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    • 93. 发明授权
    • High permeability composite films to reduce noise in high speed interconnects
    • 高磁导率复合薄膜可降低高速互连中的噪声
    • US06787888B2
    • 2004-09-07
    • US10371009
    • 2003-02-20
    • Leonard ForbesKie Y. AhnSalman Akram
    • Leonard ForbesKie Y. AhnSalman Akram
    • H01L2906
    • G11C7/02G11C7/18H01L23/5225H01L2223/6627H01L2924/0002H01L2924/1903H01L2924/3011H01L2924/00
    • A memory device is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the number of high permeability metal lines. A second layer of insulating material is formed on the transmission lines and the high permeability metal lines. The structure for transmission line operation includes a second layer of electrically conductive material on the second layer of insulating material.
    • 存储器件具有用于改善集成电路上的传输线操作的结构。 用于传输线操作的结构包括在衬底上的第一层导电材料。 第一层绝缘材料形成在导电材料的第一层上。 在第一绝缘材料层上形成多个高磁导率金属线。 高渗透性金属线的数量包括复合六铁氧体膜。 多个传输线形成在绝缘材料的第一层上并且与多个高导磁率金属线之间并且平行。 在传输线和高磁导率金属线上形成第二层绝缘材料。 用于传输线操作的结构包括在第二绝缘材料层上的第二层导电材料。
    • 94. 发明授权
    • High density stackable and flexible substrate-based devices and systems and methods of fabricating
    • 高密度可堆叠和灵活的基于衬底的器件及其制造方法和制造方法
    • US06785144B1
    • 2004-08-31
    • US09645373
    • 2000-08-24
    • Salman Akram
    • Salman Akram
    • H05K706
    • H05K1/147H01L23/5387H01L2224/16225H01L2924/00014H01L2924/01004H01L2924/01078H01L2924/01079H01L2924/01087H01L2924/3011H05K1/141H05K1/144H05K1/189H05K2201/10674H05K2201/2018H01L2224/0401
    • A flexible carrier substrate assembly or module that facilitates stacking of multiple carrier substrates bearing semiconductor dice for high density electronic systems. After the dice are placed on the flexible substrate, a flexible support frame may be applied to the flexible substrate. The support frame includes conductive paths therethrough to connect to circuit traces running from the dice on the substrate to the substrate perimeter to interconnect superimposed carrier substrates. The flexible carrier substrates may be bent to a radius of any given curvature to conform to various non-planar regular and irregular surfaces. Furthermore, since the frame as well as the substrate may be flexible, multiple, flexible substrate assemblies may be stacked one on top of another wherein an upper assembly has a different radius than a lower module and any intermediate assemblies have progressively differing radii from bottom to top position.
    • 一种柔性载体衬底组件或模块,其有助于堆叠多个承载用于高密度电子系统的半导体晶片的载体衬底。 在将骰子放置在柔性基板上之后,可以将柔性支撑框架施加到柔性基板上。 支撑框架包括穿过其中的导电路径以连接到从衬底上的骰子延伸到衬底周边的电路迹线,以互连叠加的载体衬底。 柔性载体基底可以弯曲到任何给定曲率的半径以符合各种非平面的规则和不规则表面。 此外,由于框架以及基板可以是柔性的,多个柔性基板组件可以一个在另一个的顶部上堆叠,其中上部组件具有与下部模块不同的半径,并且任何中间组件具有从底部到 最高职位。