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    • 98. 发明申请
    • DEPOSITED SEMICONDUCTOR STRUCTURE TO MINIMIZE N-TYPE DOPANT DIFFUSION AND METHOD OF MAKING
    • 沉积半导体结构以最小化N型掺杂物扩散和制备方法
    • US20120012808A1
    • 2012-01-19
    • US13247723
    • 2011-09-28
    • S. Brad Herner
    • S. Brad Herner
    • H01L47/00
    • H01L45/08H01L27/1021H01L27/2409H01L27/2463H01L29/161H01L29/165H01L45/04H01L45/1233H01L45/145H01L45/146
    • A memory cell is provided that includes a semiconductor pillar and a reversible state-change element coupled to the semiconductor pillar. The semiconductor pillar includes a heavily doped bottom region of a first conductivity type, a heavily doped top region of a second conductivity type, and a lightly doped or intrinsic middle region interposed between and contacting the top and bottom regions. The middle region comprises a first proportion of germanium, and either the top region or the bottom region comprises no germanium or comprises a second proportion of germanium less than the first proportion. The reversible state-change element includes a layer of a resistivity-switching metal oxide or nitride compound selected from the group consisting of NiO, Nb2O5, TiO2, HfO2, Al2O3, CoO, MgOx, CrO2, VO, BN, and AlN. Numerous other aspects are provided.
    • 提供了存储单元,其包括半导体柱和耦合到半导体柱的可逆状态变换元件。 半导体柱包括第一导电类型的重掺杂底部区域,第二导电类型的重掺杂顶部区域,以及插入并接触顶部区域和底部区域之间的轻掺杂或本征中间区域。 中间区域包括第一比例的锗,并且顶部区域或底部区域不包含锗,或者包括小于第一比例的第二比例的锗。 可逆态变化元件包括选自NiO,Nb 2 O 5,TiO 2,HfO 2,Al 2 O 3,CoO,MgO x,CrO 2,VO,BN和AlN的电阻率切换金属氧化物或氮化物层。 提供了许多其他方面。