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11. 发明专利

JPH0216438A INSTRUMENT AND METHOD FOR INSPECTING FOREIGN MATTER 失效
公开(公告)号：JPH0216438A
公开(公告)日：1990-01-19
申请号：JP16500388
申请日：1988-07-04
申请人： HITACHI LTD
发明人： KOIZUMI MITSUYOSHI , SHIGYO YOSHIHARU , OSHIMA YOSHIMASA , MORIOKA HIROSHI
IPC分类号： G01N21/88 , G01N21/94 , G01N21/956 , G01N21/958 , H01L21/027 , H01L21/30 , H01L21/66
摘要： PURPOSE:To improve foreign matter detection sensitivity by shielding reflecting light from a specific pattern by a space filter having a light shielding part determined by a lens opening and an illumination laser light spot shape. CONSTITUTION:Laser light from a light source 9 is projected on a sample 8 via a lens 10 and scattered light from it is passed through an objective lens 3 and a lambda/4 wavelength plate 11 and then, diverged by a diverging optical element 12 and images on detectors 7A and 7B by relay lenses 13A and 13B. Filters 4A and 4B on the Fourier transformation surface F of the objective lens 3 shield the scattered light from the pattern 1 on one end and the other end of a corner part of the pattern 1 by omega3 of 6c and omega3' of 6c' respectively. The outputs VA and VB of the detectors 7A and 7B are added and then, binarized and made to a quantization signal and when the foreign matter is detected, it is stored together with its coordinate output.

12. 发明专利

JP2007281500A Inspection device, inspection system and inspection method for circuit pattern 审中-公开
标题翻译：检查装置，检查系统和电路图案检查方法
公开(公告)号：JP2007281500A
公开(公告)日：2007-10-25
申请号：JP2007146424
申请日：2007-06-01
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NARA YASUHIKO , HAYAKAWA KOICHI , MACHIDA KAZUHISA , NOZOE MARI , MORIOKA HIROSHI , USAMI YASUTSUGU , HIROI TAKASHI
IPC分类号： H01L21/66 , G01N21/956 , G01N23/225
摘要： PROBLEM TO BE SOLVED: To provide an inspection device, an inspection system and an inspection method for a circuit pattern, capable of enhancing using convenience by improving a screen function of the inspection device for the circuit pattern for inspecting defects in the circuit pattern in a wafer, a mask, a reticle or the like, i.e. thinning in a linear or hole-like shape, a chip, a formation defect, a foreign matter or the like, and capable of enhancing a production yield of a semiconductor device by discovery of the defect at an early stage, investigation of the cause thereof and countermeasures at the early stage, as the inspection system as a whole. SOLUTION: The inspection device for circuit pattern is constituted to display an image signal transmitted from another device. The inspection system for the circuit pattern is provided with an electron beam visual inspection device, provided with a monitor for displaying the defect on a map; and an external visual inspection device for storing an image of the defect, and is constituted to display concurrently the map and the image of the defect on the monitor. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于电路图案的检查装置，检查系统和检查方法，其能够通过改进用于检查电路中的缺陷的电路图案的检查装置的屏幕功能来增强使用的方便性晶片，掩模，掩模版等中的图案，即线状或孔状形状的薄化，芯片，地层缺陷，异物等，并且能够提高半导体器件的制造成品率通过早期发现缺陷，调查事故原因和对策，作为整体检查制度。解决方案：电路图案检查装置构成为显示从另一装置发送的图像信号。电路图案的检查系统设有电子束目视检查装置，设置有用于在地图上显示缺陷的监视器; 以及用于存储缺陷的图像的外部目视检查装置，并且被构造成在监视器上同时显示缺陷的地图和图像。版权所有（C）2008，JPO＆INPIT

13. 发明专利

JP2004048002A Circuit-pattern inspecting apparatus and method 有权
公开(公告)号：JP2004048002A
公开(公告)日：2004-02-12
申请号：JP2003183707
申请日：2003-06-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NARA YASUHIKO , MACHIDA KAZUHISA , NOZOE MARI , MORIOKA HIROSHI , USAMI YASUTSUGU , HIROI TAKASHI
IPC分类号： G01B11/30 , G01B15/00 , G01N23/225 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a circuit-pattern inspecting apparatus and method having a good practical usability, by improving the cross-section function of the visual inspection apparatus of a wafer. SOLUTION: The circuit-pattern inspecting apparatus has a projecting means for projecting a light, a laser beam, or a charged-particle beam on the surface of a substrate having a circuit pattern formed for a wafer; a sensing means for sensing a signal generated by the projection from the substrate; a storing means for changing the signal sensed by the sensing means into an image to store the image; a comparing means for comparing the stored image with another image formed from the same circuit pattern, and a deciding means for deciding the defects of the circuit pattern based on the comparing result. Further, the circuit-pattern inspecting apparatus has a cell region setting means for setting the cell regions of an intra-chip map of a chip in the wafer to display a creating tool for setting the cell regions, together with an image plane for displaying the intra-chip map. COPYRIGHT: (C)2004,JPO

14. 发明专利

JP2001304842A METHOD AND DEVICE OF PATTERN INSPECTION AND TREATMENT METHOD OF SUBSTRATE 失效
公开(公告)号：JP2001304842A
公开(公告)日：2001-10-31
申请号：JP2000128954
申请日：2000-04-25
申请人： HITACHI LTD
发明人： TANAKA MAKI , HIROI TAKASHI , WATANABE MASAHIRO , SHISHIDO CHIE , MORIOKA HIROSHI , WATANABE KENJI , MIYAI YASUSHI , NOZOE MARI
IPC分类号： G01B15/00 , G01B15/04 , G01B15/08 , G01N23/225 , G06T7/00 , H01J37/22 , H01J37/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To set an optimal condition on image processing which gets no false information from the fluctuation of brightness between the images to be compared which is caused by an object to be tested and an image detection system. SOLUTION: Noise characteristics of the secondary electron image which is caused by an image detection system is determined and optimal parameters for image processing are decided based on the noise characteristics according to the object to be tested. The process variation of the object to be tested is evaluated by processing with comparison using the noise characteristics and the image of the object to be tested.

15. 发明专利

JP2000315712A PRODUCTION OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000315712A
公开(公告)日：2000-11-14
申请号：JP2000070992
申请日：2000-03-09
申请人： HITACHI LTD
发明人： NOGUCHI MINORU , MORIOKA HIROSHI , NISHIYAMA HIDETOSHI , KENBO YUKIO , OSHIMA YOSHIMASA , MATSUOKA KAZUHIKO , SHIGYO YOSHIHARU
IPC分类号： G01B11/24 , G01N21/956 , H01L21/02 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To detect a dust particle full-automatically at high speed and high accuracy by detecting a dust particle in a specified region on a substrate using a dust particle detecting means within the time required for a processing means to process the substrate and monitoring the generating state of dust particle based on that data. SOLUTION: In a mass production line of substrate, e.g. semiconductor, comprising a plurality of processing units, a dust particle monitoring unit comprising an oblique illumination system 3151 having an illumination array, a focus optical system 3153 having a lens array or a microlens group, a spatial filter 3154 arranged on the Fourier transform plane of the focus optical system 3153, and a detector 3155 arranged at the focus position of the focus optical system 3153 is disposed at the inlet or outlet of a specified processing unit or in the carrying system between the plurality of processing units and the generating state of dust particle on the substrate is detected within the processing time of the processing means. Defect due to dust particle thus generated is then analyzed based on the detection results.

16. 发明专利

JPH1030988A AUTOMATIC FOCUS CORRECTING METHOD AND APPARATUS THEREFOR 失效
公开(公告)号：JPH1030988A
公开(公告)日：1998-02-03
申请号：JP18440296
申请日：1996-07-15
申请人： HITACHI LTD , HITACHI ELECTR ENG
发明人： FUKUDA KENICHIRO , NOGUCHI MINORU , MORIOKA HIROSHI , SAKAI SHIGETOSHI , NISHIYAMA HIDETOSHI
IPC分类号： G01N21/88 , G01N21/94 , G01N21/956 , G02B7/28 , G03B13/36 , G03F9/00 , H01L21/027 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To easily adjust the extent of focusing range corresponding to the positioning precision of a semiconductor substrate supporting mechanism of respective process apparatuses and at the same time, to improve the function of detecting foreign matters and improve the production yield by making the numerical apertures for illuminating light for detecting focal point changeable. SOLUTION: Light rays from a lighting source 101 such as a semiconductor laser pass through a lens 102a and reach an object work (a wafer) 4 whose focal point to be measured, and thus an image of the lighting source 101 is formed. Moreover, the image of the lighting source 101 focused on the work 4 is formed on a detector 105 by a lens 102b. The number of apertures of the lens 102a can be adjusted through an aperture diaphragm 103 by properly selecting lens stops with different sizes. That is, the size of the spot diameter of the work 4 can be adjusted by selecting the diameter of an aperture diaphragm 103. Consequently, the size of the spot diameter oon the detector 5 can be adjusted, so that the extent of the focusing range can be adjusted corresponding to the positioning precision of the z-axial stage 108.

17. 发明专利

JPH0855886A MANUFACTURE OF SEMICONDUCTOR DEVICE AND ITS MANUFACTURING FACILITY 失效
公开(公告)号：JPH0855886A
公开(公告)日：1996-02-27
申请号：JP17892095
申请日：1995-07-14
申请人： HITACHI LTD
发明人： NOGUCHI MINORU , KENBO YUKIO , MORIOKA HIROSHI , YAMAGUCHI HIROSHI , KONO MAKIKO , OSHIMA YOSHIMASA
IPC分类号： H01L21/66
摘要： PURPOSE:To readily manufacture a semiconductor by carrying a substrate to each of a plurality of treatment devices and easily coping with the generation of foreign objects on the substrate. CONSTITUTION:When foreign objects are detected by an off-line foreign object detection system 1002 while a substrate is carried to each of a plurality of treatment devices 100-106 for treatment, the succeeding occurrence of the foreign objects can be coped with easily and a semiconductor can be manufactured if the state of the treatment devices 100-106 can be constantly monitored by a sensing part 200 in an off-line foreign object inspection system 1001.

18. 发明专利

JPH06324003A FOREIGN MATTER INSPECTING DEVICE AND METHOD 失效
公开(公告)号：JPH06324003A
公开(公告)日：1994-11-25
申请号：JP11019093
申请日：1993-05-12
申请人： HITACHI LTD , HITACHI VIDEO & INF SYST
发明人： NOGUCHI MINORU , MORIOKA HIROSHI , OSHIMA YOSHIMASA , KENBO YUKIO , NISHIYAMA HIDETOSHI , MATSUOKA KAZUHIKO , SHIGYO YOSHIHARU , MINAMITANI NORIHIRO
IPC分类号： G01N21/88 , G01N21/94 , G01N21/956 , H01L21/66
摘要： PURPOSE:To provide a foreign matter inspecting device and its method which inspects the foreign matter generation status in a manufacturing process for detecting a defect such as a foreign matter generated at the manufacturing process for manufacturing a target object by forming a pattern on a substrate, analyzes it, an then provide measures against. CONSTITUTION:The inspecting device consists of a detection head which is constituted of a lighting means 102, a detection optical system 103, a space filter unit 106, a detector 107, an operational amplifier 201, and an A/D converter 202 and a pitch detection means 212, an operator treatment system 303, a foreign matter data memory 206, a large foreign data memory 207, a pattern memory 208, a soft treatment system 210, a parameter transfer means 209, a foreign matter memory 211, a coordinate data creation means 232, a microcomputer 229, and a display means 230.

19. 发明专利

JPH06194320A METHOD AND EQUIPMENT FOR INSPECTING MIRROR FACE SUBSTRATE IN SEMICONDUCTOR MANUFACTURING LINE AND METHOD FOR MANUFACTURING 失效
公开(公告)号：JPH06194320A
公开(公告)日：1994-07-15
申请号：JP34588992
申请日：1992-12-25
申请人： HITACHI LTD
发明人： NOGUCHI MINORU , MORIOKA HIROSHI , KENBO YUKIO
IPC分类号： G01B11/24 , G01B11/245 , G01N21/88 , G01N21/94 , G01N21/956 , G01Q30/02 , G01Q60/12 , H01L21/66
摘要： PURPOSE:To allow to a mass production line of LSI to quickly rise, in early stage, with a yield by providing means for Performing photoelectric conversion with a pixel of specific mum or less, expressed in terms of the size on a mirror substrate, and detecting a signal corresponding to the number of scattering photons. CONSTITUTION:A mirror wafer 401 (provided with gentle irregularities having maximum height of 0.7nm or less at a pitch of 0.3mum or less) is mounted on a stage section 1560 and illuminated by an illumination optical system 1530. When a dust particle (microparticle of 0.05mum-0.109mum) is present at a detecting position 803 on the surface of the wafer, scattering light therefrom is detected by an objective lens 1541. Number of electrons arriving at a fluorescent surface 1523 varies depending on the number of photons being detected and thereby the intensity of a signal being detected by a linear sensor 1552, constituted of pixels having size of 1mum or less when expressed on the mirror surface wafer, varies. Consequently, a signal is detected by an appropriate threshold when the number of photons is large whereas a signal having a small value is detected when the number of photons is small.

20. 发明专利

JPH0616481B2 失效
公开(公告)号：JPH0616481B2
公开(公告)日：1994-03-02
申请号：JP21931986
申请日：1986-09-19
申请人： HITACHI LTD
发明人： NAKADA TOSHIHIKO , OSHIDA YOSHITADA , MORIOKA HIROSHI , SHIBA MASATAKA
IPC分类号： G01B11/00 , G03F7/20 , G03F9/00 , H01L21/027 , H01L21/30

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