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    • 3. 发明申请
    • METHOD OF FORMING PHOTONIC CRYSTALS
    • 形成光子晶体的方法
    • US20120142170A1
    • 2012-06-07
    • US13377521
    • 2010-06-09
    • Jinghua TengEo LimSoo Jin ChuaSoo Seng Nirman Ang
    • Jinghua TengEo LimSoo Jin ChuaSoo Seng Nirman Ang
    • H01L21/20
    • G02B6/1225B82Y20/00G02B6/136G02B2006/12176
    • According to an embodiment of the present invention, a method of forming photonic crystals is provided. The method includes: forming a layer arrangement on a support substrate. The layer arrangement includes a first partial layer arrangement and a second partial layer arrangement, wherein the second partial layer arrangement is disposed over the first partial layer arrangement, wherein each partial layer arrangement comprises a first layer and a second layer, wherein the second layer is disposed over the first layer, and wherein the material of the second layer has a different etching characteristic than the material of the first layer. The method further includes removing at least one portion of the second layer and removing the first layer, wherein forming the layer arrangement occurs prior to removing the at least one portion of the second layer and the first layer.
    • 根据本发明的实施例,提供了形成光子晶体的方法。 该方法包括:在支撑衬底上形成层布置。 层布置包括第一部分层布置和第二部分层布置,其中第二部分层布置设置在第一部分层布置之上,其中每个部分层布置包括第一层和第二层,其中第二层是 设置在所述第一层上,并且其中所述第二层的材料具有与所述第一层的材料不同的蚀刻特性。 该方法还包括去除第二层的至少一部分并去除第一层,其中形成层布置发生在去除第二层和第一层的至少一部分之前。
    • 6. 发明授权
    • Method of forming a metal contact and passivation of a semiconductor feature
    • 形成金属接触的方法和半导体特征的钝化
    • US07598104B2
    • 2009-10-06
    • US11939227
    • 2007-11-13
    • Jinghua TengEe Leong LimSoo Jin Chua
    • Jinghua TengEe Leong LimSoo Jin Chua
    • H01L21/00
    • H01L33/38H01L33/08H01L33/385H01S5/0282H01S5/22
    • A method of forming a metal contact and passivation of a semiconductor feature, and devices made using the method. The method comprises the steps of forming a dielectric mask on a semiconductor substrate utilising photolithography processes; etching the semiconductor substrate such that one or more features are formed underneath respective portions of the dielectric mask; depositing a passivation layer on the substrate with the dielectric mask in place above the features; subjecting the substrate to an etchant such that the dielectric mask is etched at a higher rate than the passivation layer, whereby portions of the passivation layer deposited on the dielectric mask are lifted off from the substrate; and depositing a metal layer on the substrate including over the remaining passivation layer and exposed portions of the features.
    • 一种形成半导体特征的金属接触和钝化的方法,以及使用该方法制造的器件。 该方法包括以下步骤:利用光刻工艺在半导体衬底上形成介电掩模; 蚀刻半导体衬底,使得一个或多个特征形成在介电掩模的各个部分下方; 在衬底上沉积钝化层,其中介电掩模位于特征上方; 使衬底经受蚀刻剂,使得以比钝化层更高的速率蚀刻介电掩模,由此沉积在介电掩模上的钝化层的一部分从衬底上提出; 以及在所述衬底上沉积金属层,所述金属层包括在剩余的钝化层上并且所述特征的暴露部分。
    • 9. 发明申请
    • NANO-PHOTOLITHOGRAPHIC SUPERLENS DEVICE AND METHOD FOR FABRICATING SAME
    • 纳米平版印刷设备及其制造方法
    • US20130208254A1
    • 2013-08-15
    • US13588058
    • 2012-08-17
    • Hong LiuJinghua TengLin KeBing Wang
    • Hong LiuJinghua TengLin KeBing Wang
    • G03F7/20
    • G03F7/2014G03F7/09
    • A system for nano-photolithography, a superlens device, and a method for fabricating the superlens device. A system for three-dimensional nano-photolithography includes a light source having a predetermined light wavelength, a device to be patterned, a photoresist layer of photoresponsive material photoresponsive to the predetermined light wavelength formed on the device, and a superlens device in contact with the photoresist layer. The superlens device includes a superlens layer in contact with the photoresist layer, a light permissive mask layer transparent to the predetermined light wavelength and having a layer of nanopatterned opaque features formed thereon, and an intermediate layer separating the superlens layer and the light permissive mask layer by a predetermined distance. The light source is located to radiate light at the predetermined light wavelength on the light permissive mask layer. The layer of nanopatterned opaque features includes a layer of opaque features with varying height dimensions.
    • 一种用于纳米光刻的系统,一种超薄设备,以及一种用于制造超薄设备的方法。 一种用于三维纳米光刻的系统包括具有预定光波长的光源,待图案化的装置,对在该装置上形成的预定光波长的光响应材料的光致抗蚀剂层以及与该装置接触的超薄装置 光致抗蚀剂层。 该超级透镜装置包括与光致抗蚀剂层接触的超薄层,对预定的光波长透明的光允许掩模层,并且具有形成在其上的纳米图案的不透明特征层,以及分离超薄层和光允许掩模层的中间层 预定距离。 光源被定位成在光允许掩模层上辐射预定光波长的光。 纳米图案不透明特征层包括具有不同高度尺寸的不透明特征层。