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1. 发明专利

JP2006179889A Method and apparatus for inspecting circuit pattern 有权
标题翻译：检查电路图的方法和装置
公开(公告)号：JP2006179889A
公开(公告)日：2006-07-06
申请号：JP2005346042
申请日：2005-11-30
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NOZOE MARI , MACHIDA KAZUHISA , ITO MASANORI , USAMI YASUTSUGU , HIROI TAKASHI , MORIOKA HIROSHI
IPC分类号： H01L21/66 , G01B11/24 , G01B15/04 , G01B15/08 , G01N21/956 , G01N23/225 , G03F1/84 , G03F1/86 , H01J37/22 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a technique for improving operability when setting various conditions needed for inspection in a technique for inspecting a minute circuit pattern using an image formed by irradiating a white light, a laser beam, or an electron beam. SOLUTION: This is a circuit pattern inspection apparatus that is composed of a means for irradiating a light or a light and charged particle beam onto a substrate surface on which a circuit pattern is formed, a means for detecting a signal generated from the substrate, a means for imaging the signal detected by the detection means for temporary storage, a means for comparing the stored image of the region against a region where the other same circuit pattern is formed, and a means for determining a defect on the circuit pattern from the comparison result. The operation screen for inspection and inspection conditions setting has a screen area that displays operation status or input data, and a means for displaying subject names showing the screen, and the subject names are displayed as an integral part of the operation screen region. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于在使用通过照射白光，激光束或电子束形成的图像的微小电路图案的检查技术中设置检查所需的各种条件时提高可操作性的技术。解决方案：这是一种电路图形检查装置，其由用于将光或光和带电粒子束照射到其上形成有电路图案的基板表面上的装置，用于检测从基板，用于对由检测装置检测的用于临时存储的信号进行成像的装置，用于将存储的区域的图像与形成另一个相同电路图案的区域进行比较的装置，以及用于确定电路图案上的缺陷的装置从比较结果。用于检查和检查条件设置的操作屏幕具有显示操作状态或输入数据的屏幕区域，以及用于显示显示屏幕的主题名称的装置，并且将主题名称显示为操作屏幕区域的组成部分。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2004157135A Method of and apparatus for inspecting circuit pattern 审中-公开
公开(公告)号：JP2004157135A
公开(公告)日：2004-06-03
申请号：JP2004010030
申请日：2004-01-19
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NOZOE MARI , SHINADA HIROYUKI , WATANABE KENJI , SAEKI KEIICHI , SUGIMOTO ARITOSHI , MORIOKA HIROSHI , TANAKA MAKI , MIYAI YASUSHI
IPC分类号： G01N23/225 , H01J37/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To conduct inspection under optimum conditions without delay of inspection time by obtaining an optimal irradiation condition of an electron beam according to the material and structure of a circuit pattern to be inspected and kinds of defects to be detected. SOLUTION: An optimal value of irradiation energy according to the structure of a sample is registered with a database within the apparatus in advance. A user is allowed to search for a recommended value of irradiation energy suitable for inspection by inputting or selecting irradiation energy, or inputting information on the structure of an object to be inspected. By using the inspecting method, a substrate having a circuit pattern is inspected, while an image of a location in which a defect is detected is automatically stored. By using the stored image, defects are classified simultaneously with or separately from the inspection. COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2003197699A PROCESS PERFORMING EQUIPMENT AND SYSTEM THEREFOR 审中-公开
公开(公告)号：JP2003197699A
公开(公告)日：2003-07-11
申请号：JP2002262450
申请日：2002-09-09
申请人： HITACHI LTD
发明人： NOGUCHI MINORU , KENBO YUKIO , MORIOKA HIROSHI , NISHIYAMA HIDETOSHI , DOI HIDEAKI , SHIBA MASATAKA , SHIGYO YOSHIHARU , MATSUOKA KAZUHIKO , WATANABE KENJI , OSHIMA YOSHIMASA , ENDO FUMIAKI , TANIGUCHI YUZO
IPC分类号： G01B11/30 , G01N21/956 , H01L21/027 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a process performing equipment, a system for the same and product storing equipment by which a semiconductor substrate can be produced by high yield, by reducing the generation of abnormal stuck foreign matter to the semiconductor substrate in various kinds of process processors. SOLUTION: In order to detect the foreign matter stuck onto a work 4 carried by a handling mechanism 5 inside of a carrying room 104 or inside of a spare room in the process performing equipment, the process performing equipment is provided with a foreign matter inspection device having a detection head 1a and a processing means. The detection head 1a comprises a plurality of sets of an illumination optical system for irradiating the surface of the work 4 with a luminous flux converged from a direction oblique to the surface of the work 4, and a detection optical system which collects scattered light from the foreign matter on the work irradiated by the illumination optical system an photodetects it by a photoelectric conversion means. The processing means processes a signal detected by the photoelectric conversion means of the detection head to extract a signal from the foreign matter. COPYRIGHT: (C)2003,JPO

4. 发明专利

JP2003179115A FOREIGN OBJECT MONITORING METHOD AND SYSTEM 审中-公开
公开(公告)号：JP2003179115A
公开(公告)日：2003-06-27
申请号：JP2002234303
申请日：2002-08-12
申请人： HITACHI LTD
发明人： MORIOKA HIROSHI , NOGUCHI MINORU , OSHIMA YOSHIMASA , KENBO YUKIO , TANIGUCHI YUZO
IPC分类号： G01N21/956 , H01L21/02 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a method and a system of monitoring a foreign object attached on the surface of a product wafer, by which a large amount of defectives can be prevented from occurring to manufacture the product wafers with a high yield. SOLUTION: This foreign object monitoring system is equipped with a plurality of foreign object monitoring means which are arranged, corresponding to a plurality of processing units provided on a semiconductor production line, a plurality of outputting means which are provided, corresponding to the foreign object monitoring means to output the foreign object data of the foreign object monitoring means which monitors foreign objects on the surface of the substrate processed by the processing units, and a foreign object analyzing means which processes the foreign object data outputted from a plurality of the outputting means. Many defectives can be prevented from resulting by the above foreign object monitoring system, and the high yield can be maintained. COPYRIGHT: (C)2003,JPO

5. 发明专利

JP2003115428A METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003115428A
公开(公告)日：2003-04-18
申请号：JP2002198453
申请日：2002-07-08
申请人： HITACHI LTD
发明人： MORIOKA HIROSHI , NOGUCHI MINORU , OSHIMA YOSHIMASA , KENBO YUKIO
IPC分类号： H01L21/66 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To enable detection of foreign matter on a wafer being conveyed in a real time in an inspection method of the foreign matter on the wafer and to enable previous prevention of a great quantity of defects and maintenance of a defect rate in mass production line of a semiconductor manufacturing process. SOLUTION: The mass production line of the semiconductor manufacturing process is constituted so that a foreign matter inspection device is downsized and is set on an input port and an output port of processors of semiconductor manufacturing line or a conveyance system between the processors. Also, a device of detecting the foreign matter on a repetitive pattern part on the wafer is provided by means of a refractive index variable type lens array, a spatial filter, and a pattern information removal circuit. Thereby, the inspection of the foreign matter on the wafer being conveyed is enabled.

6. 发明专利

JP2002195959A METHOD FOR INSPECTING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2002195959A
公开(公告)日：2002-07-10
申请号：JP2001345522
申请日：2001-11-12
申请人： HITACHI LTD
发明人： NOGUCHI MINORU , KENBO YUKIO , MORIOKA HIROSHI
IPC分类号： G01B11/30 , G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To particularly reduce noise caused by a scattering light from a substrate and detect minute foreign particles in a method for inspecting the foreign particles on the substrate. SOLUTION: An incident angle of an illuminating optical system is reduced and a detected region is sufficiently reduced by a detecting optical system having high detecting resolution and a detector having small detecting pixels. Since a phase difference is reduced by increasing the incident angle of the illuminating optical system when the light is diffracted, the scattering light from the substrate can be reduced. The minute particles (the minute foreign particles) sticking to a mirror finished wafer can be detected.

7. 发明专利

JP2000164661A INSPECTION DEVICE OF CIRCUIT PATTERN 失效
公开(公告)号：JP2000164661A
公开(公告)日：2000-06-16
申请号：JP34029698
申请日：1998-11-30
申请人： HITACHI LTD
发明人： NARA YASUHIKO , MACHIDA KAZUHISA , NOZOE MARI , MORIOKA HIROSHI , USAMI YASUTSUGU , HIROI TAKASHI
IPC分类号： G06T1/00 , G06T7/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To improve handling performance by casting a light, a laser light and a charged particle beam, detecting a signal generated from a wafer, imaging and storing the signal, comparing the signal with the other same pattern image, judging a defect and storing the formed content in two steps of a quality and a process. SOLUTION: A primary electron beam 19 is two-dimensionally operated in XY directions and casted on a circuit pattern with an operation signal generator 44. Secondary electrons 51 generated from a part position to be observed is detected, and an electron beam image is obtained. An image processing part 5 successively stores detected signals with time which correspond to desired picture elements of electron beam irradiation positions designated from a control part 6, in a storing part 46 or 47. A defect judging part 49 compares and operates the above signals with image signals of the same circuit pattern and a part, in an operation part 48, compares the absolute value of a defference image signal with a specified threshold value and displays its position, the number of defects, etc., on a monitor 50. A quality file and a process file (recipe) are properly separated and fed back to processes.

8. 发明专利

JPH08250569A PROCESSOR, SYSTEM THEREOF AND PRODUCT STORING APPARATUS 失效
公开(公告)号：JPH08250569A
公开(公告)日：1996-09-27
申请号：JP5429195
申请日：1995-03-14
申请人： HITACHI LTD
发明人： NOGUCHI MINORU , KENBO YUKIO , MORIOKA HIROSHI , NISHIYAMA HIDETOSHI , DOI HIDEAKI , SHIBA MASATAKA , SHIGYO YOSHIHARU , MATSUOKA KAZUHIKO , WATANABE KENJI , OSHIMA YOSHIMASA , ENDO FUMIAKI , TANIGUCHI YUZO
IPC分类号： H01L21/66 , G01N21/88 , G01N21/93 , G01N21/94 , G01N21/956 , H01L21/02
摘要： PURPOSE: To provide a processor, the system thereof and a product storing apparatus, by which the occurrences of abnormal attached foreign matters on a semiconductor substrate such as a semiconductor wafer and a TFT substrate are decreased and the substrates can be produced at a high yield rate. CONSTITUTION: Foreign matters attached on a work 4, which is conveyed by a handling mechanism 5 in a conveying chamber 104 in a processing device, are detected directly or through a transparent window provided in the upper lid of the conveying chamber. Or the foreign matters attached on the work 4 conveyed by the handling mechanism 5 in a preliminary chamber are detected. A lighting optical system casts the light on the surface of the work 4 in the slant direction. A detecting optical system condenses the scattered light from the foreign matters on the illuminated work, receives the light with a photoelectric conversion means and detects the foreign matter. A detecting head 1a is constituted of a plurality of the sets of the lighting optical systems and the detecting optical systems. A processing means processes the signals detected by the photoelectric conversion means of the detecting head and extracts the signals from the foreign matters. The foreign-matter detecting device having the detecting head 1a and the processing means is provided.

9. 发明专利

JPH06258239A DEFECT DETECTING DEVICE AND METHOD THEREOF 失效
公开(公告)号：JPH06258239A
公开(公告)日：1994-09-16
申请号：JP4772193
申请日：1993-03-09
申请人： HITACHI LTD
发明人： NOGUCHI MINORU , MORIOKA HIROSHI , NISHIYAMA HIDETOSHI , KENBO YUKIO , OSHIMA YOSHIMASA , MATSUOKA KAZUHIKO , SHIGYO YOSHIHARU
IPC分类号： G01B11/30 , G01N21/88 , G01N21/94 , G01N21/956 , G01Q30/02 , G01Q30/08 , G01Q30/20 , G01Q60/10 , G03F1/84 , G06T1/00 , H01L21/66 , G06F15/62
摘要： PURPOSE:To detect a defect such as a foreign matter at high speed in full automation with high accuracy by clearing signals generated according to a repetition pattern of the large pitch on a board while comparing them with each other. CONSTITUTION:A board 1 is illuminated by an illuminating means 102, and scattered light or diffracted light from a foreign matter on the surface, a defect or a pattern is taken in, and optical filtering processing is carried out in a space filter unit 106. A signal detected by a detector 107 is amplified by an operation amplifier 201, and is converted by an A/D converter 202, and is transmitted to an operator processing system 203. Pattern information is removed in the processing system 203 by using repeatability of the chip pitch according to information such as the chip repeating pitch transmitted by a parameter transmitting means 209. That is, signals generated according to a repetition pattern of the large pitch are compared with each other, and these are cleared, The result is stored in a foreign matter data memory 206 and a pattern memory 208.

10. 发明专利

JPH0238951A DEVICE AND METHOD FOR FOREIGN MATTER DETECTION 失效
公开(公告)号：JPH0238951A
公开(公告)日：1990-02-08
申请号：JP18840588
申请日：1988-07-29
申请人： HITACHI LTD
发明人： UTO YUKIO , MORIOKA HIROSHI , OSHIMA YOSHIMASA , KOIZUMI MITSUYOSHI
IPC分类号： G01N21/88 , G01N21/94 , G01N21/956 , H01L21/027 , H01L21/30 , H01L21/66
摘要： PURPOSE:To light the surface of a body to be measured linearly without providing any movable part and to shorten an inspection time by providing an oblique light optical system with a linear optical system. CONSTITUTION:The oblique lighting system 5a lights the surface of the sample 7 slantingly above 18 to form a linear spot 8. The detection system consisting of an image forming lens 9, a light shielding plate 10, and a detector 11 is provided vertically and the linear spot 8 and the light receiving surface of the detector 11 are in image formation relation by the image forming lens 9; if there is foreign matter in the linear spot 8, scattered light is generated and its image is projected on the detector 11 and detected. The sample 7 on a stage 12 is moved at equal speed by a motor 13 and a feed screw 14 and inspected. The electric signal 11a from the detector 11 is processed by a binarization circuit 15 and an arithmetic circuit 16 and when the foreign matter is detected, its coordinates are displayed on a foreign matter display part 17.

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