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11. 发明申请

US20070069357A1 Device for thermal transfer and power generation 有权
标题翻译：热转印和发电装置
公开(公告)号：US20070069357A1
公开(公告)日：2007-03-29
申请号：US11449002
申请日：2006-06-07
申请人： Stanton Weaver , Mehmet Arik
发明人： Stanton Weaver , Mehmet Arik
IPC分类号： H01L23/02
CPC分类号： H01L35/08 , H01J45/00 , H01L35/32
摘要： A system is provided. The system includes a device that includes top and bottom thermally conductive substrates positioned opposite to one another, wherein a top surface of the bottom thermally conductive substrate is substantially atomically flat and a thermal blocking layer disposed between the top and bottom thermally conductive substrates. The device also includes top and bottom electrodes separated from one another between the top and bottom thermally conductive substrates to define a tunneling path, wherein the top electrode is disposed on the thermal blocking layer and the bottom electrode is disposed on the bottom thermally conductive substrate.
摘要翻译：提供了一个系统。该系统包括一个装置，该装置包括彼此相对定位的顶部和底部导热基底，其中底部导热基底的顶表面基本上是原子上平坦的，以及设置在顶部和底部导热基底之间的热阻挡层。该装置还包括在顶部和底部导热基板之间彼此分离的顶部和底部电极以限定隧道路径，其中顶部电极设置在热阻挡层上，而底部电极设置在底部导热基底上。

12. 发明申请

US20060207643A1 Device for thermal transfer and power generation and system and method incorporating same 有权
标题翻译：用于热转印和发电的装置及其结合的系统和方法
公开(公告)号：US20060207643A1
公开(公告)日：2006-09-21
申请号：US11081986
申请日：2005-03-16
申请人： Stanton Weaver , Robert Wojnarowski
发明人： Stanton Weaver , Robert Wojnarowski
IPC分类号： H01L35/30
CPC分类号： H01L35/32 , Y10T156/1092
摘要： A device includes first and second electrically conductive substrates that are positioned opposite from one another. The device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.
摘要翻译：一种器件包括彼此相对定位的第一和第二导电衬底。该装置还包括设置在第一和第二导电基底之间的密封层和具有导电材料的多个中空结构，其中多个中空结构由第一和第二导电基底之间的密封层容纳。

13. 发明申请

US20060091778A1 Phosphor blends for green traffic signals 有权
标题翻译：荧光粉混合绿色交通信号
公开(公告)号：US20060091778A1
公开(公告)日：2006-05-04
申请号：US10979912
申请日：2004-11-02
申请人： Anant Setlur , Emil Radkov , Alok Srivastava , Stanton Weaver , Thomas Stecher , Holly Comanzo
发明人： Anant Setlur , Emil Radkov , Alok Srivastava , Stanton Weaver , Thomas Stecher , Holly Comanzo
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： C09K11/7734 , C09K11/7739 , C09K11/774 , H01L33/502 , H01L33/507 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2924/00012
摘要： There is provided a blue-green illumination system, including a semiconductor light emitter, and a luminescent material, wherein the system has an emission with CIE color coordinates located within an area of a of a pentagon on a CIE chromaticity diagram, whose corners have the following CIE color coordinates: i) x=0.0137 and y=0.4831; ii) x=0.2240 and y=0.3890; iii) x=0.2800 and y=0.4500; iv) x=0.2879 and y=0.5196; and v) x=0.0108 and y=0.7220. The luminescent material includes two or more phosphors. The illumination system may be used as the green light of a traffic light or an automotive display.
摘要翻译：提供了包括半导体光发射器和发光材料的蓝绿照明系统，其中该系统具有CIE色坐标位于CIE色度图的五边形区域内的发射，其角部具有遵循CIE色坐标：i）x = 0.0137和y = 0.4831; ii）x = 0.2240和y = 0.3890; iii）x = 0.2800和y = 0.4500; iv）x = 0.2879和y = 0.5196; 和v）x = 0.0108和y = 0.7220。发光材料包括两种或更多种荧光体。照明系统可以用作交通信号灯或汽车显示器的绿灯。

14. 发明申请

US20050006651A1 Light-emitting diode (LED) with amorphous fluoropolymer encapsulant and lens 有权
标题翻译：具有无定形含氟聚合物密封剂和透镜的发光二极管（LED）
公开(公告)号：US20050006651A1
公开(公告)日：2005-01-13
申请号：US10609040
申请日：2003-06-27
申请人： Steven LeBoeuf , Donald Buckley , Stanton Weaver
发明人： Steven LeBoeuf , Donald Buckley , Stanton Weaver
IPC分类号： H01L33/50 , H01L27/15
CPC分类号： H01L33/502 , H01L33/44 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2224/16225 , H05K1/0203 , H05K2201/10106
摘要： A lens and encapsulant made of an amorphous fluoropolymer for a light-emitting diode (LED) or diode laser, such as an ultraviolet (UV) LED (UVLED). A semiconductor diode die (114) is formed by growing a diode (110) on a substrate layer (115) such as sapphire. The diode die (114) is flipped so that it emits light (160, 365) through the face (150) of the layer (115). An amorphous fluoropolymer encapsulant encapsulates the emitting face of the diode die (114), and may be shaped as a lens to form an integral encapsulant/lens. Or, a lens (230, 340) of amorphous fluoropolymer may be joined to the encapsulant (220). Additional joined or separate lenses (350) may also be used. The encapsulant/lens is transmissive to UV light as well as infrared light. Encapsulating methods are also provided.
摘要翻译：由用于发光二极管（LED）或二极管激光器（例如紫外线（UV）LED（UVLED））的无定形含氟聚合物制成的透镜和密封剂。通过在诸如蓝宝石的衬底层（115）上生长二极管（110）来形成半导体二极管管芯（114）。二极管管芯（114）被翻转，使得它通过层（115）的面（150）发光（160,365）。无定形氟聚合物密封剂封装二极管管芯（114）的发射面，并且可以被成形为透镜以形成整体的密封剂/透镜。或者，可以将无定形含氟聚合物的透镜（230,340）接合到密封剂（220）。还可以使用附加的连接或分开的透镜（350）。密封剂/透镜对于紫外线以及红外光是透射的。还提供封装方法。

15. 发明申请

US20080042163A1 Thermal Transfer Device and System and Method Incorporating Same 失效
标题翻译：热转印装置及其相结合的方法和方法
公开(公告)号：US20080042163A1
公开(公告)日：2008-02-21
申请号：US11925396
申请日：2007-10-26
申请人： Stanton Weaver
发明人： Stanton Weaver
IPC分类号： H01L29/40 , H05K3/00
CPC分类号： F25B21/00 , F25B2321/003 , Y02B30/66 , Y10T29/49147
摘要： A thermal transfer device having a first substrate layer, a second substrate layer and first and second electrodes disposed between the first substrate layer and the second substrate layer. The thermal transfer device also includes a release layer disposed between the first electrode and the second electrode and an actuator disposed adjacent the first and second electrodes. The actuator is adapted to separate the first and second electrodes from the release layer to open a thermotunneling gap between the first and second electrodes, and wherein the actuator is adapted to actively control the thermotunneling gap.
摘要翻译：一种热转印装置，具有第一基底层，第二基底层和设置在第一基底层和第二基底层之间的第一和第二电极。热转印装置还包括设置在第一电极和第二电极之间的释放层和邻近第一和第二电极设置的致动器。致动器适于将第一和第二电极与释放层分开以打开第一和第二电极之间的热电穿孔间隙，并且其中致动器适于主动地控制热电穿孔间隙。

16. 发明申请

US20070114557A1 Flip-chip light emitting diode device without sub-mount 审中-公开
公开(公告)号：US20070114557A1
公开(公告)日：2007-05-24
申请号：US11654165
申请日：2007-01-16
申请人： Bryan Shelton , Sebastien Libon , Hari Venugopalan , Ivan Eliashevich , Stanton Weaver , Chen-Lun Chen , Thomas Soules , Steven LeBoeuf , Stephen Arthur
发明人： Bryan Shelton , Sebastien Libon , Hari Venugopalan , Ivan Eliashevich , Stanton Weaver , Chen-Lun Chen , Thomas Soules , Steven LeBoeuf , Stephen Arthur
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/81 , H01L33/38 , H01L2224/0345 , H01L2224/03462 , H01L2224/0401 , H01L2224/04026 , H01L2224/05005 , H01L2224/05023 , H01L2224/05027 , H01L2224/0508 , H01L2224/05139 , H01L2224/05144 , H01L2224/05155 , H01L2224/05564 , H01L2224/05568 , H01L2224/05611 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/13639 , H01L2224/13644 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/3003 , H01L2224/73103 , H01L2224/73203 , H01L2224/83193 , H01L2224/83203 , H01L2224/83205 , H01L2224/8321 , H01L2224/8323 , H01L2224/83815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).

17. 发明申请

US20070097366A1 Optical system and method for detecting particles 审中-公开
标题翻译：用于检测颗粒的光学系统和方法
公开(公告)号：US20070097366A1
公开(公告)日：2007-05-03
申请号：US11262210
申请日：2005-10-31
申请人： Steven LeBoeuf , Alexei Vertiatchikh , Stanton Weaver , Radislav Potyrailo , Xian-An Cao
发明人： Steven LeBoeuf , Alexei Vertiatchikh , Stanton Weaver , Radislav Potyrailo , Xian-An Cao
IPC分类号： G01N21/00
CPC分类号： G01N21/6486 , G01N21/15 , G01N21/532 , G01N21/645
摘要： Embodiments of the invention include a particle detection system that includes a light emitting source, a non-collimating reflector, a collimating reflector, and a detector. Light from the light emitting source is directed by the non-collimating reflector to an area through which a particle stream may be transmitted. Fluorescent light from the light striking particles is redirected to the collimating reflector and then on to the detector. Other embodiments include a single pump used to pull a pair of fluid flows through the detection system. Other embodiments include a plurality of light emitting sources whose light is directed to a particle stream by a single reflector. Other embodiments include a method for detecting particles.
摘要翻译：本发明的实施例包括一种粒子检测系统，其包括发光源，非准直反射器，准直反射器和检测器。来自发光源的光由非准直反射器引导到可以传播颗粒物流的区域。来自光撞击颗粒的荧光被重定向到准直反射器，然后被引导到检测器上。其他实施例包括用于拉动一对流体流过检测系统的单个泵。其他实施例包括多个发光源，其光通过单个反射器被引导到颗粒流。其他实施方案包括用于检测颗粒的方法。

18. 发明申请

US20060068611A1 Heat transfer device and system and method incorporating same 审中-公开
标题翻译：传热装置及其结合的系统和方法
公开(公告)号：US20060068611A1
公开(公告)日：2006-03-30
申请号：US10955639
申请日：2004-09-30
申请人： Stanton Weaver , James Bray , Ahmed Elasser , Seth Taylor
发明人： Stanton Weaver , James Bray , Ahmed Elasser , Seth Taylor
IPC分类号： H05K1/00 , C23C14/00 , B32B37/00 , H01S4/00
CPC分类号： H01J45/00 , B32B2310/024 , H01L35/00 , Y10T29/49002
摘要： A method of manufacturing a heat transfer device including providing first and second thermally conductive substrates that are substantially atomically flat, providing a patterned electrical barrier on the first or second thermally conductive substrates and disposing a low work function material on the first or second thermally conductive substrates in an area oriented between the patterned electrical barrier in a configuration in which the first and second thermally conductive substrates are positioned opposite from one another. The method also includes bonding the first and second thermally conductive substrates in the configuration and extracting a plurality of units having opposite sections of the first and second thermally conductive substrates, each unit having a portion of the patterned electrical barrier disposed about the low work function material.
摘要翻译：一种制造传热装置的方法，包括提供基本上原子上平坦的第一和第二导热基板，在第一或第二导热基板上提供图案化的电阻挡层，并将低功函数材料设置在第一或第二导热基板上在其中第一和第二导热基板彼此相对定位的构造中的图案化电阻挡之间的区域中。该方法还包括将第一导热基板和第二导热基板结合在一起并且提取具有第一和第二导热基板的相对部分的多个单元，每个单元具有围绕低功函数材料设置的图案化电阻挡部分。

19. 发明申请

US20050258438A1 Light emitting diode apparatuses with heat pipes for thermal management 有权
标题翻译：具有用于热管理的热管的发光二极管装置
公开(公告)号：US20050258438A1
公开(公告)日：2005-11-24
申请号：US10851273
申请日：2004-05-21
申请人： Mehmet Arik , Stanton Weaver , Charles Becker
发明人： Mehmet Arik , Stanton Weaver , Charles Becker
IPC分类号： F21K99/00 , H01L21/00 , H01L25/075 , H01L33/64 , H01L33/00
CPC分类号： F21V29/51 , F21K9/00 , H01L25/0753 , H01L33/648 , H01L2224/16 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.
摘要翻译：发光设备（10,110,210,310,410）包括设置在芯片支撑壁（16,116,216）上的一个或多个发光二极管芯片（12,112,212,312,412），其包括印刷电路（34,134,234,360,362,460,462），与发光二极管芯片连接。热管（24,124,224,324,424）具有由包括芯片支撑壁和至少一个附加壁（18,20,28）的壁限定的密封体积（22,122,222,322,422） 120,218）。热管还包括设置在密封体积中的传热流体（26,226,326,426）。

20. 发明申请

US20050239227A1 Light emitting diode component 有权
标题翻译：发光二极管组件
公开(公告)号：US20050239227A1
公开(公告)日：2005-10-27
申请号：US10831862
申请日：2004-04-26
申请人： Srinath Aanegola , James Petroski , Emil Radkov , Stanton Weaver
发明人： Srinath Aanegola , James Petroski , Emil Radkov , Stanton Weaver
IPC分类号： H01L21/00 , H01L21/44 , H01L21/48 , H01L21/50 , H01L25/075 , H01L27/15 , H01L29/267 , H01L31/12 , H01L33/48 , H01L33/52 , H01L33/58 , H01L33/00
CPC分类号： H01L33/52 , H01L25/0753 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2924/00
摘要： A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.
摘要翻译：发光封装（8,8'，8“，208,408）包括支撑至少一个发光管芯（12,12”，“10”）的印刷电路板（10,10'，10“，210,410），14,16,212,412）。透光罩（60,60'，60“，260,460）设置在所述至少一个发光管芯上。盖具有限定与印刷电路板连接的盖周长（62,62'，62“，262,462）的开口端。与印刷电路板一起，盖的内表面限定包含至少一个发光管芯的内部容积（70,70“，270,470）。密封剂（76,76“，276,278,476）设置在内部体积中并且至少覆盖发光管芯。

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