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1. 发明公开

EP1503465A1 Connector 有权
标题翻译：连接器
公开(公告)号：EP1503465A1
公开(公告)日：2005-02-02
申请号：EP03017094.8
申请日：2003-07-28
申请人： Infineon Technologies AG
发明人： Kuzmenka, Maksim
IPC分类号： H01R43/02
CPC分类号： H01R43/0242 , H01R12/856 , H01R13/193
摘要： A connector (100) has a connector body (102), at least one contact (104, 106) and at least one bimetal stripe (108, 110). One end (104a, 104b) of the contact is fixed to the connector body and another end of each contact extends from a surface (102a) of the connector body forming a springy contact (104b, 106b). One end (108a, 110a) of the bimetal stripe is fixed in the connector body and another end (108b, 110b) of the bimetal stripe extends from the surface of the connector body. The bimetal stripe is arranged for moving the contact in a first or second position depending on the temperature of the bimetal stripe.
摘要翻译：连接器（100）具有连接器主体（102），至少一个触点（104,106）和至少一个双金属条（108,110）。触头的一端（104a，104b）固定到连接器本体，并且每个触头的另一端从形成弹性触头（104b，106b）的连接器本体的表面（102a）延伸。双金属条的一端（108a，110a）固定在连接器主体中，而双金属条的另一端（108b，110b）从连接器主体的表面延伸。双金属条被布置用于根据双金属条的温度在第一或第二位置移动触点。

2. 发明申请

WO1987003145A1 SHAPE MEMORY ACTUATOR FOR A MULTI-CONTACT ELECTRICAL CONNECTOR 审中-公开
标题翻译：用于多接点电气连接器的形状记忆执行器
公开(公告)号：WO1987003145A1
公开(公告)日：1987-05-21
申请号：PCT/US1986002474
申请日：1986-11-10
申请人： BETA PHASE, INC. , KRUMME, John, F.
发明人： BETA PHASE, INC.
IPC分类号： H01R13/20
CPC分类号： H01R12/856 , H01R4/01 , Y10S439/932
摘要： Shape memory materials, preferably metals, (81) are employed to replace levers to control opening and closing of opposed pairs of contacts (69, 71) in multicontact, zero insertion force connectors; the shape memory material opening the connectors.
摘要翻译：使用形状记忆材料（优选金属）（81）来替代杠杆以控制在多个零插入力连接器中的相对的触点对（69,71）的打开和关闭; 形状记忆材料打开连接器。

3. 发明授权

US07094108B2 Apparatus for forming modular sockets using flexible interconnects and resulting structures 失效
标题翻译：用于使用柔性互连和结构的结构形成模块化插座的装置
公开(公告)号：US07094108B2
公开(公告)日：2006-08-22
申请号：US10401199
申请日：2003-03-27
申请人： Warren M. Farnworth , David J. Corisis , Salman Akram
发明人： Warren M. Farnworth , David J. Corisis , Salman Akram
IPC分类号： H01R24/00
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
摘要翻译：提供了用于将多个微型半导体裸片附接到基板的模块化裸模插座组件。插座组件由在水平叠层中垂直连接的多个双面板组成，其中每个板具有用于可裸插入裸半导体管芯的管芯插座。多层互连引线带具有在一端弯曲的多个光刻形成的引线，以形成用于附接到可移除插入的半导体管芯上的接合焊盘并具有可连接到基板的相对端的节点。

4. 发明申请

US20050269686A1 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures 失效
标题翻译：用于使用柔性互连和结构的结构形成模块插座的方法和装置
公开(公告)号：US20050269686A1
公开(公告)日：2005-12-08
申请号：US11204081
申请日：2005-08-15
申请人： Warren Farnworth , David Corisis , Salman Akram
发明人： Warren Farnworth , David Corisis , Salman Akram
IPC分类号： H01L21/44 , H01L25/065 , H01R12/57 , H01R12/70 , H01R12/72 , H01R12/85 , H05K7/02
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
摘要翻译：提供了用于将多个微型半导体裸片附接到基板的模块化裸模插座组件。插座组件由在水平叠层中垂直连接的多个双面板组成，其中每个板具有用于可裸插入裸半导体管芯的管芯插座。多层互连引线带具有在一端弯曲的多个光刻形成的引线，以形成用于附接到可移除插入的半导体管芯上的接合焊盘并具有可连接到基板的相对端的节点。

5. 发明授权

US06612872B2 Apparatus for forming modular sockets using flexible interconnects and resulting structures 失效
标题翻译：用于使用柔性互连和结构的结构形成模块化插座的装置
公开(公告)号：US06612872B2
公开(公告)日：2003-09-02
申请号：US10158979
申请日：2002-05-30
申请人： Warren M. Farnworth , David J. Corisis , Salman Akram
发明人： Warren M. Farnworth , David J. Corisis , Salman Akram
IPC分类号： H01R2370
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
摘要翻译：一种用于将多个微型半导体管芯附接到衬底的模块裸露裸露插座组件。插座组件由在水平叠层中垂直连接的多个双面板组成，其中每个板具有用于可裸插入裸半导体管芯的管芯插座。多层互连引线带具有在一端弯曲的多个光刻形成的引线，以形成用于附接到可移除插入的半导体管芯上的接合焊盘并具有可连接到基板的相对端的节点。

6. 发明申请

US20020189092A1 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures 失效
标题翻译：用于使用柔性互连和结构的结构形成模块插座的方法和装置
公开(公告)号：US20020189092A1
公开(公告)日：2002-12-19
申请号：US10218334
申请日：2002-08-13
发明人： Warren M. Farnworth , David J. Corisis , Salman Akram
IPC分类号： H05K003/00 , H01R009/00
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.
摘要翻译：用于形成模块化裸模插座组件10并将多个微型半导体裸片18附接到衬底的方法。插座组件10由在水平叠层中垂直连接的多个双面板14组成，其中每个板14具有用于可裸插入裸半导体管芯18的管芯插座22.多层互连引线带50 具有在一端弯曲的多个光刻形成的引线以形成用于附接到可移除插入的半导体管芯18上的接合焊盘90的节点88，并且具有可连接到基板的相对端92。

7. 发明授权

US4846729A Zero insertion force connector actuated by a stored shape member 失效
标题翻译：零插入力连接器由存储的形状构件致动
公开(公告)号：US4846729A
公开(公告)日：1989-07-11
申请号：US94756
申请日：1987-09-10
申请人： Toshiya Hikami , Koji Yoshida , Yuichi Obara , Kenichi Fuse
发明人： Toshiya Hikami , Koji Yoshida , Yuichi Obara , Kenichi Fuse
IPC分类号： H01R4/01 , H01R12/16 , H01R12/18
CPC分类号： H01R12/856 , H01R4/01
摘要： An electronic connector which has a plurality of contacts associated in one or more rows in a connector housing, a shape memory spring associated in the connector housing for driving the contacts, the shape memory spring having a beginning shape and transmitting a recovery force to the contacts generated when the shape memory spring reaches a transformation temperature or higher while recovering a stored shape when the shape memory spring reaches the transformation temperature or higher and returning to the beginning shape by the spring force of the contact when the shape memory spring reaches below its transformation temperature. Thus, the electronic connector can mount or dismount contacts to each other without an inserting or removing force or substantially without an inserting or removing force in a simple structure with a reduced number of parts.
摘要翻译：一种电子连接器，其具有在连接器壳体中以一行或多列相关联的多个触点，与连接器壳体相关联的用于驱动触点的形状记忆弹簧，形状记忆弹簧具有起始形状，并将回复力传递到触点当形状记忆弹簧达到相变温度以上时，当形状记忆弹簧达到相变温度以上时，当形状记忆弹簧达到相变温度以上时，当形状记忆弹簧低于其变形时，由于接触的弹力而返回到起始形状温度。因此，电子连接器可以在没有插入或移除力的情况下将触点彼此安装或拆卸，或者在具有减少的部件数量的简单结构中基本上不插入或移除力。

8. 发明授权

US4787854A Connector for flat connections 失效
标题翻译：扁平连接用连接器
公开(公告)号：US4787854A
公开(公告)日：1988-11-29
申请号：US64020
申请日：1987-06-19
申请人： Guy Le Parquier
发明人： Guy Le Parquier
IPC分类号： H01R4/01 , H01R11/01 , H01R12/85 , H05K3/36 , H01R9/09
CPC分类号： H01R4/01 , H01R12/856 , H05K3/365 , Y10S439/932
摘要： The invention provides a connector for flat connections adapted for connecting electrically together printed circuit tracks or printed circuit tracks to a flat cable or two flat cables together. The connector includes a sleeve made from a shape memory material in which the conducting elements intended to be in electric contact are superimposed. The sleeve is adapted for applying transverse forces under the effect of a predetermined temperature so that electric continuity may be provided between these elements.
摘要翻译：本发明提供一种用于平坦连接的连接器，其适于将印刷电路轨道或印刷电路轨道电连接到扁平电缆或两条扁平电缆在一起。连接器包括由形状记忆材料制成的套筒，其中要与电接触的导电元件叠加在其中。该套筒适于在预定温度的作用下施加横向力，使得可以在这些元件之间提供电连续性。

9. 发明授权

US09929485B2 Card edge connector using a set of electroactive polymers 有权
公开(公告)号：US09929485B2
公开(公告)日：2018-03-27
申请号：US14940111
申请日：2015-11-12
申请人： International Business Machines Corporation
发明人： Tyler Jandt , Phillip V. Mann , Mark D. Plucinski , Sandra J. Shirk/Heath
IPC分类号： H01R24/00 , H01R12/72
CPC分类号： H01R12/721 , H01R4/01 , H01R12/856 , H01R43/26
摘要： Disclosed aspects include an apparatus having a card edge connector which has first and second positions. The apparatus may include a set of contacts to connect with a set of card edges in the second position. To adjust the set of contacts between the first position and the second position, the apparatus may include a set of electroactive polymers. Disclosed aspects include card edge connector management. It may be detected that a card edge connector is in a first position. A request for the card edge connector to be in a second position can be received. It is determined to adjust the card edge connector. The card edge connector is adjusted using a set of electroactive polymers. In embodiments, such adjustment can include introducing a voltage which causes the set of electroactive polymers to adjust a set of contacts between the first and second positions.

10. 发明申请

US20020142661A1 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures 失效
公开(公告)号：US20020142661A1
公开(公告)日：2002-10-03
申请号：US10158979
申请日：2002-05-30
发明人： Warren M. Farnworth , David J. Corisis , Salman Akram
IPC分类号： H01R024/00
CPC分类号： H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R12/7082 , H01R12/721 , H01R12/856 , H01R13/24 , H01R13/514 , H05K7/023 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49169 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.

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