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1. 发明授权

US5028955A Exposure apparatus 失效
标题翻译：曝光装置
公开(公告)号：US5028955A
公开(公告)日：1991-07-02
申请号：US480005
申请日：1990-02-14
申请人： Yasushi Hayashida , Noriyuki Anai , Osamu Hirakawa , Masami Akimoto , Yasuhiro Sakamoto , Keisuke Shigaki , Masashi Moriyama
发明人： Yasushi Hayashida , Noriyuki Anai , Osamu Hirakawa , Masami Akimoto , Yasuhiro Sakamoto , Keisuke Shigaki , Masashi Moriyama
IPC分类号： G03F7/20
CPC分类号： G03F7/70725 , G03F7/2051
摘要： An exposure apparatus of this invention is used in an exposure process of semiconductor and LCD devices. The exposure apparatus includes a stage on which a semiconductor wafer is placed, a rotating mechanism for rotating the stage, a radiation unit arranged to oppose a support surface of the stage, a slider mechanism for reciprocating the radiation unit along a straight line passing through the center of the support surface of the stage, an exposure range input unit for inputting a desired exposure range of the wafer, an exposure range memory unit for storing the input exposure range, a CCD image sensor for detecting a reference position of the wafer, a relative position detector for detecting a relative position between the detected reference position and the radiation unit, a controller for controlling the sliding mechanism in correspondence with the relative position and the exposure range, and a light amount control mechanism for controlling an amount of light radiated from the irradiation mechanism to the wafer in correspondence with the relative position and the exposure range.
摘要翻译：本发明的曝光装置用于半导体和LCD装置的曝光处理。曝光装置包括其上放置有半导体晶片的台，用于旋转台的旋转机构，布置成与舞台的支撑表面相对的辐射单元，用于使辐射单元沿着穿过舞台的支撑表面的中心，用于输入晶片的期望曝光范围的曝光范围输入单元，用于存储输入曝光范围的曝光范围存储单元，用于检测晶片的参考位置的CCD图像传感器，相对位置检测器，用于检测检测到的基准位置和辐射单元之间的相对位置，控制器，用于根据相对位置和曝光范围来控制滑动机构;以及光量控制机构，用于控制从对应于相对位置和曝光范围的到晶片的照射机构。

2. 发明授权

US5061144A Resist process apparatus 失效
标题翻译：抗蚀加工设备
公开(公告)号：US5061144A
公开(公告)日：1991-10-29
申请号：US442535
申请日：1989-11-28
申请人： Masami Akimoto , Yoshio Kimura , Osamu Hirakawa , Noriyuki Anai , Masanori Tateyama , Yasuhiro Sakamoto
发明人： Masami Akimoto , Yoshio Kimura , Osamu Hirakawa , Noriyuki Anai , Masanori Tateyama , Yasuhiro Sakamoto
IPC分类号： G03F7/26 , H01L21/677 , H01L21/687
CPC分类号： H01L21/68707 , G03F7/26 , H01L21/67778 , Y10S414/135 , Y10S414/137
摘要： A resist process apparatus of the invention serves to load/unload a semiconductor wafer in/from the respective process mechanisms. The apparatus includes a wafer holding member for holding a semiconductor wafer, and X, Y, Z and .theta. driving mechanisms for conveying the wafer holding member to a resist coating mechanism and the like. The wafer holding member includes a support frame which is larger than diameter of a semiconductor wafer, and a plurality of support members, arranged on the support frame, for supporting the semiconductor wafer in partial contact with the peripheral portion of the semiconductor wafer. Since the contact area between the support members and a semiconductor wafer is small, changes in temperature of the semiconductor, when it is held, are small.
摘要翻译：本发明的抗蚀剂处理装置用于在各个加工机构中加载/卸载半导体晶片。该装置包括用于保持半导体晶片的晶片保持构件和用于将晶片保持构件输送到抗蚀剂涂覆机构等的X，Y，Z和θ驱动机构。晶片保持构件包括比半导体晶片的直径大的支撑框架和布置在支撑框架上的多个支撑构件，用于支撑半导体晶片与半导体晶片的周边部分部分接触。由于支撑构件和半导体晶片之间的接触面积小，因此在保持时半导体的温度变化小。

3. 发明授权

US5089305A Coating apparatus and method for applying a liquid to a semiconductor wafer including selecting a nozzle on a stand by state 失效
标题翻译：涂料装置和液体应用于半导体滤波器的方法，包括按状态选择喷嘴的喷嘴
公开(公告)号：US5089305A
公开(公告)日：1992-02-18
申请号：US585199
申请日：1990-09-20
申请人： Mitsuru Ushijima , Osamu Hirakawa , Masami Akimoto , Yoshio Kimura , Noriyuki Anai
发明人： Mitsuru Ushijima , Osamu Hirakawa , Masami Akimoto , Yoshio Kimura , Noriyuki Anai
IPC分类号： B05B15/02 , B05C11/08 , G03F7/16
CPC分类号： B05B15/025 , B05C11/08 , G03F7/162
摘要： Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.

4. 发明授权

US5002008A Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state 失效
标题翻译：将液体施加到半导体晶片的涂布装置和方法，包括在待机状态下选择喷嘴
公开(公告)号：US5002008A
公开(公告)日：1991-03-26
申请号：US357279
申请日：1989-05-26
申请人： Mitsuru Ushijima , Osamu Hirakawa , Masami Akimoto , Yoshio Kimura , Noriyuki Anai
发明人： Mitsuru Ushijima , Osamu Hirakawa , Masami Akimoto , Yoshio Kimura , Noriyuki Anai
IPC分类号： B05B15/02 , B05C11/08 , G03F7/16
CPC分类号： B05B15/025 , B05C11/08 , G03F7/162
摘要： Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.
摘要翻译：公开了一种将抗蚀剂或显影液施加到半导体晶片的涂布装置。该涂布装置包括从抗蚀剂源供给各种抗蚀剂的多个喷嘴，每个喷嘴适于将不同的溶液滴到晶片上，其中喷嘴保持待机的容器，同时将液体保持在预定状态喷嘴的排出口部分附近，当喷嘴不需要操作时，以及喷嘴操作机构，用于选择在容器中保持待机的喷嘴之一，并将所选择的喷嘴输送到晶片的位置，由此通过仅由喷嘴操作机构传送的喷嘴将抗蚀剂施加到晶片。

5. 发明授权

US07245348B2 Coating and developing system and coating and developing method with antireflection film and an auxiliary block for inspection and cleaning 有权
标题翻译：涂层和显影系统以及具有防反射膜和辅助块的检测和清洁的涂层和显影方法
公开(公告)号：US07245348B2
公开(公告)日：2007-07-17
申请号：US11117566
申请日：2005-04-29
申请人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
发明人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
IPC分类号： G03B27/52
CPC分类号： H01L21/67184 , H01L21/6715 , H01L21/67178 , H01L21/6719
摘要： A coating and developing system includes an auxiliary block, a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system can cope with either a case where antireflection films are formed or a case where no antireflection film is formed. Film forming unit blocks, namely, a TCT layer, a COT layer and a BCT layer, and developing unit blocks, namely, DEV layers, are stacked up in layers in a processing block S2. The TCT layer, the COT layer and the BCT layer are used selectively in the case where antireflection films are formed and the case where any antireflection film is not formed. The coating and developing system is controlled by a carrying program.
摘要翻译：涂覆显影系统包括辅助块，抗蚀剂膜形成单元块和层叠的抗反射膜形成单元块，以形成抗蚀剂膜和抗蚀剂膜下面的抗反射膜，以及抗反射膜，覆盖抗蚀剂膜空间。涂覆和显影系统可以应对形成防反射膜的情况或不形成抗反射膜的情况。成膜单位块，即TCT层，COT层和BCT层，以及显影单元块，即DEV层，在处理块S2中层叠。在形成防反射膜的情况下选择性地使用TCT层，COT层和BCT层以及未形成任何抗反射膜的情况。涂层和显影系统由携带程序控制。

6. 发明申请

US20070056514A1 Coating and developing apparatus 有权
标题翻译：涂装显影装置
公开(公告)号：US20070056514A1
公开(公告)日：2007-03-15
申请号：US11342616
申请日：2006-01-31
申请人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
发明人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
IPC分类号： C23C16/00
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67178 , H01L21/67207 , H01L21/67745
摘要： Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks. Unit blocks for application which a wafer goes through are determined depending on the layering positional relationship between an antireflective film and a resist film. An exposed wafer goes only through the unit block for development without going through any one of the unit blocks for application.
摘要翻译：提供一种由多个单元块组成的涂层显影装置。第一单位块堆叠和第二单位块堆叠被布置在相对于前后方向的不同位置。用于显影的单元块，每个包括多个处理单元，包括执行曝光之后的显影处理的显影单元和在处理单元之间传送基板的转印装置布置在最下层。用于应用或涂布的单元块包括多个处理单元，包括在曝光之前进行施加处理的涂布单元和在处理单元之间传送基板的转印装置，布置在用于显影的单位块上方。用于应用的单元块被布置在第一和第二单元块堆叠中。根据防反射膜和抗蚀剂膜之间的层叠位置关系确定晶片通过的应用单元块。暴露的晶片仅通过单元块进行开发，而不经过用于应用的单元块中的任何一个。

7. 发明申请

US20060162858A1 Coating and developing system and coating and developing method 有权
公开(公告)号：US20060162858A1
公开(公告)日：2006-07-27
申请号：US11336990
申请日：2006-01-23
申请人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
发明人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
IPC分类号： B32B37/00
CPC分类号： H01L21/6715 , H01L21/00 , H01L21/67178 , H01L21/67184 , H01L21/6719
摘要： A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system is capable of coping with either of a case where antireflection films are formed and a case where any antireflection film is not formed and needs simple software. Film forming unit blocks, namely, a TCT layer B3, a COT layer B4 and a BCT layer B5, and developing unit blocks, namely, DEV layers B1 and B2, are stacked up in layers in a processing block S2. The TCT layer B3, the COT layer B4 and the BCT layer B5 are used selectively in the case where antireflection films are formed and the case where any antireflection film is not formed. The coating and developing system is controlled by a simple carrying program and simple software.

8. 发明授权

US07322756B2 Coating and developing apparatus and coating and developing method 有权
标题翻译：涂装开发设备及涂层开发方法
公开(公告)号：US07322756B2
公开(公告)日：2008-01-29
申请号：US11239403
申请日：2005-09-30
申请人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka
发明人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka
IPC分类号： G03D5/00
CPC分类号： H01L21/67276 , H01L21/67173 , H01L21/67178 , H01L21/67754
摘要： A coating and developing apparatus comprises a process block which forms a resist film on a wafer, then transfers the wafer to an exposure apparatus, and performs a developing process on the wafer after exposure, and an interface transfer mechanism provided between the process block and the exposure apparatus. The process block includes unit blocks for coating-film formation and unit blocks for development laid out in a stacked manner. When an abnormality occurs in the interface transfer mechanism, an ordinary process in the unit block for coating-film formation is performed on those substrates which are present in that unit block for coating-film formation, after which processed wafers are retreated to a retaining unit and transfer of any wafer into the unit block for coating-film formation is inhibited.
摘要翻译：涂层显影装置包括在晶片上形成抗蚀剂膜的处理块，然后将晶片转移到曝光装置，并且在曝光后对晶片进行显影处理，以及设置在处理块和曝光装置处理块包括用于涂膜形成的单元块和以堆叠方式布置的用于显影的单元块。当在界面转移机构发生异常时，在用于涂膜形成的单元块中存在的那些基板上进行用于涂膜形成的单元块中的常规工艺，之后将处理的晶片退回到保持单元并且将任何晶片转移到用于涂膜形成的单元块中被抑制。

9. 发明授权

US07267497B2 Coating and developing system and coating and developing method 有权
标题翻译：涂层开发系统及涂层开发方法
公开(公告)号：US07267497B2
公开(公告)日：2007-09-11
申请号：US11117552
申请日：2005-04-29
申请人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
发明人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
IPC分类号： G03D5/00
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67178
摘要： A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system can cope with either of a case where antireflection films are formed and where any antireflection film is not formed. Film forming unit blocks: TCT layer B3, a COT layer B4 and a BCT layer B5, and developing unit blocks: DEV layers B1 and B2, are stacked up in layers in a processing block S2. The TCT layer B3, the COT layer B4 and the BCT layer B5 are used selectively where antireflection films are formed and any antireflection film is not formed. The coating and developing system is controlled by a carrying program and software.
摘要翻译：涂布显影系统包括：抗蚀剂膜形成单元块和抗反射膜形成单元块，其层叠以形成抗蚀剂膜和抗反射膜下面的抗反射膜以及在小空间中覆盖抗蚀剂膜的抗反射膜。涂覆和显影系统可以应对形成防反射膜的情况和其中没有形成任何抗反射膜的情况。成膜单元块：TCT层B 3，COT层B 4和BCT层B 5以及显影单元块DEV层B 1和B 2在处理块S2中层叠。选择性地使用TCT层B 3，COT层B 4和BCT层B 5，其中形成防反射膜并且不形成任何抗反射膜。涂层和显影系统由携带程序和软件控制。

10. 发明申请

US20060201423A1 COATING/DEVELOPING DEVICE AND METHOD 有权
标题翻译：涂料/开发装置和方法
公开(公告)号：US20060201423A1
公开(公告)日：2006-09-14
申请号：US11276662
申请日：2006-03-09
申请人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
发明人： Masami Akimoto , Shinichi Hayashi , Yasushi Hayashida , Nobuaki Matsuoka , Yoshio Kimura , Issei Ueda , Hikaru Ito
IPC分类号： B05C13/02 , B05C11/00
CPC分类号： H01L21/67742 , G03F7/162 , H01L21/6715 , H01L21/67173 , H01L21/67178
摘要： A coating/developing device includes a processing block having a plurality of coating unit blocks stacked and a developing unit block stacked on the coating unit blocks. Each of the unit blocks is provided with a liquid processing unit for coating a liquid chemical on a substrate, a heating unit for heating the substrate, a cooling unit for cooling the substrate and a transfer unit for transferring the substrate between the units. The liquid processing unit is provided with a coating unit for coating a resist liquid on the substrate, a first bottom antireflection coating (BARC) forming unit for coating a liquid chemical for a BARC on the substrate before the resist liquid is coated thereon, and a second BARC forming unit for coating a liquid chemical for the BARC on the substrate after the resist liquid is coated thereon.
摘要翻译：涂覆/显影装置包括具有堆叠的多个涂布单元块的处理块和堆叠在涂布单元块上的显影单元块。每个单元块设置有用于在基板上涂覆液体化学品的液体处理单元，用于加热基板的加热单元，用于冷却基板的冷却单元和用于在单元之间转移基板的转移单元。液体处理单元设置有用于在基板上涂覆抗蚀剂液体的涂布单元，在其上涂覆抗蚀剂液体之前，在基板上涂布用于BARC的液体化学品的第一底部抗反射涂层（BARC）形成单元，以及第二BARC形成单元，用于在其上涂覆抗蚀剂液体之后，在基板上涂覆用于BARC的液体化学品。

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