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1. 发明申请

US20070153453A1 Fully conductive pad for electrochemical mechanical processing 审中-公开
标题翻译：全导电垫用于电化学机械加工
公开(公告)号：US20070153453A1
公开(公告)日：2007-07-05
申请号：US11327527
申请日：2006-01-05
申请人： You Wang , Renhe Jia , Stan Tsai , Yongqi Hu , Zhihong Wang , Jie Diao , Gerald Alonzo
发明人： You Wang , Renhe Jia , Stan Tsai , Yongqi Hu , Zhihong Wang , Jie Diao , Gerald Alonzo
IPC分类号： H05K5/00 , H05K3/10
CPC分类号： C25F7/00 , B23H5/08 , B24B37/20 , Y10T29/49155 , Y10T29/49156
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a plurality of discrete members and a plurality of apertures. Each of the plurality of discrete members include a first conductive layer and a second conductive layer, with an isolation layer therebetween, and a recess for byproduct accumulation. The second conductive layer comprises a plurality of reaction surfaces that are orthogonal to the upper and lower surfaces of the pad assembly.
摘要翻译：提供了用于处理基板的垫组件的实施例。垫组件包括多个分立构件和多个孔。多个离散构件中的每一个包括第一导电层和第二导电层，其间具有隔离层，以及用于副产物积累的凹部。第二导电层包括与焊盘组件的上表面和下表面正交的多个反应表面。

2. 发明申请

US20070131562A1 Method and apparatus for planarizing a substrate with low fluid consumption 审中-公开
标题翻译：用于以低流体消耗平坦化基板的方法和装置
公开(公告)号：US20070131562A1
公开(公告)日：2007-06-14
申请号：US11298643
申请日：2005-12-08
申请人： Zhihong Wang , Ming-Kuei Tseng , Yuan Tian , Yongqi Hu , Stan Tsai
发明人： Zhihong Wang , Ming-Kuei Tseng , Yuan Tian , Yongqi Hu , Stan Tsai
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B24B37/04 , B24B57/02 , C25D5/06 , C25D5/08 , C25D7/12 , C25D17/001
摘要： The embodiments of the invention generally relate to a method and apparatus for processing a substrate with reduced fluid consumption. Embodiments of the invention may be beneficially utilized in chemical mechanical and electrochemical mechanical polishing processes, among other processes where conservation of a processing fluid disposed on a rotating pad is desirable. In one embodiment, a processing fluid delivery arm assembly is provided that includes a nozzle assembly supported at a distal end of an arm. The nozzle assembly includes a nozzle that is adjustable to control the delivery of fluid exiting therefrom in two planes relative to the arm. In another embodiment, processing fluid in the form of electrolyte fills holes formed at least partially through the pad as they enter the wet zone, and a current is driven through the electrolyte, filling the holes between a substrate and an electrode disposed below the surface of the pad.
摘要翻译：本发明的实施例一般涉及用于处理具有减少的流体消耗的基板的方法和装置。本发明的实施例可以有利地用于化学机械和电化学机械抛光工艺以及其它工艺中，其中设置在旋转焊盘上的处理流体的保护是期望的。在一个实施例中，提供了一种处理流体输送臂组件，其包括支撑在臂的远端处的喷嘴组件。喷嘴组件包括可调节的喷嘴，以控制从相对于臂的两个平面离开的流体的输送。在另一个实施方案中，电解液形式的处理流体在其进入湿区时填充至少部分地通过焊盘形成的孔，并且电流驱动通过电解质，填充基板和设置在下表面之下的电极之间的孔垫

3. 发明申请

US20070161250A1 Method for electrochemically mechanically polishing a conductive material on a substrate 失效
标题翻译：在基板上进行电化学机械研磨导电材料的方法
公开(公告)号：US20070161250A1
公开(公告)日：2007-07-12
申请号：US11328958
申请日：2006-01-09
申请人： You Wang , Zhihong Wang , Renhe Jia , Stan Tsai , Yongqi Hu
发明人： You Wang , Zhihong Wang , Renhe Jia , Stan Tsai , Yongqi Hu
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/7684 , B23H5/08 , H01L21/32125
摘要： Aspects of the present invention include a method and an apparatus that may be utilized to reduce dishing and improve cleaning efficiency of a material layer residue (e.g., copper residual) by varying a substrate potential in a substrate processing system. For example, by utilizing multiple polishing steps and applying different voltages (e.g., while a substrate is being in a polishing station), ECMP can be used to effectively reduce dishing and it can be used to enhance copper residual cleaning as well as minimizing a possibility of arcing, which can occur at the end of the polishing process, when a substrate is moved from a polishing station.
摘要翻译：本发明的方面包括可以通过改变衬底处理系统中的衬底电位来减少凹陷并提高材料层残留物（例如铜残留物）的清洁效率的方法和装置。例如，通过利用多个抛光步骤和施加不同的电压（例如，当衬底处于抛光站中时），ECMP可以用于有效地减少凹陷，并且可以用于增强铜残留清洁以及最小化可能性当抛光工位移动基板时，可能在抛光过程结束时发生电弧。

4. 发明申请

US20050218010A1 Process and composition for conductive material removal by electrochemical mechanical polishing 失效
标题翻译：通过电化学机械抛光去除导电材料的工艺和组成
公开(公告)号：US20050218010A1
公开(公告)日：2005-10-06
申请号：US11123274
申请日：2005-05-05
申请人： Zhihong Wang , You Wang , Daxin Mao , Renhe Jia , Stan Tsai , Yongqi Hu , Yuan Tian , Liang-Yuh Chen
发明人： Zhihong Wang , You Wang , Daxin Mao , Renhe Jia , Stan Tsai , Yongqi Hu , Yuan Tian , Liang-Yuh Chen
IPC分类号： B23H3/08 , B23H5/08 , C09G1/02 , C25F3/02 , H01L21/321 , H01L21/768
CPC分类号： C25F3/02 , B23H5/08 , C09G1/02 , H01L21/32125 , H01L21/7684
摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
摘要翻译：提供了用于处理其上设置有导电材料层的基板的组合物和方法。在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

5. 发明申请

US20070209946A1 Method and apparatus for evaluating polishing pad conditioning 失效
标题翻译：评估抛光垫调理的方法和装置
公开(公告)号：US20070209946A1
公开(公告)日：2007-09-13
申请号：US11370474
申请日：2006-03-08
申请人： Zhihong Wang , Yongqi Hu , Stan Tsai
发明人： Zhihong Wang , Yongqi Hu , Stan Tsai
IPC分类号： B23H5/06
CPC分类号： B23H5/08 , B24B53/017 , C25F3/02 , C25F7/00
摘要： A method and apparatus for evaluating a conditioned electrochemical mechanical polishing pad are provided. A polishing pad is conditioned using a first set of process conditions. A sheet wafer and a residue wafer are polished on the polishing pad. The removal rates of one or more materials from the sheet wafer and the residue wafer are measured. A normalized removal rate is calculated. The polishing pad is further conditioned if the normalized removal rate is not within a minimum value and a maximum value. In one embodiment, the normalized removal rate comprises a ratio of the removal rate of the residue wafer to the removal rate of the sheet wafer.
摘要翻译：提供了一种评价调理电化学机械抛光垫的方法和装置。使用第一组工艺条件对抛光垫进行调理。在抛光垫上抛光片状晶片和残留晶片。测量来自片状晶片和残留晶片的一种或多种材料的去除速率。计算归一化的去除率。如果归一化的去除速率不在最小值和最大值内，抛光垫被进一步调节。在一个实施例中，归一化去除速率包括残余晶片的去除速率与片晶片的去除速率的比率。

6. 发明申请

US20080108288A1 Conductive Polishing Article for Electrochemical Mechanical Polishing 审中-公开
标题翻译：电化学机械抛光导电抛光制品
公开(公告)号：US20080108288A1
公开(公告)日：2008-05-08
申请号：US11934878
申请日：2007-11-05
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Stan Tsai , Feng Liu , Liang-Yuh Chen , Robert Ewald
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Stan Tsai , Feng Liu , Liang-Yuh Chen , Robert Ewald
IPC分类号： B24B39/06 , H01L21/3105
CPC分类号： B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.
摘要翻译：提供了用于处理基板的抛光制品的实施例。在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。导电层具有适于抛光衬底的暴露表面。织物层可以是编织的或非织造的。导电层可以由软质材料组成，并且在一个实施例中，暴露表面可以是平面的。

7. 发明申请

US20070034506A1 PAD ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING 失效
标题翻译：电化学机械加工用PAD组件
公开(公告)号：US20070034506A1
公开(公告)日：2007-02-15
申请号：US11458356
申请日：2006-07-18
申请人： Yongqi Hu , Stan Tsai , Yan Wang , Feng Liu , Shou-Sung Chang , Liang-Yuh Chen
发明人： Yongqi Hu , Stan Tsai , Yan Wang , Feng Liu , Shou-Sung Chang , Liang-Yuh Chen
IPC分类号： C25B11/03
CPC分类号： B24B37/26 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/042 , B24B37/046 , B24B37/22 , B24B37/24 , B24B49/16 , B24B53/017 , C25D17/14 , H01L21/32125
摘要： Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.
摘要翻译：提供了用于处理衬底的处理衬垫组件的实施例。处理垫组件包括具有处理表面的上层和具有联接到上层的顶侧和与顶侧相对的底侧的电极。通过上层形成第一组孔，用于将电极暴露于处理表面。通过上层和电极形成至少一个孔。

8. 发明申请

US20060260951A1 Full Sequence Metal and Barrier Layer Electrochemical Mechanical Processing 失效
标题翻译：全序列金属和屏障层电化学机械加工
公开(公告)号：US20060260951A1
公开(公告)日：2006-11-23
申请号：US11425682
申请日：2006-06-21
申请人： Feng Liu , Liang-Yuh Chen , Stan Tsai , Yongqi Hu
发明人： Feng Liu , Liang-Yuh Chen , Stan Tsai , Yongqi Hu
IPC分类号： B23H3/02
CPC分类号： B23H5/08 , C25F7/00
摘要： A method and apparatus for electrochemically processing metal and barrier materials is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of establishing an electrically-conductive path through an electrolyte between an exposed layer of barrier material on the substrate and an electrode, pressing the substrate against a processing pad assembly, providing motion between the substrate and pad assembly in contact therewith and electrochemically removing a portion of the exposed layer during a first electrochemical processing step in a barrier processing station.
摘要翻译：提供了一种用于电化学处理金属和阻隔材料的方法和装置。在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在衬底上的暴露的阻挡材料层与电极之间建立通过电解质的导电路径，将衬底压在处理衬垫组件上，所述衬底和焊盘组件与其接触并且在屏障处理站中的第一电化学处理步骤期间电化学去除所述暴露层的一部分。

9. 发明申请

US20060046623A1 Method and apparatus for reduced wear polishing pad conditioning 失效
标题翻译：降低磨损抛光垫调理的方法和装置
公开(公告)号：US20060046623A1
公开(公告)日：2006-03-02
申请号：US11209167
申请日：2005-08-22
申请人： Yan Wang , Stan Tsai , Yongqi Hu , Feng Liu , Liang-Yuh Chen , Daxin Mao , Huyen Tran , Martin Wohlert , Renhe Jia , Yuan Tian
发明人： Yan Wang , Stan Tsai , Yongqi Hu , Feng Liu , Liang-Yuh Chen , Daxin Mao , Huyen Tran , Martin Wohlert , Renhe Jia , Yuan Tian
IPC分类号： B24B1/00
CPC分类号： B24B53/017 , B23H5/08
摘要： Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.
摘要翻译：提供了用于原位调理和/或清洁CMP，ECMP或其它处理系统的处理垫的调节头的实施例。在一个实施例中，调节头包括设置在中心腔中的刷子。清洁流体通过调节头的中心空腔设置到处理垫。刷子旋转并横向移动到处理垫的表面上。通过调节头分配的清洁溶液溶解处理操作的副产物，同时刷子轻轻地擦拭处理垫。调节头的唇缘保持清洁流体和清洁废物，从而最小化调节头外部区域的污染。清洁废物通过在调节头的外周附近形成的通道从处理垫移除。

10. 发明授权

US07569134B2 Contacts for electrochemical processing 失效
标题翻译：电化学处理接点
公开(公告)号：US07569134B2
公开(公告)日：2009-08-04
申请号：US11424170
申请日：2006-06-14
申请人： Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
发明人： Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
IPC分类号： B23H5/06 , C25D17/00
CPC分类号： H01L21/32125 , B23H5/08 , B24B37/046 , B24B37/24 , B24B53/017
摘要： Systems and methods for electrochemically processing a substrate. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.
摘要翻译：用于电化学处理衬底的系统和方法。接触元件限定在处理期间可定位成接触衬底的衬底接触表面。在一个实施例中，接触元件包括线元件。在另一个实施例中，接触元件是旋转构件。在一个实施例中，接触元件包括贵金属。

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