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    • 22. 发明授权
    • Method of fabricating a grayscale mask using a wafer bonding process
    • 使用晶片接合工艺制造灰度掩模的方法
    • US07682761B2
    • 2010-03-23
    • US11709008
    • 2007-02-20
    • Wei GaoBruce D. UlrichYoshi Ono
    • Wei GaoBruce D. UlrichYoshi Ono
    • G03F1/00
    • G03F1/68G03F1/50G03F1/54
    • A method of fabricating a grayscale mask includes preparing a quartz wafer; depositing a layer of Si3N4 on the quartz wafer; depositing a layer of titanium/TEOS directly on the Si3N4 layer on the backside of the quartz wafer; removing the layer of Si3N4 from the front side of the quartz wafer; depositing a layer of SRO directly on the front side of the quartz wafer; patterning a microlens array on the SRO layer; etching the SRO layer to form a microlens array in the SRO layer; depositing a layer of titanium; patterning and etching the titanium layer; depositing a layer of SiOxNy on the SRO microlens array; CMP to planarize the layer of SiOxNy removing the titanium/TEOS layer from the backside of the quartz wafer; bonding the planarized SiOxNy to a quartz reticle plate; and etching to remove Si3N4 from the bonded structure to form a grayscale mask reticle.
    • 制造灰度掩模的方法包括制备石英晶片; 在石英晶片上沉积一层Si3N4; 在石英晶片的背面的Si 3 N 4层上直接沉积钛/ TEOS层; 从石英晶片的前侧去除Si 3 N 4层; 在石英晶片的正面上直接沉积SRO层; 在SRO层上构图微透镜阵列; 蚀刻SRO层以在SRO层中形成微透镜阵列; 沉积一层钛; 图案化和蚀刻钛层; 在SRO微透镜阵列上沉积一层SiOxNy; CMP平面化从石英晶片的背面去除钛/ TEOS层的SiO x N y层; 将平坦化的SiO x N y键合到石英光罩板上; 并蚀刻以从结合结构去除Si 3 N 4,以形成灰度掩模掩模版。
    • 27. 发明申请
    • Rare earth element-doped oxide precursor with silicon nanocrystals
    • 具有硅纳米晶体的稀土元素掺杂氧化物前体
    • US20070238239A1
    • 2007-10-11
    • US11224549
    • 2005-09-12
    • Wei-Wei ZhuangYoshi OnoSheng Teng-HsuTingkai Li
    • Wei-Wei ZhuangYoshi OnoSheng Teng-HsuTingkai Li
    • H01L21/8238
    • H01L21/02156H01L21/02282H01L21/316
    • A method is provided for forming a rare earth element-doped silicon oxide (SiO2) precursor with nanocrystalline (nc) Si particles. In one aspect the method comprises: mixing Si particles into a first organic solvent, forming a first solution with a first boiling point; filtering the first solution to remove large Si particles; mixing a second organic solvent having a second boiling point, higher than the first boiling point, to the filtered first solution; and, fractionally distilling, forming a second solution of nc Si particles. The Si particles are formed by immersing a Si wafer into a third solution including hydrofluoric (HF) acid and alcohol, applying an electric bias, and forming a porous Si layer overlying the Si wafer. Then, the Si particles are mixed into the organic solvent by depositing the Si wafer into the first organic solvent, and ultrasonically removing the porous Si layer from the Si wafer.
    • 提供了用纳米晶体(nc)Si颗粒形成稀土元素掺杂的氧化硅(SiO 2)前体的方法。 一方面,该方法包括:将Si颗粒混合到第一有机溶剂中,形成具有第一沸点的第一溶液; 过滤第一溶液以除去大的Si颗粒; 将具有高于第一沸​​点的第二沸点的第二有机溶剂与过滤的第一溶液混合; 并分馏,形成nc Si颗粒的第二溶液。 通过将Si晶片浸入包括氢氟酸(HF)酸和醇的第三溶液中,施加电偏压并形成覆盖Si晶片的多孔Si层,形成Si颗粒。 然后,通过将Si晶片沉积到第一有机溶剂中,将Si颗粒混入有机溶剂中,并从Si晶片超声波除去多孔Si层。
    • 30. 发明授权
    • Thin film oxide interface
    • 薄膜氧化物界面
    • US07196383B2
    • 2007-03-27
    • US11046571
    • 2005-01-28
    • Pooran Chandra JoshiJohn W. HartzellMasahiro AdachiYoshi Ono
    • Pooran Chandra JoshiJohn W. HartzellMasahiro AdachiYoshi Ono
    • H01L29/772
    • H01L29/66757H01L29/4908H01L29/66772
    • An oxide interface and a method for fabricating an oxide interface are provided. The method comprises forming a silicon layer and an oxide layer overlying the silicon layer. The oxide layer is formed at a temperature of less than 400° C. using an inductively coupled plasma source. In some aspects of the method, the oxide layer is more than 20 nanometers (nm) thick and has a refractive index between 1.45 and 1.47. In some aspects of the method, the oxide layer is formed by plasma oxidizing the silicon layer, producing plasma oxide at a rate of up to approximately 4.4 nm per minute (after one minute). In some aspects of the method, a high-density plasma enhanced chemical vapor deposition (HD-PECVD) process is used to form the oxide layer. In some aspects of the method, the silicon and oxide layers are incorporated into a thin film transistor.
    • 提供氧化物界面和制造氧化物界面的方法。 该方法包括形成硅层和覆盖硅层的氧化物层。 使用电感耦合等离子体源在低于400℃的温度下形成氧化物层。 在该方法的一些方面,氧化物层的厚度大于20纳米(nm),折射率在1.45和1.47之间。 在该方法的一些方面,通过等离子体氧化硅层形成氧化物层,以每分钟高达约4.4nm的速率产生等离子体氧化物(1分钟后)。 在该方法的某些方面,使用高密度等离子体增强化学气相沉积(HD-PECVD)工艺来形成氧化物层。 在该方法的一些方面,将硅和氧化物层结合到薄膜晶体管中。