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91. 发明专利

JPS6073347A METHOD AND APPARATUS FOR INSPECTING BONDING STATE 失效
公开(公告)号：JPS6073347A
公开(公告)日：1985-04-25
申请号：JP18068783
申请日：1983-09-30
申请人： HITACHI LTD
发明人： HIROI TAKASHI , NINOMIYA TAKANORI , NAKAGAWA YASUO
IPC分类号： G01N25/72
摘要： PURPOSE:To rapidly and accurately judge the presence and absence of the defect in a bonded region, by determining an atmospheric condition from a short-time temp. change due to heating receiving no influence of the presence and absence of the defect in the bonded region, and correcting temp. change over a long time. CONSTITUTION:The inspection part 11 provided to the surface of a lead 9, which is bonded to a base plate surface 10 by solder, opposite to the bonding surface thereof is heated by the irradiation of laser beam from a heating source 12 through a shutter 13 controlled by a control part 19. In this case, thermal radiation is detected by a detector 15 and the surface state determining part of the control part 9 determines correction coefficient corresponding to an atmospheric condition responding to a surface inclination or state from short-time temp. change receiving no influence of the presence and absence of the defect in the bonded region. Temp. change over a long time corresponding to the defect in the bonded region is corrected on the basis of this correction coefficient by the calibration part of the control part. By this constitution, the presence and absence of the defect in the bonded region is judged rapidly and accurately without spending a long time in inspection preparation.

92. 发明专利

JPS6011105A PATTERN DETECTING DEVICE 失效
公开(公告)号：JPS6011105A
公开(公告)日：1985-01-21
申请号：JP11833583
申请日：1983-07-01
申请人： HITACHI LTD
发明人： NINOMIYA TAKANORI , NAKAGAWA YASUO , HIROI TAKASHI
IPC分类号： G01B11/24 , G01B11/25 , G06T1/00 , G06T7/60
摘要： PURPOSE:To detect positions and shapes of plural objects different in vertical position independently of one another by detecting lengths from a reference face to surfaces of objects and detecting outlines of objects with two-dimensional differentiation and detecting positions and shapes of three-dimensionally arranged objects independently of one another. CONSTITUTION:A slit light 8 is projected to an object 9. The image detected by an image pickup device 7 is taken out as a waveform signal of the shape of a slit bright line, and this signal indicates the shape of a section of the object. When a waveform signal 13 of the shape of the slit bright line is taken out while moving the position of the slit light 8 and the image pickup position in a uniform speed by a feeding device 10, a length image 12 as the whole is obtained. A two-dimensional image detector such as a TV camera, the combination of a linear sensor and a galvanomirror, or the like is used as the image pickup device 7, and the length image is detected with a high precision by a relatively simple constitution.

93. 发明专利

JP2003106829A PATTERN INSPECTION METHOD AND APPARATUS 审中-公开
公开(公告)号：JP2003106829A
公开(公告)日：2003-04-09
申请号：JP2001298910
申请日：2001-09-28
申请人： HITACHI LTD
发明人： HIROI TAKASHI , WATANABE MASAHIRO , KUNI TOMOHIRO , TANAKA MAKI , FUKUNISHI MUNENORI , MIYAI YASUSHI , NARA YASUHIKO , ISOBE MITSUNOBU
IPC分类号： G01B15/00 , G01B15/04 , G01B15/08 , G01N21/956 , G01N23/04 , G01N23/20 , G01N23/22 , G01N23/225 , G06K9/64 , G06T7/00 , H01L21/027 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To solve the problem that defect data outputted by an inspection apparatus include only feature variable data such as coordinates data, area, and projected length and only the coordinates data for moving the defect position are validly utilized. SOLUTION: Not only the feature variable data but also image data are added as defect data by the inspection apparatus, and the image data can be, for exampled, searched for by an external result confirmation apparatus. In the case of a plurality of defect data, the defect map is displayed by searching for a similar defect on an image, performing trend display of the searched result, and specifying one searched result on the trend, and the defect on the defect map is specified, thus displaying the defect image in inspection.

94. 发明专利

JP2002310962A SORTING METHOD AND OBSERVATION METHOD FOR IMAGE AND APPARATUS THEREFOR 失效
公开(公告)号：JP2002310962A
公开(公告)日：2002-10-23
申请号：JP2001120467
申请日：2001-04-19
申请人： HITACHI LTD
发明人： NAKAGAKI AKIRA , TAKAGI YUJI , HIROI TAKASHI , WATANABE MASAHIRO , NOGUCHI MINORU , AOKI KAZUO
IPC分类号： G01N23/225 , G01N21/95 , G01N21/956 , G01Q10/00 , G01Q30/20 , H01J37/20 , H01J37/22 , H01L21/66 , H04N7/18
摘要： PROBLEM TO BE SOLVED: To provide an automatic image collector and a method thereof which enable to obtain and sort images of defective parts automatically at a higher speed as for defects generated in the production process of semiconductor wafers as detected with a defect inspection instrument. SOLUTION: In the image collector which automatically takes and collects images a plurality of parts to be observed on semiconductor wafers, there are arranged a scheduling part which determines the order of photographing defects and the moving speeds of stages based on the positional relationship of the plurality of parts to be observed on the wafers, and a control unit which feeds back the movement of the stages to the degree of deflection of beams. This enables to take and collect images in the optimum routes while moving the stages.

95. 发明专利

JP2002014062A METHOD AND APPARATUS FOR CHECKING PATTERN 失效
公开(公告)号：JP2002014062A
公开(公告)日：2002-01-18
申请号：JP2000203056
申请日：2000-06-30
申请人： HITACHI LTD
发明人： WATANABE MASAHIRO , TANAKA MAKI , HIROI TAKASHI , SHISHIDO CHIE , MIYAI YASUSHI , WATANABE KENJI , SUGIMOTO ARITOSHI , KUNI TOMOHIRO , NOZOE MARI
IPC分类号： G01B15/00 , G01B15/04 , G01N23/225 , G06T1/00 , G06T7/00 , H01L21/66 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To solve such problem in the conventional method and apparatus has been no that there method for rapidly sorting defects having a littlie damage to an object based on the electrical properties of the detected defect in checking the pattern for detecting the defect by comparing an image to be checked with a reference image. SOLUTION: The method for checking the pattern comprises calculating the feature amount of a defect which includes the signal amount of a charged particle beam image of the defect, simultaneously or concurrently upon checking, and immediately sorting the defects based on the electrical properties of the defects.

96. 发明专利

JP2001304842A METHOD AND DEVICE OF PATTERN INSPECTION AND TREATMENT METHOD OF SUBSTRATE 失效
公开(公告)号：JP2001304842A
公开(公告)日：2001-10-31
申请号：JP2000128954
申请日：2000-04-25
申请人： HITACHI LTD
发明人： TANAKA MAKI , HIROI TAKASHI , WATANABE MASAHIRO , SHISHIDO CHIE , MORIOKA HIROSHI , WATANABE KENJI , MIYAI YASUSHI , NOZOE MARI
IPC分类号： G01B15/00 , G01B15/04 , G01B15/08 , G01N23/225 , G06T7/00 , H01J37/22 , H01J37/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To set an optimal condition on image processing which gets no false information from the fluctuation of brightness between the images to be compared which is caused by an object to be tested and an image detection system. SOLUTION: Noise characteristics of the secondary electron image which is caused by an image detection system is determined and optimal parameters for image processing are decided based on the noise characteristics according to the object to be tested. The process variation of the object to be tested is evaluated by processing with comparison using the noise characteristics and the image of the object to be tested.

97. 发明专利

JP2000215834A INSPECTING DEVICE AND INSPECTING METHOD USING CHARGED PARTICLE BEAM 失效
公开(公告)号：JP2000215834A
公开(公告)日：2000-08-04
申请号：JP32644099
申请日：1999-11-17
申请人： HITACHI LTD
发明人： SHICHIDA YOSHIYUKI , GUNJI YASUHIRO , HIROI TAKASHI , KAMETANI MASATSUGU , KOYAMA MASAHIRO , YAMAMOTO KENJIRO , NINOMIYA HIROSHI
IPC分类号： H01J37/20 , G01N23/225 , H01J37/147 , H01J37/22 , H01J37/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To reduce the deflection distortion of the image signal of a sample and to detect the defect of the sample by matching the center of the object region on the sample radiated with a charged particle beam with the optical axis of the charged particle beam, and radiating the charged particle beam to the sample while stopping one stage and moving the other stage. SOLUTION: When the prescribed correction work by an optical microscope 4 and the preparation work such as inspection region setting are completed, a sample 9 is moved below an X stage 31 and a Y stage 32. An electron beam 19 is secondarily scanned in the X, Y directions by a scanning deflecting system 15 in the same circuit pattern as that observed by the optical microscope 4. Secondary electrons 51 are generated from an observed portion by this scanning, and second secondary electrons 52 generated by a reflector 17 are detected by a secondary electron detector 20 to obtain an electron beam image. The electron beam image has higher resolution than that of an optical image, and positioning, position correction and rotation correction can be conducted at high magnifying power and high precision.

98. 发明专利

JP2000161948A APPARATUS AND METHOD FOR INSPECTING CIRCUIT PATTERN 失效
公开(公告)号：JP2000161948A
公开(公告)日：2000-06-16
申请号：JP34029398
申请日：1998-11-30
申请人： HITACHI LTD
发明人： NARA YASUHIKO , HIROI TAKASHI
IPC分类号： H01J37/22 , G01B11/30 , G01B15/00 , G01B15/08 , G01B21/30 , G01N21/88 , G01N21/93 , G01N21/956 , G01N23/225 , G01R31/302 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To quickly set an inspection region with satisfactory hondleability by providing an inspection region setting means on a displayed wafer map and as well as displaying the number of inspection chips, an inspection area, estimated inspection time or the like, together with a wafer map display image. SOLUTION: A region to be inspected is clicked or dragged (chip selected) for specification from among effective chips on a wafer map 101 and a map in chips. Since all the chips in a wafer are defaulted to be a region to be inspected, desired chips or regions can be specified to set an inspection region, while alternately, chips or regions which are not to be inspected can be specified thereby setting a region which is not to be inspected. In this case, the inspection region can also be specified by referring to a scanning electron microscope(SEM) image displayed on a right-hand screen 105. Thereafter, a sampling rate is selected from a combo box of a sampling rate input region 103. The number of chips inspected, the total number of chips, the inspection area, the sampling rate and estimated inspection time are respectively displayed on the lower right of the screen.

99. 发明专利

JPH11250847A FOCUSING CHARGED PARTICLE BEAM DEVICE AND INSPECTION METHOD USING IT 失效
公开(公告)号：JPH11250847A
公开(公告)日：1999-09-17
申请号：JP4672598
申请日：1998-02-27
申请人： HITACHI LTD
发明人： TANAKA MAKI , WATANABE MASAHIRO , HIROI TAKASHI , SHINADA HIROYUKI , NINOMIYA HIROSHI
IPC分类号： G01N23/225 , H01J37/21
摘要： PROBLEM TO BE SOLVED: To always observe and work and object in the focused state by optically detecting the height in the optical axis direction of sample, adjusting the height of the sample, detecting secondary charged particles generating by scanning electron beams, and inspecting a secondary charged particle image. SOLUTION: Electron beams from an electron gun are focused with an object lens 2, then used to scan the surface of a sample. Secondary electrons generated on the surface of a sample wager 3 by irradiation of electron beams are detected with a secondary electron detector 5, and inputted as an image signal in an image input part 6. An optical height detector 11 detects the sample surface height without contacting the sample, and inputs detected results into a control computer 10. The control computer 10 varies the focal point position of an electronic optical system or a Z stage according to the sample surface height, and inputs an image signal. The image signal inputted is compared with a previously memorized non-defective pattern based on inspection position information detected with a position measuring part to judge a defect.

100. 发明专利

JPH11194154A PATTERN INSPECTION METHOD AND ITS DEVICE AND PATTERN INSPECTION METHOD AND DEVICE BASED ON ELECTRON RAY IMAGE 失效
公开(公告)号：JPH11194154A
公开(公告)日：1999-07-21
申请号：JP60698
申请日：1998-01-06
申请人： HITACHI LTD
发明人： SHISHIDO CHIE , TAKAGI YUJI , MAEDA SHUNJI , NINOMIYA TAKANORI , HIROI TAKASHI , WATANABE MASAHIRO , DOI HIDEAKI
IPC分类号： G01B11/30 , G01R31/302 , G06T1/00 , G06T5/00 , G06T7/00 , H01J37/22 , H01J37/28 , H01L21/027 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To reduce a false report caused by a disagreement due to an inspection target and an image detection system and to detect a fine defect, by performing division into small region units and performing cutting, and then judging whether an area is a defect or a defect candidate based on the difference between first and second divided images being calculated for each division unit. SOLUTION: A scanning of electron beams is controlled for detecting an image with small distortion and at the same time the image is divided into a size so that a distortion can be ignored, and a position deviation is detected with accuracy being equal to or less than a picture element for each division unit, thus judging a defect. An inspection target 100 such as a wafer is scanned by electron rays 30, electrons being generated from the inspection target 100 are detected by applying the electron rays 30, the image of electron rays at a scanning site is obtained based on the intensity change, and pattern scanning is made by the image of electron rays, thus reducing a false report caused by such disagreement as the small difference in a pattern shape due to the side of an object to be inspected or an inspection device, a difference in a gradation value, a pattern distortion, and a position deviation and detecting a finer defect or a defect candidate.

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