专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP3355371A1 LIQUID-FILLED LED LAMP 审中-公开
公开(公告)号：EP3355371A1
公开(公告)日：2018-08-01
申请号：EP15895860.3
申请日：2015-10-15
申请人： Li, Feng
发明人： Li, Feng
IPC分类号： H01L33/64 , F21S2/00
CPC分类号： F21V29/56 , F21K9/64 , F21S2/00 , F21V3/12 , F21V5/00 , F21V19/0015 , F21Y2115/10 , H01L33/64
摘要： An LED lamp packaged by liquid sealant contains: a transparent sheet (10), a grid casing (20), a printed circuit board (PCB) (30), and a lid (40). The transparent sheet (10) covers on a top of the grid casing (20), the PCB (30) is defined between the grid casing (20) and the lid (40), and the lid (40) covering a bottom of the grid casing (20) and fixing the PCB (30). The grid casing (20) includes at least one feeding orifice formed on the top thereof and communicating with an accommodation chamber (24) defined on the bottom of the grid casing (20), and liquid sealant is fed into the grid casing (20) from the at least one feeding orifice, and after feeding the liquid sealant into the grid casing (20), the least one feeding orifice is closed.

2. 发明公开

EP3348901A1 BOLT-TYPE LOCKING AND FASTENING STRUCTURE AND INSTALLATION METHOD THEREFOR 审中-公开
公开(公告)号：EP3348901A1
公开(公告)日：2018-07-18
申请号：EP15895859.5
申请日：2015-09-17
申请人： Li, Feng
发明人： Li, Feng
IPC分类号： F21V17/10 , F21V17/12 , F21V17/14 , F21V17/18
CPC分类号： F21V15/01 , F21V17/104 , F21V31/00 , F21Y2115/10
摘要： A bolt locking structure for a waterproof LED lamp contains: a first casing (10) and a second casing (20). The first casing (10) includes multiple first protrusions (11) and multiple first recesses (12) which are arranged on each of four peripheral walls thereof respectively. The second casing (20) includes multiple second protrusions (21) and multiple second recesses (22) which are arranged on each of four peripheral walls thereof respectively. The multiple first protrusions (11) retain with the multiple second recesses (22), and the multiple first recesses (12) retain with the multiple second protrusions (21). Multiple through holes (30) are coaxial and form on each peripheral wall of each of the first casing (10) and the second casing (20) respectively, wherein each of the multiple through holes (30) passes through each of the multiple first protrusions (11) and the multiple second protrusions (21), such that each of multiple connection bolts (40) inserts into the multiple through holes (30), thus locking the first casing (10) and the second casing (20) together.

3. 发明公开

EP3296625A1 LED REFLECTIVE STRUCTURE 审中-公开
标题翻译： LED反射结构
公开(公告)号：EP3296625A1
公开(公告)日：2018-03-21
申请号：EP15891429.1
申请日：2015-05-18
申请人： Li, Feng
发明人： Li, Feng
IPC分类号： F21V7/22
CPC分类号： F21V29/505 , F21V7/0066 , F21V7/0083 , F21V7/22 , F21V29/70 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/483 , H01L33/60 , H01L33/642
摘要： A reflection structure for an LED lamp contains: a substrate (10) having an accommodation groove in which a plurality of cavities (11) are defined and configured to accommodate multiple light-emitting diode (LED) chips respectively. The substrate (10) also includes multiple partition ribs (12) fixed in the accommodation groove of the substrate (10) and configured to separate the plurality of cavities (11). Each of the multiple partition ribs (12) separates any two adjacent of the plurality of cavities (11). Thereby, light from said each LED chip is reflected by said each partition rib (12) and its radiation flux increases by way of a Nano-reflective material layer of said each partition rib (12), such that the substrate (10) of the reflection structure protects said LED chip and dissipates heat of said LED chip effectively.
摘要翻译：一种用于LED灯的反射结构，包括：具有容纳槽的基板（10），其中限定了多个腔（11）并且被配置为分别容纳多个发光二极管（LED）芯片。基板（10）还包括固定在基板（10）的容纳槽中的多个分隔肋（12），用于分隔多个腔体（11）。多个分隔肋（12）中的每一个分隔多个空腔（11）中的任何两个相邻空腔。由此，来自所述每个LED芯片的光被所述每个分隔肋（12）反射，并且其辐射通量借助于所述每个分隔肋（12）的纳米反射材料层而增加，使得所述每个分隔肋反射结构保护所述LED芯片并有效散发所述LED芯片的热量。

4. 发明公开

EP3296615A1 EMBEDDED LIGHT SOURCE ENCAPSULATION STRUCTURE 审中-公开
标题翻译：嵌入式光源封装结构
公开(公告)号：EP3296615A1
公开(公告)日：2018-03-21
申请号：EP15891430.9
申请日：2015-05-18
申请人： Li, Feng
发明人： Li, Feng
IPC分类号： F21S2/00 , F21V17/10
CPC分类号： F21V21/0808 , F21S2/00 , F21V15/01 , F21V17/10 , F21V17/104 , F21V19/001 , F21V19/002 , F21V19/0035 , F21W2131/103 , F21Y2115/10
摘要： A packaging structure for an LED lamp contains: a casing (10), a substrate (20), a printed circuit board (PCB) (30), and at least one locking element (40). The casing (10), the PCB (30), and the substrate (20) are stacked and adhered together. The at least one locking element (40) respectively inserts into and retains with two connection gaps between the casing (10) and the substrate (20) so as to fix the casing (10) and the substrate (20) together. The substrate (20) includes a stepped groove defined on a central portion thereof and facing the casing (10), and the stepped groove of the substrate (20) has a first accommodation part (21) and a second accommodation part (22). A size, a profile, and a depth of the first accommodation part (21) correspond to a size, a profile, and a thickness of the casing (10). A size, a profile, and a depth of the second accommodation part (22) correspond to a size, a profile, and a thickness of the PCB (30).
摘要翻译：一种用于LED灯的封装结构包括：壳体（10），基板（20），印刷电路板（PCB）（30）以及至少一个锁定元件（40）。壳体（10），PCB（30）和基板（20）堆叠并粘合在一起。所述至少一个锁定元件（40）分别插入并保持在壳体（10）和基板（20）之间的两个连接间隙中，以将壳体（10）和基板（20）固定在一起。基板（20）在中央部具有与壳体（10）相对的阶梯状的槽，基板（20）的阶梯状的槽具有第一容纳部（21）和第二容纳部（22）。第一容纳部分（21）的尺寸，轮廓和深度对应于壳体（10）的尺寸，轮廓和厚度。第二容纳部分（22）的尺寸，轮廓和深度对应于PCB（30）的尺寸，轮廓和厚度。

5. 发明公开

EP3299711A1 LOCKING STRUCTURE OF INLAY-TYPE LED HOUSING 审中-公开
标题翻译：嵌入式LED外壳的锁定结构
公开(公告)号：EP3299711A1
公开(公告)日：2018-03-28
申请号：EP15892239.3
申请日：2015-05-26
申请人： Li, Feng
发明人： Li, Feng
IPC分类号： F21V17/10 , F21V19/00
CPC分类号： F21V19/0015 , F21V15/01 , F21V17/10 , F21V19/00 , F21V19/003 , F21V19/0045 , F21V19/005 , F21V21/0808 , F21V29/70 , F21Y2105/14 , F21Y2115/10
摘要： A locking structure for an LED lamp contains: a casing (10), a substrate (20), at least one locking slot (30) defined between the substrate (20) and the casing (10), and at least one fixing element (40) configured to fix the casing (10) and the substrate (20). The substrate (20) includes a trench (21) formed therein, and a profile of the trench (21) corresponds to the casing (10) so that the trench (21) accommodates and retains with the casing (10). The at 2 least one locking slot (30) and the at least one fixing element (40) are defined between a peripheral fence (212) of the trench (21) and a peripheral wall of the casing (10), and the at least one fixing element (40) is inserted into the at least one locking slot (30) so as to fix the casing (10) and the substrate (20).
摘要翻译：一种用于LED灯的锁定结构，包括：壳体（10），基板（20），限定在基板（20）和壳体（10）之间的至少一个锁定槽（30），以及至少一个固定元件 40），其被构造成固定所述壳体（10）和所述基板（20）。衬底（20）包括形成在其中的沟槽（21），并且沟槽（21）的轮廓对应于壳体（10），使得沟槽（21）容纳并保持在壳体（10）中。所述至少一个锁定槽（30）和所述至少一个固定元件（40）被限定在所述沟槽（21）的外围围栏（212）和所述壳体（10）的外围壁之间，并且所述至少一个固定元件（40）插入至少一个锁定槽（30）中以固定壳体（10）和基板（20）。

6. 发明公开

EP3297045A1 ADHESIVE FILM MOULD CAVITY MANUFACTURING METHOD AND ADHESIVE BILL MANUFACTURED THEREBY 审中-公开
标题翻译：胶粘薄膜模腔制造方法及其制造的胶粘剂条例草案
公开(公告)号：EP3297045A1
公开(公告)日：2018-03-21
申请号：EP15891431.7
申请日：2015-05-18
申请人： Li, Feng
发明人： Li, Feng
IPC分类号： H01L33/50 , H01L33/54
CPC分类号： B29C41/22 , B29C41/04 , B29K2083/00 , B29K2995/0035 , B29L2031/3406 , F21K9/64 , F21V9/30 , F21Y2115/10 , H01L33/505 , H01L33/508 , H01L2933/0041
摘要： A method of manufacturing a fluorescent silicone film contains: steps of: A. mixing optical silicone and fluorescent powders so as to produce a mixture, and adding liquid to the mixture; B. vacuuming, degassing and feeding the mixture into an accommodation cavity of a mold (100); C. placing the mold (100) into a planetary centrifugal mixer so as to centrifuge the mixture; D. forming the fluorescent silicone film in the accommodation cavity; and E. solidifying and removing the fluorescent silicone film from the mold (100). In the step of A, the optical silicone and the fluorescent powders are mixed at a ratio of 100:10 to 100:25. In the step of B, the accommodation cavity is closed after feeding the mixture. In the step of D, the fluorescent silicone film has a silicone layer and a fluorescent powder layer which are formed in the accommodation cavity in a chemical vapor deposition (CVD) manner.
摘要翻译：一种制造荧光硅酮薄膜的方法，包括以下步骤：A.将光学硅酮和荧光粉混合以产生混合物，并向该混合物中加入液体; B.抽真空，脱气并将混合物送入模具（100）的容纳腔中; C.将模具（100）放入行星式离心混合器中以离心混合物; D.在容纳腔中形成荧光硅酮膜; 和E.从模具（100）中固化并除去荧光硅氧烷膜。在步骤A中，将光学硅酮和荧光粉以100:10至100:25的比例混合。在步骤B中，在供给混合物后，容纳腔关闭。在步骤D中，荧光硅膜具有以化学气相沉积（CVD）方式形成在容纳腔中的硅酮层和荧光粉层。

7. 发明公开

EP3608843A1 STRUCTURE THREE-DIMENSIONAL CODE AND ANTI-COUNTERFEITING METHOD 无效
公开(公告)号：EP3608843A1
公开(公告)日：2020-02-12
申请号：EP18802913.6
申请日：2018-04-09
申请人： Li, Feng
发明人： Li, Feng
IPC分类号： G06K19/06
摘要： A structural three-dimensional code and an anti-counterfeiting method. The structural three-dimensional code includes an anti-counterfeiting feature layer (11); the anti-counterfeiting feature layer (11) has one or more convex or concave coding patterns (12, 22); and in the anti-counterfeiting feature layer (11), regions with different heights are identified by different colors.

8. 发明公开

EP3348525A1 MANUFACTURING METHOD FOR GLASS COATING FILM 审中-公开
公开(公告)号：EP3348525A1
公开(公告)日：2018-07-18
申请号：EP15895858.7
申请日：2015-09-14
申请人： Li, Feng
发明人： Li, Feng
IPC分类号： C03C17/30 , B29C39/10
CPC分类号： C03C17/30 , B29C39/10 , B29C39/26 , B29C39/36 , B29C39/38 , B29C41/50 , B29K2019/00
摘要： A method of adhering a silicone rubber film and a glass sheet together contains steps of: (A). Pouring liquid silicone rubber into a mold (20) in a vacuum condition so as to form a silicone rubber film with 0.2 mm thickness after the liquid silicone rubber solidifies; (B). Placing a glass sheet (10) into the mold (20) and pressing the glass sheet (10) on the silicone rubber film in the mold (20) by way of a press plate (30); (C). Baking the silicone rubber film in a temperature of 80°C to 150°C for 20 minutes to 30 minutes; and (D). Removing the glass sheet (10) and the silicone rubber film from the mold (20). Thereby, the silicone rubber film does not attach on the inner wall of the mold as being removed from the mold (20).

9. 发明公开

EP3282173A1 LED ILLUMINATION LAMP WITH INTEGRATED HEAT DISSIPATION STRUCTURE 审中-公开
标题翻译：带集成散热结构的LED照明灯
公开(公告)号：EP3282173A1
公开(公告)日：2018-02-14
申请号：EP15888096.3
申请日：2015-04-24
申请人： Li, Feng
发明人： Li, Feng
IPC分类号： F21S2/00 , F21V29/503 , F21V29/83
CPC分类号： F21V19/0025 , F21V7/0083 , F21V7/22 , F21V17/101 , F21V19/003 , F21V29/505 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H01L25/13
摘要： An LED lamp contains: a printed circuit board (PCB) (20), an accommodation casing (10), and a closing plate (30). The PCB (20) is housed in the accommodation casing (10), and the closing plate (30) closes the accommodation casing (10). The PCB (20) includes a plurality of LED chips (21) die bonded on the PCB (20) and electrically connected with the PCB (20) by way of gold wires. The accommodation casing (10) includes a hollow area (12) defined on a central portion thereof, and the accommodation casing (10) includes a peripheral zone (11) surrounding the hollow area (12), wherein the hollow area (12) corresponds to an configuration area of the PCB (20) in which the plurality of LED chips (21) are arranged, and the hollow area (12) has multiple grid units (121) corresponding to the plurality of LED chips (21), respectively.
摘要翻译： LED灯包括：印刷电路板（PCB）（20），容纳壳体（10）和封闭板（30）。 PCB（20）容纳在容纳壳体（10）中，并且封闭板（30）封闭容纳壳体（10）。 PCB（20）包括多个LED芯片（21），芯片接合在PCB（20）上并且通过金线与PCB（20）电连接。所述容纳壳体（10）包括限定在其中部的中空区域（12），并且所述容纳壳体（10）包括围绕所述中空区域（12）的周边区域（11），其中所述中空区域（12）到布置有多个LED芯片（21）的PCB（20）的配置区域，并且中空区域（12）分别具有与多个LED芯片（21）对应的多个栅格单元（121）。

10. 发明公开

EP3366992A1 DEEPWATER LED LIGHTING SEALING STRUCTURE 审中-公开
公开(公告)号：EP3366992A1
公开(公告)日：2018-08-29
申请号：EP15895861.1
申请日：2015-11-09
申请人： Li, Feng
发明人： Li, Feng
IPC分类号： F21V31/00 , F21Y115/10
CPC分类号： F21V31/005 , F21V15/01 , F21V31/00 , F21Y2115/10 , H05K5/0013 , H05K5/065
摘要： A closing structure for a waterproof LED lamp contains: a first casing (10), a light power source (30), and a second casing (20). The light power source (30) is housed in an accommodation groove of a bottom of the first casing (10), and the first casing (10) is in connection with the second casing (20). A first closing film (41) is injection molded on a peripheral side of a first connection surface of the first casing (10) facing to the second casing (20), and a second closing film (42) is injection molded on a peripheral side of a second connection surface of the second casing (20) facing the first casing (10).

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式