; detecting electrons to be observed generated by the irradiation with the electron beam and having information on the specimen; and forming an image of the specimen from the detected electrons to be observed. The irradiation with the electron beam intermingles secondary emission electrons and mirror electrons as the electrons to be observed by irradiating the specimen with the electron beam having landing energy set in a transition region between a secondary emission electron region where the secondary emission electrons are detected, and a mirror electron region where the mirror electrons are detected. The electrons to be observed are detected in the state where the secondary emission electrons and the mirror electrons are intermingled. A fine foreign matter or pattern of 100 nm or less can be observed and inspected at a high speed.
摘要翻译：要解决的问题：提供一种能够改善通常不感兴趣的能量区域中的电子束的样本的观察能力的技术。解决方案：样本观察方法包括：用电子束照射样本; 检测通过电子束的照射产生的待观察的电子，并且具有关于样本的信息; 并从所检测的电子形成待观察的样品的图像。电子束的照射将二次发射电子和镜面电子作为待观察的电子，通过用检测到二次发射电子的二次发射电子区域之间的过渡区域中设置着电能的电子束照射样品，检测镜电子的镜电子区域。在二次发射电子和镜电子混合的状态下检测待观察的电子。可以高速观察和检查100nm以下的微细异物或图案。

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