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    • 12. 发明申请
    • INDUCTIVE PLASMA SOURCES FOR WAFER PROCESSING AND CHAMBER CLEANING
    • 晶片加工和室内清洗的感应等离子体源
    • WO2013019565A2
    • 2013-02-07
    • PCT/US2012/048400
    • 2012-07-26
    • APPLIED MATERIALS, INC.LIANG, Qiwei
    • LIANG, Qiwei
    • H01L21/205H01L21/3065
    • C23C16/5096H01J37/32357H01J37/32449H01J37/32577H01J37/32633
    • Methods and systems for depositing material on a substrate are described. One method may include providing a processing chamber partitioned into a first plasma region and a second plasma region. The method may further include delivering the substrate to the processing chamber, where the substrate may occupy a portion of the second plasma region. The method may additionally include forming a first plasma in the first plasma region, where the first plasma may not directly contact the substrate, and the first plasma may be formed by activation of at least one shaped radio frequency ("RF") coil above the first plasma region. The method may moreover include depositing the material on the substrate to form a layer, where one or more reactants excited by the first plasma may be used in deposition of the material.
    • 描述了用于在衬底上沉积材料的方法和系统。 一种方法可以包括提供分隔成第一等离子体区域和第二等离子体区域的处理室。 该方法可以进一步包括将衬底传送到处理室,其中衬底可以占据第二等离子体区域的一部分。 该方法可以另外包括在第一等离子体区域中形成第一等离子体,其中第一等离子体可以不直接接触衬底,并且第一等离子体可以通过激活以上的至少一个成形射频(“RF”)线圈来形成 第一等离子体区域。 此外,该方法可以包括将材料沉积在基板上以形成层,其中可以使用由第一等离子体激发的一种或多种反应物来沉积材料。
    • 17. 发明申请
    • PROCESS CHAMBER FOR DIELECTRIC GAPFILL
    • 电介质加工室
    • WO2007140421A9
    • 2008-12-31
    • PCT/US2007069996
    • 2007-05-30
    • APPLIED MATERIALS INCLUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • LUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • C23F1/00C23C16/22C23C16/30C23C16/36C23C16/40C23C16/46C23C16/48C23C16/52H01L21/306
    • C23C16/46C23C16/452C23C16/45565C23C16/45574H01L21/67115
    • A system (100) to form a dielectric layer on a substrate from a plasma of dielectric precursors is described. The system (100) may include a deposition chamber (201 ), a substrate stage in the deposition chamber (201 ) to hold the substrate, and a remote plasma generating system coupled to the deposition chamber (201 ), where the plasma generating system is used to generate a dielectric precursor having one or more reactive radicals. The system (100) may also include a precursor distribution system (700) comprising dual-channel showerhead (700) positioned above the substrate stage. The showerhead (700) may have a faceplate (802) with a first set of openings (804) through which the reactive radical precursor enters the deposition chamber (201 ), and a second set of openings (806) through which a second dielectric precursor enters the deposition chamber (201 ). An in-situ plasma generating system may als be included to generate the plasma in the deposition chamber (201 ) from the dielectric precursors supplied to the deposition chambe (201).
    • 描述了从电介质前体的等离子体在衬底上形成电介质层的系统(100)。 系统(100)可以包括沉积室(201),沉积室(201)中的用于保持基板的基板台和耦合到沉积室(201)的等离子体生成系统,其中等离子体产生系统是 用于产生具有一个或多个反应性基团的电介质前体。 系统(100)还可以包括前置分布系统(700),其包括位于衬底台上方的双通道喷头(700)。 喷头(700)可以具有带有第一组开口(804)的面板(802),反应性基团前体通过该开口进入沉积室(201),第二组开口(806)通过第二组开口 进入沉积室(201)。 可以包括原位等离子体产生系统以在从沉积腔(201)提供的电介质前体在沉积室(201)中产生等离子体。
    • 18. 发明申请
    • PROCESS CHAMBER FOR DIELECTRIC GAPFILL
    • 电介质加工室
    • WO2007140426A3
    • 2008-12-11
    • PCT/US2007070001
    • 2007-05-30
    • APPLIED MATERIALS INCLUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • LUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • C23F1/00C23C16/22C23C16/30C23C16/36C23C16/40C23C16/46C23C16/48C23C16/52H01L21/306
    • C23C16/45565C23C16/402C23C16/45574C23C16/505
    • A system (100) to form a dielectric layer on a substrate from a plasma of dielectric precursors is described. The system (100) may include a deposition chamber (201), a substrate stage in the deposition chamber (201) to hold the substrate, and a remote plasma generating system coupled to the deposition chamber (201), where the plasma generating system is used to generate a dielectric precursor having one or more reactive radicals. The system (100) may also include a precursor distribution system (700) comprising a dual-channel showerhead (700) positioned above the substrate stage. The showerhead (700) may have a faceplate (802) with a first set of openings (804) through which the reactive radical precursor enters the deposition chamber (201), and a second set of openings (806) through which a second dielectric precursor enters the deposition chamber (201). An in-situ plasma generating system may also be included to generate the plasma in the deposition chamber (201) from the dielectric precursors supplied to the deposition chamber (201)
    • 描述了从电介质前体的等离子体在衬底上形成电介质层的系统(100)。 系统(100)可以包括沉积室(201),沉积室(201)中的用于保持基板的基板台和耦合到沉积室(201)的等离子体生成系统,其中等离子体产生系统是 用于产生具有一个或多个反应性基团的电介质前体。 系统(100)还可以包括前体分配系统(700),其包括位于衬底台上方的双通道喷头(700)。 喷头(700)可以具有带有第一组开口(804)的面板(802),反应性基团前体通过该开口进入沉积室(201),第二组开口(806)通过第二组开口 进入沉积室(201)。 还可以包括原位等离子体产生系统,以从沉积室(201)中提供的电介质前体在沉积室(201)中产生等离子体,
    • 19. 发明申请
    • PROCESS CHAMBER FOR DIELECTRIC GAPFILL
    • 电介质加工室
    • WO2007140421A3
    • 2008-10-30
    • PCT/US2007069996
    • 2007-05-30
    • APPLIED MATERIALS INCLUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • LUBOMIRSKY DMITRYLIANG QIWEIPARK SOONAMCHUC KIEN NYIEH ELLIE
    • C23F1/00C23C16/22C23C16/30C23C16/36C23C16/40C23C16/46C23C16/48C23C16/52H01L21/306
    • C23C16/46C23C16/452C23C16/45565C23C16/45574H01L21/67115
    • A system (100) to form a dielectric layer on a substrate from a plasma of dielectric precursors is described. The system (100) may include a deposition chamber (201 ), a substrate stage in the deposition chamber (201 ) to hold the substrate, and a remote plasma generating system coupled to the deposition chamber (201 ), where the plasma generating system is used to generate a dielectric precursor having one or more reactive radicals. The system (100) may also include a precursor distribution system (700) comprising dual-channel showerhead (700) positioned above the substrate stage. The showerhead (700) may have a faceplate (802) with a first set of openings (804) through which the reactive radical precursor enters the deposition chamber (201 ), and a second set of openings (806) through which a second dielectric precursor enters the deposition chamber (201 ). An in-situ plasma generating system may als be included to generate the plasma in the deposition chamber (201 ) from the dielectric precursors supplied to the deposition chambe (201)
    • 描述了从电介质前体的等离子体在衬底上形成电介质层的系统(100)。 系统(100)可以包括沉积室(201),沉积室(201)中的用于保持基板的基板台和耦合到沉积室(201)的等离子体生成系统,其中等离子体产生系统是 用于产生具有一个或多个反应性基团的电介质前体。 系统(100)还可以包括前置分布系统(700),其包括位于衬底台上方的双通道喷头(700)。 喷头(700)可以具有带有第一组开口(804)的面板(802),反应性基团前体通过该开口进入沉积室(201),第二组开口(806)通过第二组开口 进入沉积室(201)。 可以包括原位等离子体产生系统以在从沉积腔(201)提供的电介质前体在沉积室(201)中产生等离子体,