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11. 发明授权

US06534380B1 Semiconductor substrate and method of manufacturing the same 失效
标题翻译：半导体衬底及其制造方法
公开(公告)号：US06534380B1
公开(公告)日：2003-03-18
申请号：US09116956
申请日：1998-07-17
申请人： Shoichi Yamauchi , Hisayoshi Ohshima , Masaki Matsui , Kunihiro Onoda , Tadao Ooka , Akitoshi Yamanaka , Toshifumi Izumi
发明人： Shoichi Yamauchi , Hisayoshi Ohshima , Masaki Matsui , Kunihiro Onoda , Tadao Ooka , Akitoshi Yamanaka , Toshifumi Izumi
IPC分类号： H01L2130
CPC分类号： H01L21/76254 , Y10S438/96
摘要： Before a semiconductor substrate and a base substrate is directly bonded to one another, in a protective film removing step, a contamination protective film formed on the semiconductor substrate to protect it from contamination during an ion implanting step is removed. Consequently, even when flatness of the contamination protective film is degraded during the ion implanting step or even when contaminants remain in a segregated state in the vicinity of the surface of the contamination protective film, the state of the bonding between the semiconductor substrate and the base substrate after the bonding step can be made uniform over the entire area of the bonding. As a result, a high-quality semiconductor substrate can be manufactured at low cost.
摘要翻译：在半导体基板和基底基板彼此直接接合之前，在保护膜去除步骤中，去除了在离子注入步骤期间形成在半导体衬底上以防止其污染的污染保护膜。因此，即使当在离子注入步骤期间污染保护膜的平坦度劣化时，或者甚至当污染保护膜表面附近的污染物保持分离状态时，半导体衬底和基底之间的接合状态接合步骤之后的基板可以在结合的整个区域上均匀。结果，可以以低成本制造高质量的半导体衬底。

12. 发明授权

US09102138B2 Image forming apparatus 有权
标题翻译：图像形成装置
公开(公告)号：US09102138B2
公开(公告)日：2015-08-11
申请号：US14349007
申请日：2012-11-01
申请人： Ryota Suzuki , Takeo Tsukamoto , Hisayoshi Ohshima , Aino Hasegawa , Hideomi Sakuma , Manabu Seo , Hiroyuki Yamashita , Yuuma Usui , Takahiko Matsumoto , Takeshi Hihara
发明人： Ryota Suzuki , Takeo Tsukamoto , Hisayoshi Ohshima , Aino Hasegawa , Hideomi Sakuma , Manabu Seo , Hiroyuki Yamashita , Yuuma Usui , Takahiko Matsumoto , Takeshi Hihara
IPC分类号： B41J2/005 , B41J2/175
CPC分类号： B41J2/0057 , B41J2/17509 , B41J2202/04
摘要： Using an intermediate transfer body onto which a conductive recording liquid containing water that is ejected by heads is provided; and a potential applying unit which applies a potential which can electrolyze the water within the conductive recording liquid which is ejected from the heads and which temporarily bridges between the heads and the intermediate transfer body, the potential applying unit applies a potential between the intermediate transfer body and electrodes which are in contact with the recording liquid in supplying units which supply the recording liquid to the heads.
摘要翻译：使用中间转印体，其上设置有由头部喷射的水的导电性记录液体; 以及潜在施加单元，其施加电位从头部喷射的导电记录液体中的水电解并且临时桥接在头部和中间转印体之间的电位施加单元，在中间转印体之间施加电位以及在向记录头供给记录液体的供给单元中与记录液接触的电极。

13. 发明授权

US08090305B2 Fixing unit and image forming apparatus 失效
标题翻译：定影单元和成像设备
公开(公告)号：US08090305B2
公开(公告)日：2012-01-03
申请号：US12770145
申请日：2010-04-29
申请人： Toshiyuki Iseki , Hisayoshi Ohshima , Takahiko Matsumoto , Yukimichi Someya
发明人： Toshiyuki Iseki , Hisayoshi Ohshima , Takahiko Matsumoto , Yukimichi Someya
IPC分类号： G03G15/20
CPC分类号： G03G15/2096 , G03G15/2064
摘要： Disclosed is a fixing device including a liquid supply unit that supplies a liquid fixer containing a softening agent that dissolves or swells at least part of resin to soften the resin; an air supply unit that supplies air for foaming the liquid fixer; and a foam generation unit that mixes the liquid fixer from the liquid supply unit with the air from the air supply unit to generate foams. The foam generation unit has an air channel where the air from the air supply unit flows, a liquid-fixer channel provided such that the liquid fixer from the liquid supply unit flows from a direction opposite to a flowing direction of the air channel, and an air-and-liquid mixing part that mixes the air from the air channel with the liquid fixer from the liquid fixer channel so as to be opposite to each other, thereby generating a foam-like fixer.
摘要翻译：公开了一种定影装置，其包括：液体供应单元，其供应含有溶解或溶胀至少部分树脂以软化树脂的软化剂的液体定影剂; 空气供应单元，其供应用于使液体定影剂发泡的空气; 以及泡沫产生单元，其将来自液体供应单元的液体定影剂与来自空气供应单元的空气混合以产生泡沫。泡沫产生单元具有空气通道，空气供给单元的空气流动，液体定影通道设置成使得来自液体供应单元的液体定影剂从与空气通道的流动方向相反的方向流动，空气和液体混合部分，其将来自空气通道的空气与液体定影剂从液体定影剂通道混合，以便彼此相对，从而产生泡沫状定影剂。

14. 发明授权

US07918963B2 Method and apparatus for adhering parts maintaining adjusted position 失效
标题翻译：用于粘贴保持调节位置的零件的方法和装置
公开(公告)号：US07918963B2
公开(公告)日：2011-04-05
申请号：US10666235
申请日：2003-09-19
申请人： Taroh Terashi , Hisayoshi Ohshima , Yuusuke Taneda
发明人： Taroh Terashi , Hisayoshi Ohshima , Yuusuke Taneda
IPC分类号： B29C65/00
CPC分类号： B29C66/472 , B29C65/14 , B29C65/1403 , B29C65/1406 , B29C65/1409 , B29C65/1435 , B29C65/1464 , B29C65/1483 , B29C65/1496 , B29C65/4845 , B29C65/4875 , B29C65/7802 , B29C66/1122 , B29C66/91641 , B29C66/91645 , B29C65/00
摘要： An apparatus maintaining adjusted positions of parts assembled by adhering includes a device coating plural sections between a part and an adhering target with light energy curable adhesives adhering the part to the adhering target, a light energy irradiating device for curing the adhesive, and a detecting device detecting a displacement of the part from the adhering target. A curing shrinkage force control device is also provided to control the light energy irradiating device to change the light and thus control curing shrinkage forces to offset undesirable stresses generated by the curing shrinkage forces when undesirable displacement is detected.
摘要翻译：保持通过粘合而组装的零件的调整位置的装置包括：通过将部件粘附到粘合目标上的光能固化型粘合剂来涂覆部分和粘合目标之间的多个部分的装置，用于固化粘合剂的光能照射装置和检测装置检测所述部件与所述粘合目标的位移。还提供固化收缩力控制装置以控制光能照射装置改变光，从而控制固化收缩力，以消除当检测到不期望的位移时由固化收缩力产生的不期望的应力。

15. 发明授权

US06191007B1 Method for manufacturing a semiconductor substrate 失效
标题翻译：半导体基板的制造方法
公开(公告)号：US06191007B1
公开(公告)日：2001-02-20
申请号：US09066971
申请日：1998-04-28
申请人： Masaki Matsui , Shoichi Yamauchi , Hisayoshi Ohshima , Kunihiro Onoda , Akiyoshi Asai , Takanari Sasaya , Takeshi Enya , Jun Sakakibara
发明人： Masaki Matsui , Shoichi Yamauchi , Hisayoshi Ohshima , Kunihiro Onoda , Akiyoshi Asai , Takanari Sasaya , Takeshi Enya , Jun Sakakibara
IPC分类号： H01L21331
CPC分类号： H01L21/84 , H01L21/02667 , H01L21/2022 , H01L21/76243 , H01L21/76254 , H01L21/76264 , H01L21/76267 , H01L21/76275 , H01L21/76281 , H01L21/76283 , H01L2221/68363
摘要： Methods for manufacturing semiconductor substrates in which a semiconductor layer for forming semiconductor device therein is formed on a supporting substrate with an insulating film interposed between, with which in forming the semiconductor layer on a substrate on which a buried pattern structure has been formed it is possible to greatly increase the film thickness uniformity of the semiconductor layer and the film thickness controllability, particularly when the semiconductor layer is being formed as an extremely thin film. As a result, it is possible to achieve improved quality and characteristics of the semiconductor substrates and make possible the deployment of such semiconductor substrates to various uses.
摘要翻译：制造半导体衬底的方法，其中半导体器件用于形成半导体器件的半导体层形成在支撑衬底上，绝缘膜介于其之间，在形成掩埋图案结构的衬底上形成半导体层是可能的大大增加了半导体层的膜厚均匀性和膜厚可控性，特别是当半导体层被形成为极薄膜时。结果，可以实现半导体衬底的改进的质量和特性，并且可以将这种半导体衬底部署到各种用途上。

16. 发明授权

US5534698A Solid state surface evaluation methods and devices 失效
标题翻译：固态表面评估方法和装置
公开(公告)号：US5534698A
公开(公告)日：1996-07-09
申请号：US271741
申请日：1994-07-07
申请人： Hisayoshi Ohshima , Yoshiyasu Yamada
发明人： Hisayoshi Ohshima , Yoshiyasu Yamada
IPC分类号： G01B11/30 , G01N21/55 , G01N21/59 , G01J3/42
CPC分类号： G01B11/30 , G01N21/55 , G01N21/59
摘要： Methods and devices for evaluating solid-state surface properties use infrared absorption of lattice vibration. These methods and devices are characterized by reflection spectrometry by injecting infrared rays from the reverse of the solids, placing a light transmissible solid-state sample in ways that its surface faces the plane reflex mirror on the interaction region formed by reflected infrared rays, or by injecting infrared rays from the rear of a sample or from the front thereof after upright installation of the light transmissible solid-state sample through a slit created across the plane reflex mirror or on the surface of plane reflex mirror. These methods and devices enable simplified and accurate reflection spectrometry of solid-surface properties, featuring an economical system configuration that dispenses with expensive prism, unlike the conventional ATR method.
摘要翻译：用于评估固态表面性质的方法和装置使用晶格振动的红外吸收。这些方法和装置的特征在于通过从固体反向注入红外线的反射光谱法，将透光固态样品放置在其表面面对由反射红外线形成的相互作用区域上的平面反射镜的方式，或者由在通过穿过平面反射镜或平面反射镜的表面上形成的狭缝直立安装透光固体样品之后，从样品的后部或从其前方注入红外线。这些方法和装置能够实现固体表面性质的简化和准确的反射光谱测定，其特征在于与常规ATR方法不同，其具有省去昂贵的棱镜的经济系统配置。

17. 发明申请

US20130093810A1 IMAGE FORMING DEVICE, AND IMAGE FORMING METHOD 有权
标题翻译：图像形成装置和图像形成方法
公开(公告)号：US20130093810A1
公开(公告)日：2013-04-18
申请号：US13704321
申请日：2012-04-12
申请人： Ryota Suzuki , Takeo Tsukamoto , Takeshi Orito , Manabu Seo , Hideomi Sakuma , Aino Hasegawa , Hiroyuki Yamashita , Yuuma Usui , Hisayoshi Ohshima , Takahiko Matsumoto
发明人： Ryota Suzuki , Takeo Tsukamoto , Takeshi Orito , Manabu Seo , Hideomi Sakuma , Aino Hasegawa , Hiroyuki Yamashita , Yuuma Usui , Hisayoshi Ohshima , Takahiko Matsumoto
IPC分类号： B41J2/115
CPC分类号： B41J2/115 , B41J2/0057 , B41J2/04563 , B41J2/04581 , B41J2/3855
摘要： An image forming device includes a head including a nozzle that discharges an electrically-conductive recording liquid in accordance with a driving signal; an intermediate transfer body on which the recording liquid discharged by the head is applied; a voltage apply unit that applies a voltage between the intermediate transfer body and the head, so as to decompose the electrically-conductive recording liquid by electrolysis; a transfer unit that transfers an image supported on the intermediate transfer body onto a recording material; and a discharging control unit that generates the driving signal that causes the electrically-conductive recording liquid to be discharged from the nozzle. The discharging control unit generates the driving signal so that a position of a meniscus is placed outside the nozzle during a time interval in which the recording liquid temporarily bridges between the head and the intermediate transfer body.
摘要翻译：图像形成装置包括：头部，其包括根据驱动信号对导电记录液体进行排出的喷嘴; 其上施加有由头部排出的记录液体的中间转印体; 电压施加单元，其在所述中间转印体和所述头之间施加电压，以通过电解分解所述导电记录液; 传送单元，其将支撑在所述中间转印体上的图像转印到记录材料上; 以及放电控制单元，其产生使导电记录液体从喷嘴排出的驱动信号。放电控制单元产生驱动信号，使得在记录液临时桥接在头部和中间转印体之间的时间间隔期间，弯液面的位置被放置在喷嘴外部。

18. 发明申请

US20130050363A1 AQUEOUS INK COMPOSITION AND IMAGE FORMING APPARATUS 有权
标题翻译：水性墨水组合物和图像形成装置
公开(公告)号：US20130050363A1
公开(公告)日：2013-02-28
申请号：US13588748
申请日：2012-08-17
申请人： Yuuma Usui , Takeo Tsukamoto , Aino Hasegawa , Hideomi Sakuma , Manabu Seo , Hiroyuki Yamashita , Ryota Suzuki , Hisayoshi Ohshima , Takahiko Matsumoto , Shigeo Takeuchi , Takeshi Hihara
发明人： Yuuma Usui , Takeo Tsukamoto , Aino Hasegawa , Hideomi Sakuma , Manabu Seo , Hiroyuki Yamashita , Ryota Suzuki , Hisayoshi Ohshima , Takahiko Matsumoto , Shigeo Takeuchi , Takeshi Hihara
IPC分类号： C09D11/10 , C08K5/09 , B41J2/17 , H01B1/12
CPC分类号： C09D11/38 , B41J2/175 , B41J2/2107 , C08K5/0041 , C08K5/098 , C09D11/102
摘要： Disclosed is an aqueous ink composition, including an aqueous solvent, a coloring agent dissolved or dispersed in the aqueous solvent, an ABA-type amphipathic polymer including a hydrophobic segment A and a hydrophilic segment B, and an anionic surfactant configured to dissolve or disperse the ABA-type amphipathic polymer in the aqueous solvent, wherein a viscosity of the aqueous ink composition is changed depending on a pH thereof.
摘要翻译：公开了一种含水溶剂，溶解或分散在水性溶剂中的着色剂的水性油墨组合物，包含疏水性链段A和亲水性链段B的ABA型两亲性聚合物，以及配置成溶解或分散 ABA型两亲性聚合物在水性溶剂中，其中水性油墨组合物的粘度根据其pH而改变。

19. 发明授权

US06251754B1 Semiconductor substrate manufacturing method 失效
标题翻译：半导体衬底制造方法
公开(公告)号：US06251754B1
公开(公告)日：2001-06-26
申请号：US09074384
申请日：1998-05-08
申请人： Hisayoshi Ohshima , Masaki Matsui , Kunihiro Onoda , Shoichi Yamauchi
发明人： Hisayoshi Ohshima , Masaki Matsui , Kunihiro Onoda , Shoichi Yamauchi
IPC分类号： H01L2120
CPC分类号： H01L21/76254
摘要： The invention provides a number of semiconductor substrate manufacturing methods with which, in manufacturing a semiconductor substrate having a semiconductor layer in an insulated state on a supporting substrate, it is possible to obtain a thick semiconductor layer with a simple process and cheaply while reducing impurity contamination of the semiconductor layer to a minimum. One of these methods includes a defective layer forming step of carrying out ion implantation to a predetermined depth from the surface of a base substrate to partition off a monocrystalline thin film layer at the surface of the base substrate by a defective layer formed by implanted ions, a semiconductor film forming step of forming a monocrystalline semiconductor film of a predetermined thickness on the monocrystalline thin film layer, a laminating step of laminating the base substrate by the surface of the monocrystalline semiconductor film to the supporting substrate, and a detaching step of detaching the base substrate laminated to the supporting substrate at the defective layer.
摘要翻译：本发明提供了许多半导体衬底制造方法，在制造具有在支撑衬底上具有绝缘状态的半导体层的半导体衬底的情况下，可以以简单的工艺获得厚半导体层并且在降低杂质污染的同时廉价的半导体层。这些方法之一包括从基底表面进行离子注入到预定深度的缺陷层形成步骤，以通过由注入离子形成的缺陷层在基底基板的表面分隔单晶薄膜层，在单晶薄膜层上形成预定厚度的单晶半导体膜的半导体膜形成步骤，通过单晶半导体膜的表面将基底基板层压到支撑基板上的层压步骤，以及将基板基底基板层叠到不良层的支撑基板。

20. 发明授权

US6060344A Method for producing a semiconductor substrate 有权
标题翻译：半导体基板的制造方法
公开(公告)号：US6060344A
公开(公告)日：2000-05-09
申请号：US136294
申请日：1998-08-19
申请人： Masaki Matsui , Masatake Nagaya , Hisayoshi Ohshima
发明人： Masaki Matsui , Masatake Nagaya , Hisayoshi Ohshima
IPC分类号： H01L21/02 , H01L21/76 , H01L21/762 , H01L27/12 , H02L21/20
CPC分类号： H01L21/76264 , H01L21/76297 , H01L21/76275 , H01L21/76286
摘要： In a method for producing a semiconductor substrate completed through a bonding process for joining a semiconductor wafer to a support substrate by performing heat treatment thereto in a state in which the semiconductor wafer is closely joined to the support substrate, the method according to the present invention includes the following steps, i.e., a depositing process for depositing a poly-crystal semiconductor which covers all areas of a surface to be bonded on the surface of the semiconductor wafer; a heat treatment process for performing the heat treatment to the semiconductor wafer provided after the depositing process, during a predetermined time under a temperature equal to or higher than the heat treatment temperature at the bonding process; and a polishing process for flattening the surface of the poly-crystal semiconductor provided after the heat treatment process. After the above processes were performed in order, the bonding process is performed after the polishing process.
摘要翻译：在半导体基板的制造方法中，通过在将半导体晶片紧密接合到支撑基板的状态下对半导体晶片与支撑基板进行热处理的接合工序而完成，本发明的方法包括以下步骤，即，用于沉积覆盖半导体晶片表面上要接合的表面的所有区域的多晶半导体的沉积工艺; 在接合工序的等于或高于所述热处理温度的温度下的预定时间内对所述沉积工艺之后提供的所述半导体晶片进行热处理的热处理工艺; 以及用于使在热处理工艺之后提供的多晶半导体的表面变平的抛光工艺。在进行上述处理之后，在抛光处理之后进行接合处理。

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