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11. 发明申请

US20070131562A1 Method and apparatus for planarizing a substrate with low fluid consumption 审中-公开
标题翻译：用于以低流体消耗平坦化基板的方法和装置
公开(公告)号：US20070131562A1
公开(公告)日：2007-06-14
申请号：US11298643
申请日：2005-12-08
申请人： Zhihong Wang , Ming-Kuei Tseng , Yuan Tian , Yongqi Hu , Stan Tsai
发明人： Zhihong Wang , Ming-Kuei Tseng , Yuan Tian , Yongqi Hu , Stan Tsai
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B24B37/04 , B24B57/02 , C25D5/06 , C25D5/08 , C25D7/12 , C25D17/001
摘要： The embodiments of the invention generally relate to a method and apparatus for processing a substrate with reduced fluid consumption. Embodiments of the invention may be beneficially utilized in chemical mechanical and electrochemical mechanical polishing processes, among other processes where conservation of a processing fluid disposed on a rotating pad is desirable. In one embodiment, a processing fluid delivery arm assembly is provided that includes a nozzle assembly supported at a distal end of an arm. The nozzle assembly includes a nozzle that is adjustable to control the delivery of fluid exiting therefrom in two planes relative to the arm. In another embodiment, processing fluid in the form of electrolyte fills holes formed at least partially through the pad as they enter the wet zone, and a current is driven through the electrolyte, filling the holes between a substrate and an electrode disposed below the surface of the pad.
摘要翻译：本发明的实施例一般涉及用于处理具有减少的流体消耗的基板的方法和装置。本发明的实施例可以有利地用于化学机械和电化学机械抛光工艺以及其它工艺中，其中设置在旋转焊盘上的处理流体的保护是期望的。在一个实施例中，提供了一种处理流体输送臂组件，其包括支撑在臂的远端处的喷嘴组件。喷嘴组件包括可调节的喷嘴，以控制从相对于臂的两个平面离开的流体的输送。在另一个实施方案中，电解液形式的处理流体在其进入湿区时填充至少部分地通过焊盘形成的孔，并且电流驱动通过电解质，填充基板和设置在下表面之下的电极之间的孔垫

12. 发明申请

US20070209946A1 Method and apparatus for evaluating polishing pad conditioning 失效
标题翻译：评估抛光垫调理的方法和装置
公开(公告)号：US20070209946A1
公开(公告)日：2007-09-13
申请号：US11370474
申请日：2006-03-08
申请人： Zhihong Wang , Yongqi Hu , Stan Tsai
发明人： Zhihong Wang , Yongqi Hu , Stan Tsai
IPC分类号： B23H5/06
CPC分类号： B23H5/08 , B24B53/017 , C25F3/02 , C25F7/00
摘要： A method and apparatus for evaluating a conditioned electrochemical mechanical polishing pad are provided. A polishing pad is conditioned using a first set of process conditions. A sheet wafer and a residue wafer are polished on the polishing pad. The removal rates of one or more materials from the sheet wafer and the residue wafer are measured. A normalized removal rate is calculated. The polishing pad is further conditioned if the normalized removal rate is not within a minimum value and a maximum value. In one embodiment, the normalized removal rate comprises a ratio of the removal rate of the residue wafer to the removal rate of the sheet wafer.
摘要翻译：提供了一种评价调理电化学机械抛光垫的方法和装置。使用第一组工艺条件对抛光垫进行调理。在抛光垫上抛光片状晶片和残留晶片。测量来自片状晶片和残留晶片的一种或多种材料的去除速率。计算归一化的去除率。如果归一化的去除速率不在最小值和最大值内，抛光垫被进一步调节。在一个实施例中，归一化去除速率包括残余晶片的去除速率与片晶片的去除速率的比率。

13. 发明授权

US07699972B2 Method and apparatus for evaluating polishing pad conditioning 失效
标题翻译：评估抛光垫调理的方法和装置
公开(公告)号：US07699972B2
公开(公告)日：2010-04-20
申请号：US11370474
申请日：2006-03-08
申请人： Zhihong Wang , Yongqi Hu , Stan D. Tsai
发明人： Zhihong Wang , Yongqi Hu , Stan D. Tsai
IPC分类号： C25F3/02 , B23H5/06
CPC分类号： B23H5/08 , B24B53/017 , C25F3/02 , C25F7/00
摘要： A method and apparatus for evaluating a conditioned electrochemical mechanical polishing pad are provided. A polishing pad is conditioned using a first set of process conditions. A sheet wafer and a residue wafer are polished on the polishing pad. The removal rates of one or more materials from the sheet wafer and the residue wafer are measured. A normalized removal rate is calculated. The polishing pad is further conditioned if the normalized removal rate is not within a minimum value and a maximum value. In one embodiment, the normalized removal rate comprises a ratio of the removal rate of the residue wafer to the removal rate of the sheet wafer.
摘要翻译：提供了一种评价调理电化学机械抛光垫的方法和装置。使用第一组工艺条件对抛光垫进行调理。在抛光垫上抛光片状晶片和残留晶片。测量来自片状晶片和残留晶片的一种或多种材料的去除速率。计算归一化的去除率。如果归一化的去除速率不在最小值和最大值内，抛光垫被进一步调节。在一个实施例中，归一化去除速率包括残余晶片的去除速率与片晶片的去除速率的比率。

14. 发明申请

US20120184251A1 DEVICE AND METHOD FOR PROCESSING SHORT MESSAGE SERVICE 有权
标题翻译：用于处理短消息服务的设备和方法
公开(公告)号：US20120184251A1
公开(公告)日：2012-07-19
申请号：US13432663
申请日：2012-03-28
申请人： Li Feng , Zhihong Wang , Lei Shi
发明人： Li Feng , Zhihong Wang , Lei Shi
IPC分类号： H04W4/14 , H04W4/12
CPC分类号： H04W4/14 , H04L67/1002 , H04L67/1034
摘要： A device and a method for processing a short message service are capable of high-reliably processing a short message service. The device for processing a short message service includes a plurality of access units and a plurality of service processing units, where each of the access units is connected to the plurality of service processing units. The access unit is configured to receive the short message service and send it to one of the service processing units, and send out the processed short message service from the service processing unit . The service processing unit is configured to process the short message service, and send out the processed short message service through one of the access units.
摘要翻译：用于处理短消息服务的设备和方法能够高可靠地处理短消息服务。用于处理短消息服务的设备包括多个接入单元和多个业务处理单元，其中每个接入单元连接到多个业务处理单元。访问单元被配置为接收短消息服务并将其发送到服务处理单元之一，并从服务处理单元发出处理的短消息服务。服务处理单元被配置为处理短消息服务，并且通过其中一个访问单元发送经处理的短消息服务。

15. 发明申请

US20120034845A1 TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING 审中-公开
标题翻译：将测量光谱匹配到用于现场光学监测的参考光谱的技术
公开(公告)号：US20120034845A1
公开(公告)日：2012-02-09
申请号：US13198635
申请日：2011-08-04
申请人： Xiaoyuan Hu , Zhihong Wang , Harry Q. Lee , Zhize Zhu , Jeffrey Drue David , Dominic J. Benvegnu , Jimin Zhang , Wen-Chiang Tu
发明人： Xiaoyuan Hu , Zhihong Wang , Harry Q. Lee , Zhize Zhu , Jeffrey Drue David , Dominic J. Benvegnu , Jimin Zhang , Wen-Chiang Tu
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B37/042 , B24B37/107 , B24B37/205 , B24B49/045 , B24B49/12
摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
摘要翻译：控制抛光的方法包括：存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术，以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关，并且选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考光谱。

16. 发明申请

US20120034844A1 SPECTROGRAPHIC MONITORING USING INDEX TRACKING AFTER DETECTION OF LAYER CLEARING 审中-公开
标题翻译：检测层清除后使用索引跟踪进行光谱监测
公开(公告)号：US20120034844A1
公开(公告)日：2012-02-09
申请号：US12851467
申请日：2010-08-05
申请人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
发明人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
IPC分类号： B24B49/12
CPC分类号： B24B37/042 , B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, polishing a substrate having a second layer overlying a first layer, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, detecting exposure of the first layer, fitting a function to a portion of the sequence of index values corresponding to spectra measured after detection of exposure of the first layer, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function.
摘要翻译：控制抛光的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关索引值，抛光具有覆盖第一层的第二层的衬底，测量第对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考序列确定每个最佳匹配光谱的相关索引值光谱以产生索引值序列，检测第一层的曝光，将功能拟合到对应于在检测到第一层的曝光之后测量的光谱的索引值序列的一部分，以及确定抛光终点中的至少一个或基于该功能的抛光速率的调整。

17. 发明申请

US20090061741A1 ECMP POLISHING SEQUENCE TO IMPROVE PLANARITY AND DEFECT PERFORMANCE 审中-公开
标题翻译： ECMP抛光顺序提高平面度和缺陷性能
公开(公告)号：US20090061741A1
公开(公告)日：2009-03-05
申请号：US11849724
申请日：2007-09-04
申请人： Zhihong Wang , Alain Duboust , Wei-Yung Hsu , Yan Wang
发明人： Zhihong Wang , Alain Duboust , Wei-Yung Hsu , Yan Wang
IPC分类号： B24B7/04
CPC分类号： B24B37/042 , H01L21/67219
摘要： A method for processing a substrate having a conductive layer disposed thereon is provided. The substrate is coupled with a planarizing head. The planarizing head is moved to a position above a polishing pad assembly. The planarizing pad is positioned relative to the polishing pad assembly without applying a voltage to the substrate. A first voltage is applied to the substrate for a first time period. A second voltage is applied to the substrate for a second time period in order to remove a portion of the conductive layer, wherein the second voltage is greater than the first voltage. In certain embodiments, applying a first voltage to the substrate further comprises forming a uniform passivation layer on the conductive layer.
摘要翻译：提供一种处理其上设置有导电层的基板的方法。衬底与平坦化头结合。平坦化头移动到抛光垫组件上方的位置。平面化焊盘相对于抛光垫组件定位，而不向衬底施加电压。第一次施加第一电压到基板。向基板施加第二电压第二时间段，以便去除导电层的一部分，其中第二电压大于第一电压。在某些实施例中，向衬底施加第一电压还包括在导电层上形成均匀的钝化层。

18. 发明申请

US20080003931A1 SYSTEM AND METHOD FOR IN-SITU HEAD RINSE 审中-公开
标题翻译：用于现场头部冲洗的系统和方法
公开(公告)号：US20080003931A1
公开(公告)日：2008-01-03
申请号：US11562811
申请日：2006-11-22
申请人： Antoine Manens , Alain Duboust , Paul Butterfield , Yan Wang , Shi-Ping Wang , Zhihong Wang , Andrew Nagengast , Wei-Yung Hsu , Liang-Yuh Chen
发明人： Antoine Manens , Alain Duboust , Paul Butterfield , Yan Wang , Shi-Ping Wang , Zhihong Wang , Andrew Nagengast , Wei-Yung Hsu , Liang-Yuh Chen
IPC分类号： B24B53/007
CPC分类号： B24B37/30 , B24B55/00 , H01L21/67219
摘要： A carrier head and a method of cleaning the carrier head are disclosed. The carrier head may have one or more openings through a sidewall that extend into a cavity within the carrier head using a fluid passage. The openings may each have a lip. The lip may have a chamfered edge. Additionally, a fluid passage may slope generally downward from the openings to the cavity. The chamfered lips and the sloped fluid passage reduce back splashing and help ensure that sufficient rinsing fluid reaches the cavity to rinse polishing fluid and particles from the carrier head. The present invention relates to carrier heads for polishing or planarizing semiconductor substrates by chemical mechanical polishing (CMP) or electrochemical mechanical polishing (ECMP). The cavities in the carrier head are cleaned by rinsing fluid (i.e., liquid or gas) from inside the cavity towards a substrate receiving side of the carrier head.
摘要翻译：公开了载体头和清洁载体头的方法。载体头部可以具有穿过侧壁的一个或多个开口，该侧壁使用流体通道延伸到载体头部内的空腔中。开口可以各自具有唇缘。唇缘可以具有倒角边缘。此外，流体通道可以从开口大致向下倾斜到空腔。倒角的唇缘和倾斜的流体通道减少了飞溅，并有助于确保足够的冲洗流体到达腔体以从载体头部漂洗抛光液和颗粒。本发明涉及用于通过化学机械抛光（CMP）或电化学机械抛光（ECMP）对半导体衬底进行抛光或平面化的载体头。载体头部中的空腔通过从空腔内部朝向承载头的基板接收侧的冲洗流体（即，液体或气体）来清洁。

19. 发明申请

US20070044913A1 Grooved Retaining Ring 失效
标题翻译：凹槽保持环
公开(公告)号：US20070044913A1
公开(公告)日：2007-03-01
申请号：US11468267
申请日：2006-08-29
申请人： Shi-Ping Wang , Alain Duboust , Antoine Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
发明人： Shi-Ping Wang , Alain Duboust , Antoine Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
IPC分类号： C03C15/00 , H01L21/306
CPC分类号： B24B37/32
摘要： A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another.
摘要翻译：描述了用于化学机械抛光的保持环。环具有具有不相交槽的底面。交替的槽彼此成相对的角度。

20. 发明授权

US06653763B2 Dual stage actuator systems for high density hard disk drives using annular rotary piezoelectric actuators 失效
标题翻译：双级致动器系统，用于使用环形旋转压电致动器的高密度硬盘驱动器
公开(公告)号：US06653763B2
公开(公告)日：2003-11-25
申请号：US09811112
申请日：2001-03-16
申请人： Zhihong Wang , Tamon Kasajima , Masashi Shiraishi , Ping Shang , Kai Wu
发明人： Zhihong Wang , Tamon Kasajima , Masashi Shiraishi , Ping Shang , Kai Wu
IPC分类号： H01L4108
CPC分类号： G11B5/5552 , G11B21/106 , G11B21/20 , H01L41/096 , H02N2/10
摘要： A piezoelectric actuator is disclosed including an annular piezoelectric element and a base. There is a gap along the radial direction of the annular piezoelectric element. One of the two ends, i.e., the fixed end of the said annular element, is connected to the base, while the other end is free. The base is made of piezoelectric materials. Furthermore, the annular element is divided into two or more annular parts along the direction of its circumference by the electrode patterns applied on its two opposite surface and/or its polarization directions. When driving voltages are applied, the actuator can generate roughly a rotary motion around the center of the annular piezoelectric element. The annular rotary actuator could be either a single plate or with multilayer structure. The present invention further relates to a dual stage head positioning actuator system of a hard disk drive with a plurality of disks and a plurality of vertically aligned head sliders mounted on distal ends of a plurality of suspensions via the annular piezoelectric actuators.
摘要翻译：公开了一种压电致动器，其包括环形压电元件和基座。沿着环形压电元件的径向存在间隙。两个端部中的一个，即所述环形元件的固定端连接到基座，而另一端是自由的。基座由压电材料制成。此外，通过施加在其两个相对表面和/或其偏振方向上的电极图案，环形元件沿其圆周方向被分成两个或更多个环形部分。当施加驱动电压时，致动器可围绕环形压电元件的中心大致产生旋转运动。环形旋转致动器可以是单板或具有多层结构。本发明还涉及具有多个盘的硬盘驱动器的双级头定位致动器系统和经由环形压电致动器安装在多个悬架的远端上的多个垂直对准的头滑块。

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