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    • 3. 发明申请
    • Method and apparatus for planarizing a substrate with low fluid consumption
    • 用于以低流体消耗平坦化基板的方法和装置
    • US20070131562A1
    • 2007-06-14
    • US11298643
    • 2005-12-08
    • Zhihong WangMing-Kuei TsengYuan TianYongqi HuStan Tsai
    • Zhihong WangMing-Kuei TsengYuan TianYongqi HuStan Tsai
    • B23H3/00
    • B23H5/08B24B37/04B24B57/02C25D5/06C25D5/08C25D7/12C25D17/001
    • The embodiments of the invention generally relate to a method and apparatus for processing a substrate with reduced fluid consumption. Embodiments of the invention may be beneficially utilized in chemical mechanical and electrochemical mechanical polishing processes, among other processes where conservation of a processing fluid disposed on a rotating pad is desirable. In one embodiment, a processing fluid delivery arm assembly is provided that includes a nozzle assembly supported at a distal end of an arm. The nozzle assembly includes a nozzle that is adjustable to control the delivery of fluid exiting therefrom in two planes relative to the arm. In another embodiment, processing fluid in the form of electrolyte fills holes formed at least partially through the pad as they enter the wet zone, and a current is driven through the electrolyte, filling the holes between a substrate and an electrode disposed below the surface of the pad.
    • 本发明的实施例一般涉及用于处理具有减少的流体消耗的基板的方法和装置。 本发明的实施例可以有利地用于化学机械和电化学机械抛光工艺以及其它工艺中,其中设置在旋转焊盘上的处理流体的保护是期望的。 在一个实施例中,提供了一种处理流体输送臂组件,其包括支撑在臂的远端处的喷嘴组件。 喷嘴组件包括可调节的喷嘴,以控制从相对于臂的两个平面离开的流体的输送。 在另一个实施方案中,电解液形式的处理流体在其进入湿区时填充至少部分地通过焊盘形成的孔,并且电流驱动通过电解质,填充基板和设置在下表面之下的电极之间的孔 垫