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1. 发明专利

JP2006074065A Inspection device of sample 审中-公开
标题翻译：样品检验装置
公开(公告)号：JP2006074065A
公开(公告)日：2006-03-16
申请号：JP2005305912
申请日：2005-10-20
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： OBARA KENJI , TAKAGI YUJI , HONDA TOSHIFUMI , NAKAGAKI AKIRA , KUROSAKI TOSHISHIGE , OZAWA YASUHIKO
IPC分类号： H01L21/66 , G01N23/223 , G01N23/225 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To increase inspection efficiency in detailed inspection of defect which is performed on the basis of inspection information of defect inspection.
SOLUTION: For example, contaminations and defects which are detected with a defect inspection device 1 are inspected in detail with a detailed inspection device 3 using SEM and the like, and the cause of the occurrence and the like are clarified. Before performing the detailed inspection, contaminations and defects which are detected with the defect inspection device 1 are inspected with an attribute inspection device using optical microscope and the like, and each attribute is searched for. The defects and contaminations are classified into a type which needs the detailed inspection and a type which does not need the detailed inspection or a type which can not be performed the detailed inspection, based on the attributes. Only contaminations and defects which need the detailed inspection are inspected with the detailed inspection device 3.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：根据缺陷检查的检查信息进行的缺陷的详细检查，提高检查效率。解决方案：例如，使用SEM等详细检查装置3来详细检查用缺陷检查装置1检测的污染物和缺陷，并且说明发生的原因等。在进行详细检查之前，使用光学显微镜等用属性检查装置检查用缺陷检查装置1检测到的污染物和缺陷，并搜索每个属性。根据属性，将缺陷和污染分为需要详细检查的类型和不需要详细检查的类型或不能进行详细检查的类型。只需要详细检查的污染物和缺陷，请仔细检查。3.版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2002090312A DEFECT ANALYSIS SYSTEM 失效
公开(公告)号：JP2002090312A
公开(公告)日：2002-03-27
申请号：JP2000287081
申请日：2000-09-21
申请人： HITACHI LTD
发明人： SHIMODA ATSUSHI , ISHIMARU ICHIRO , TAKAGI YUJI , OBARA KENJI , NAKAGAKI AKIRA , WATANABE KENJI
IPC分类号： G01N21/956 , G01N1/28 , G01N1/32 , G01N33/00 , G01N35/00 , G06T1/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To efficiently sort inspected objects having new defects hard to solve by conventional knowledge, out of a large number of objects to be inspected. SOLUTION: This analysis system for defects detected in a plurality of objects to be inspected has an appearance inspection device 100 for detecting defective parts in the inspected objects; a defect classifying device 200 for detecting detailed information in the defective parts and classifying the defects into known defects whose appearance is confirmed, and new defects whose appearance is not confirmed; and a defect analysis device 300 for accepting the assignment of the inspected objects and analyzing the assigned inspected objects. The appearance inspection device 100, the defect classifying device 200 and the defect analysis device 300 can have display devices for displaying the number of defects every classification including the new defects.

3. 发明专利

JP2001256480A AUTOMATIC PICTURE CLASSIFYING METHOD AND ITS DEVICE 失效
公开(公告)号：JP2001256480A
公开(公告)日：2001-09-21
申请号：JP2000065151
申请日：2000-03-09
申请人： HITACHI LTD
发明人： NAKAGAKI AKIRA , TAKAGI YUJI , OBARA KENJI , OZAWA YASUHIKO , KUROSAKI TOSHISHIGE , ISOGAI SHIZUSHI
IPC分类号： G01B11/30 , G01N21/956 , G06F17/30 , G06T1/00 , G06T7/00
摘要： PROBLEM TO BE SOLVED: To secure dassification performance for high fault by permitting instruction data for fault classification which is set at every fault attribute to follow the fluctuation of a manufacturing process. SOLUTION: Featured values are calculated from fault detected from a semi- conductor wafer and assigned in a featured values space, categories are assigned from a distribution in the space as shown in a figure 10(a) and instruction data for fault classification is generated. When fault detected from the wafer is classified into the respective fault attributes, the instruction data is used. When fault is classified, the same processing is performed concerning the fault to be classified, which is detected from the wafer, classification dealing data shown in a figure 10(b) is generated and, then, it is compared with instruction data shown in the figure 10(a). A difference occurs in these kinds of data when a fluctuation exists in the semi-conductor manufacturing process and obtained instruction data is corrected in accordance with the difference when the difference exists.

4. 发明专利

JP2001189358A HIGH-POWER IMAGE AUTOMATIC COLLECTION METHOD AND SYSTEM OF SEMICONDUCTOR WAFER DEFECT 失效
公开(公告)号：JP2001189358A
公开(公告)日：2001-07-10
申请号：JP37266199
申请日：1999-12-28
申请人： HITACHI LTD
发明人： SHISHIDO CHIE , TAKAGI YUJI , SHIMODA ATSUSHI , OBARA KENJI , NAKAGAKI AKIRA , ISOGAI SHIZUSHI , OZAWA YASUHIKO , BABA HIDEHARU , WATANABE KENJI
IPC分类号： G01B11/30 , G06T1/00 , G06T7/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To solve the problems, in which long time and labor are required to carry out review operation for improvement in quality and yield of a semiconductor because an inspection device indicates a large number of defects, and cope especially with the operation among the review operation to collect high magnification images by the use of a microscope system for strong desire for automation. SOLUTION: The inspection device detects defects in a semiconductor wafer through a comparison inspection in which repeated patterns are compared with each other taking advantage of the repeatability of the patterns formed on the semiconductor wafer, so that data as to what part of the defects shoud be compared with each other for detection of defects are stored in the check device. Then, not only the data on defects but also the data on objects of comparison are included in data on inspection result in a microscope system, the image of a defect and the image of an object of comparison are detected, based on the data on the object of comparison, and the images are compared with each other to locate the position of the defect.

5. 发明专利

JP2001156135A METHOD AND DEVICE FOR SORTING DEFECTIVE IMAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THEM 失效
公开(公告)号：JP2001156135A
公开(公告)日：2001-06-08
申请号：JP33719699
申请日：1999-11-29
申请人： HITACHI LTD
发明人： OBARA KENJI , TAKAGI YUJI , NAKAGAKI AKIRA , OZAWA YASUHIKO , KUROSAKI TOSHISHIGE , ISOGAI SHIZUSHI
IPC分类号： G01N21/88 , G06T7/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To improve efficiency of teaching in automatic sorting of defective image for carrying out image sorting, based on data taught in advance and to make the display method of automatic sorting result effective. SOLUTION: A computer supports user judgment, by displaying category candidate when a user rearranges and displays an untaught image group according to similarity degree of an image group designated as the same category or designates an untaught image. An image which is exceptional in a category can be readily found by displaying characteristic amount distribution and each image per category in coordination. Sorting is carried out automatically according to the size of the defect. When an image is picked up through by variable magnification, a display image size is changed and displayed to make the scale on a screen the same. A display method for automatic sorting result, two or more of a wafer map, a category list and defective size distribution are displayed simultaneously, and a plot point on a wafer map is made to change according to a category which is selected by a user and the defect size.

6. 发明专利

JP2002310962A SORTING METHOD AND OBSERVATION METHOD FOR IMAGE AND APPARATUS THEREFOR 失效
公开(公告)号：JP2002310962A
公开(公告)日：2002-10-23
申请号：JP2001120467
申请日：2001-04-19
申请人： HITACHI LTD
发明人： NAKAGAKI AKIRA , TAKAGI YUJI , HIROI TAKASHI , WATANABE MASAHIRO , NOGUCHI MINORU , AOKI KAZUO
IPC分类号： G01N23/225 , G01N21/95 , G01N21/956 , G01Q10/00 , G01Q30/20 , H01J37/20 , H01J37/22 , H01L21/66 , H04N7/18
摘要： PROBLEM TO BE SOLVED: To provide an automatic image collector and a method thereof which enable to obtain and sort images of defective parts automatically at a higher speed as for defects generated in the production process of semiconductor wafers as detected with a defect inspection instrument. SOLUTION: In the image collector which automatically takes and collects images a plurality of parts to be observed on semiconductor wafers, there are arranged a scheduling part which determines the order of photographing defects and the moving speeds of stages based on the positional relationship of the plurality of parts to be observed on the wafers, and a control unit which feeds back the movement of the stages to the degree of deflection of beams. This enables to take and collect images in the optimum routes while moving the stages.

7. 发明专利

JP2002026102A INSPECTING AND INFORMATION PROCESSING METHOD AND INSPECTING SYSTEM THEREOF 失效
公开(公告)号：JP2002026102A
公开(公告)日：2002-01-25
申请号：JP2000203055
申请日：2000-06-30
申请人： HITACHI LTD
发明人： TAKAGI YUJI , OBARA KENJI , NAKAGAKI AKIRA , TSUYUKI HISAMASA , KUROSAKI TOSHISHIGE , ISOGAI SHIZUSHI
IPC分类号： G01N23/225 , G01N21/956 , G06T1/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To sample detected defect points with qualitative and quantitative references for a detailed analysis of a manufacturing process and efficiently limit defect candidates needing a detailed inspection or analysis from defect information outputted from an inspector. SOLUTION: In the method of inspecting defects in detail detected by inspecting an object under test, a plurality of different kinds of defect detecting means inspect the object to be detected for defects, and an information processing means selects the detected and obtained information, according to characteristics of the plurality of different kinds of detailed inspecting means and outputs to the inspecting means, so that the object is inspected in detail, based on the detected and obtained information selected and outputted thereby.

8. 发明专利

JP2001134763A METHOD FOR SORTING DEFECT ON BASIS OF PICKED-UP IMAGE AND METHOD FOR DISPLAYING THE RESULT 失效
公开(公告)号：JP2001134763A
公开(公告)日：2001-05-18
申请号：JP31842199
申请日：1999-11-09
申请人： HITACHI LTD
发明人： TAKAGI YUJI , OBARA KENJI , NAKAGAKI AKIRA , OZAWA YASUHIKO , KUROSAKI TOSHISHIGE , ISOGAI SHIZUSHI
IPC分类号： G06F15/18 , G06N3/00 , G06T1/00 , G06T7/00
摘要： PROBLEM TO BE SOLVED: To smoothly perform learning by shortening teaching time of learning by making a sorting system automatically control consistency between the sorting reference of a defect defined by a user and an image feature concerning a method for automatically sorting the defect on the basis of a picked-up image. SOLUTION: A user category designated by the user is temporarily sorted on the basis of the sub-category of low-order sorting with similarity in the features of images as a reference the images of respective defects. The similarity in the feature of this image is captured by a cluster for the distribution of feature amounts. As a result of sorting, the image of the defect is outputted with sorting based on the user category.

9. 发明专利

JP2001085483A METHOD OF INSPECTING SAMPLE, AND DEVICE THEREFOR 失效
公开(公告)号：JP2001085483A
公开(公告)日：2001-03-30
申请号：JP26416499
申请日：1999-09-17
申请人： HITACHI LTD
发明人： OBARA KENJI , TAKAGI YUJI , HONDA TOSHIFUMI , NAKAGAKI AKIRA , KUROSAKI TOSHISHIGE , OZAWA YASUHIKO
IPC分类号： H01J37/28 , G01N21/88 , G01N21/956 , G01N23/225 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To raise the inspection efficiency in the detailed inspection of a defect being performed based on the information on defect inspection. SOLUTION: For example, a foreign matter or defect detected by a defect inspection device 1 is inspected in detail with a detailed inspection device 3 using an SEM or the like to elucidate the cause of its occurrence, but before detailed inspection, the foreign matter or the defect detected with the defect inspection device 1 is inspected with an attribute inspection device 1, using an optical microscope or the like to obtain each attribute. Based on this attribute, these defects or foreign matters are divided into ones requiring detailed inspection and ones which to not require the detailed inspection or being impossible of detailed inspection, and only the foreign matters or the defects requiring the detailed inspection are inspected by detailed inspection device 3.

10. 发明专利

JP2001077165A DEFECT INSPECTION METHOD, ITS DEVICE, DEFECT ANALYSIS METHOD AND ITS DEVICE 失效
公开(公告)号：JP2001077165A
公开(公告)日：2001-03-23
申请号：JP25098499
申请日：1999-09-06
申请人： HITACHI LTD
发明人： NAKAGAKI AKIRA , TAKAGI YUJI , HONDA TOSHIFUMI , MAEDA SHUNJI , YOSHIDA ATSUSHI , NINOMIYA TAKANORI , ISOGAI SHIZUSHI
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To inspect or analyze with high reliability without misconceiving fine defects, by a method wherein a correspondence relation of a correlation of a gradation value in each split region computed in a correlation computation process to a gradation value in a pixel in a secondary inspection image corresponding to each pixel in a secondary reference image is used. SOLUTION: A threshold set 138 uses correlation tables 137a to 137n of inspection image data 116 to reference image data 117, and in the region, a judgment threshold 141 for judging defects or defect candidates is computed. An image comparison part 124 compares, in each pixel in an inspection image data 120, a correspondence of an inspection image data 120 in the pixel to a reference image data 121 with a judgment threshold 141 acquired in each region comprising the computed slit pixel group, and judges defects or defect candidates. Thus, even when there is irregularity of the gradation value between the inspection image data and the reference image data, it is possible to correctly judge the defects or defect candidates.

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